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公开(公告)号：US06570099B1
公开(公告)日：2003-05-27
申请号：US09694445
申请日：2000-10-23
IPC分类号： H05K100
CPC分类号： H01L23/49861 , H01L23/36 , H01L23/3737 , H01L2924/0002 , H01L2924/09701 , H05K1/036 , H05K1/0366 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , Y10T428/24917 , Y10T428/25 , Y10T428/253 , H01L2924/00
摘要： A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.
摘要翻译： 导热基板包括第一电绝缘体层，第二电绝缘体层和用作电路图案的引线框架。 第一电绝缘体层由含有热固性树脂和无机填料的导热性树脂组合物形成，并与引线框架接合。 第二电绝缘体层设置在不与引线框架接触的第一电绝缘体层的一侧，并且由含有无机填料的热导性树脂组合物和含有该热固性树脂的树脂组合物形成。 第二电绝缘体层具有比第一电绝缘体层更高的热导率。 因此，可以在不降低电绝缘体层的成形性和粘合特性的情况下实现更高的散热特性和部件封装可靠性。
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2.发明授权Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink 有权制造具有连接到散热器的接地图案的导热电路板的方法公开(公告)号：US07059042B2
公开(公告)日：2006-06-13
申请号：US10998277
申请日：2004-11-24
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.
摘要翻译： 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。
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3.发明申请公开(公告)号：US20050158916A1
公开(公告)日：2005-07-21
申请号：US10998277
申请日：2004-11-24
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H01L21/44
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.
摘要翻译： 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。
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4.发明授权公开(公告)号：US06522555B2
公开(公告)日：2003-02-18
申请号：US09834710
申请日：2001-04-13
IPC分类号： H05K702
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.
摘要翻译： 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。
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5.发明授权公开(公告)号：US07033865B2
公开(公告)日：2006-04-25
申请号：US10647263
申请日：2003-08-26
IPC分类号： H01L21/48
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
摘要翻译： 通过设置位于绝缘片的端部和靠近引线框架延伸的绝缘片的端部上的辐射板的端部，在离开绝缘片的端部的位置远离绝缘体片的端部的位置处， 绝缘体片材，可以确保引线框架和辐射板之间的蠕变距离，而不会减少可实际安装部件的引线框区域。
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6.发明授权Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink 有权制造具有连接到散热器的接地图案的导热电路板的方法公开(公告)号：US06860004B2
公开(公告)日：2005-03-01
申请号：US10309707
申请日：2002-12-03
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H05K3/30
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： In a method of manufacturing a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection, a sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. The method provides that a part of a lead frame and heat sink are connected not only mechanically, but also electrically, and allows an associated power module size to be reduced and its density to be increased.
摘要翻译： 在具有高散热，高导电性和高接地连接的导热电路板的制造方法中，含有70〜95重量份的片状导热性树脂组合物， ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 该方法提供引线框架和散热器的一部分不仅机械地而且电连接，并且允许相关联的功率模块尺寸减小并且其密度增加。
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7.发明授权公开(公告)号：US06700182B2
公开(公告)日：2004-03-02
申请号：US09870684
申请日：2001-06-01
IPC分类号： H01L23495
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
摘要翻译： 通过设置位于绝缘片的端部和靠近引线框架延伸的绝缘片的端部上的辐射板的端部，在离开绝缘片的端部的位置远离绝缘体片的端部的位置处， 绝缘体片材，可以确保引线框架和辐射板之间的蠕变距离，而不会减少可实际安装部件的引线框区域。
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8.发明授权Method of producing circuit component built-in module with embedded circuit component 有权具有嵌入式电路元件的电路元件内置模块的制造方法公开(公告)号：US07140104B2
公开(公告)日：2006-11-28
申请号：US10902523
申请日：2004-07-29
申请人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
发明人： Koichi Hirano , Seiichi Nakatani , Hiroyuki Handa , Tsunenori Yoshida , Yoshihisa Yamashita , Hiroyuki Ishitomi
IPC分类号： H01K3/10
CPC分类号： H01G2/065 , H01L25/0652 , H01L29/0657 , H01L2224/16225 , H01L2924/09701 , H01L2924/10157 , H01L2924/10158 , H01L2924/3011 , H05K1/185 , H05K3/3442 , H05K2201/09154 , H05K2201/10568 , H05K2201/10636 , H05K2201/2036 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49082 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/53174 , Y10T29/53178
摘要： A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.
摘要翻译： 可以通过在板状构件的通孔中填充导电材料，将片状构件和金属箔堆叠在电路构件封装上，并施加热和压力以嵌入电路来制造电路部件内置模块 并且对金属箔进行图案化。 电路部件封装包括具有衬底和布线图案的安装构件和电路部件。 电路部件包括部件主体和外部电极，其中部件主体在设置有外部电极的部分处更薄。 外部电极设置在与安装部件相对的电路部件的表面上，并且部件主体与安装部件接触。
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9.发明授权Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same 有权电容器及其制造方法以及具有内置电容器的电路板及其制造方法公开(公告)号：US07126811B2
公开(公告)日：2006-10-24
申请号：US10726675
申请日：2003-12-04
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G4/26 , H05K1/186 , H05K3/321 , H05K3/4614 , Y10T29/417
摘要： A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.
摘要翻译： 提供了一种微型固体电解电容器，其适用于设置在电绝缘层中，并且使用导电粘合剂连接到组件，其中阳极处的连接电阻低，并且连接可靠性得到改善。 具体地说，电解电容器包括用于阳极的阀金属元件，具有电容器形成部分和电极引线部分，形成在阀元件上的电介质氧化膜，形成在电介质氧化物膜上的固体电解质层和用于 形成在所述固体电解质层上的阴极，其中，在所述电极引线部中形成有至少一个通孔，以露出所述阀金属元件的芯，并且其中所述芯的暴露部分用作连接部。
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10.发明授权Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same 有权电容器及其制造方法以及具有内置电容器的电路板及其制造方法公开(公告)号：US07247178B2
公开(公告)日：2007-07-24
申请号：US11523574
申请日：2006-09-20
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G4/26 , H05K1/186 , H05K3/321 , H05K3/4614 , Y10T29/417
摘要： A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to other component using an electrically conductive adhesive with a connection resistance at an anode low and with connection reliability improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode 10 having a capacitor forming part 10A and an electrode lead part 10B, a dielectric oxide film 11 formed on the valve element, a solid electrolyte layer 12 formed on the dielectric oxide film 11 and a charge collecting element for a cathode 13 formed on the solid electrolyte layer 12, wherein at least one through hole 15 is formed in the electrode lead part 10B so as to expose a core 10C of the valve metal element, and an exposed portion 10D of the core is used for connecting portion.
摘要翻译： 提供一种微型固体电解电容器，其适于布置在电绝缘层内，并且使用具有阳极连接电阻的导电粘合剂连接到其它部件，并提高连接可靠性。 具体地，电解电容器包括：具有电容器形成部10A的阳极10的阀金属元件和电极引线部10B，形成在阀元件上的电介质氧化膜11，形成在电介质氧化物上的固体电解质层12 膜11和形成在固体电解质层12上的用于阴极13的电荷收集元件，其中至少一个通孔15形成在电极引线部分10B中，以暴露阀金属元件的芯部10 C，以及 芯的露出部分10D用于连接部分。
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