公开(公告)号：US06626717B2

公开(公告)日：2003-09-30

申请号：US10024209

申请日：2001-12-21

申请人： Koichi Miyashita ,  Takayoshi Kuriyama ,  Masahiko Ishii

发明人： Koichi Miyashita ,  Takayoshi Kuriyama ,  Masahiko Ishii

IPC分类号： H05B3310

CPC分类号： H01L51/56 ,  H01L51/005 ,  H01L51/0078 ,  H01L51/0081

摘要： In a manufacturing step for forming an organic EL element, the organic EL element is provided so as to have an anode and a cathode with a luminescent layer having an organic luminescent material interposed therebetween. Then, an aging treatment is performed. In the aging treatment, a curve of change in luminance with time is measured in driving the organic EL element at constant current. Then, the curve of change in luminance with time is divided into a component having a slowest luminance age-deterioration rate and other components by analyzing the curve and forming a fitting curve having a plurality of members that is fitted to the curve of change in luminance with time. Moreover, the aging treatment is conducted until a luminance of the element becomes approximately equal to an initial value A1 of the component having a slowest luminance age-deterioration rate.

公开(公告)号：US20110174800A1

公开(公告)日：2011-07-21

申请号：US13000140

申请日：2009-09-25

申请人： Takashi Chino ,  Satoshi Gomi ,  Koichi Miyashita ,  Minoru Nagasawa ,  Yoshie Eda

发明人： Takashi Chino ,  Satoshi Gomi ,  Koichi Miyashita ,  Minoru Nagasawa ,  Yoshie Eda

IPC分类号： H05B3/68

CPC分类号： H01L21/67259 ,  C23C16/4583 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/52

摘要： A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table 3, in which a heater 6a, 6b is disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heater 6a, 6b or information about a measured temperature of the substrate table 3, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.

摘要翻译： 当放置加热器6a，6b的衬底W上的衬底W进行加热时，检测衬底W的异常放置的方法。 检测基板的异常放置的方法包括以下步骤：在基板W的处理期间，基于关于加热器6a，6b的电输出的信息或关于基板台3的测量温度的信息，检测基板 电输出或测量温度的最大值和最小值，或电输出或测量温度的积分值; 以及基于检测到的最大值和最小值或检测到的积分值判断基板的异常放置。

公开(公告)号：US20060174695A1

公开(公告)日：2006-08-10

申请号：US10548879

申请日：2004-03-04

申请人： Koichi Miyashita ,  Shinya Mori

发明人： Koichi Miyashita ,  Shinya Mori

IPC分类号： G01N15/08 ,  G01M19/00 ,  G01N15/02

CPC分类号： G01N15/082 ,  G01N15/02

摘要： A method and a device for inspecting a honeycomb structure having porous partition walls (2) disposed so as to form a plurality of flow passages (3a) and (3b) passed through the honeycomb structure from one end face (42) to the other end face (44), the device comprising a water particle generating part (11) generating water particles (10), a water particle lead-in part (12) leading the water particles (10) into the plurality of flow passages (3a), and a discharged particle measuring part (13) measuring the particle size distribution and the quantity of particles of the water particles (10) discharged from the plurality of flow passages (3b). By the device and method, the honeycomb structure can be easily inspected for presence or absence of defects, sizes of defects, quantity of defects, and the sizes and quantity of pits, and a post-treatment can also be easily performed.

摘要翻译： 一种用于检查具有多孔分隔壁（2）的蜂窝结构的方法和装置，所述蜂窝结构设置成形成从一个端面（42）穿过所述蜂窝结构体的多个流动通道（3a）和（3b） 所述装置包括产生水颗粒的水粒子产生部分（11），将水颗粒（10）引导到多个流动通道（3）中的水粒子引入部分（12） a）和排出的颗粒测量部件（13），其测量从多个流动通道（3b）排出的水粒子（10）的粒度分布和颗粒数量。 通过该装置和方法，可以容易地检查蜂窝结构的存在或不存在缺陷，缺陷尺寸，缺陷量以及凹坑的尺寸和数量，并且还可以容易地执行后处理。

公开(公告)号：US20130013240A1

公开(公告)日：2013-01-10

申请号：US13617950

申请日：2012-09-14

申请人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

发明人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

IPC分类号： G01N37/00 ,  G06F19/00

CPC分类号： G05B19/4065 ,  G05B2219/32226 ,  Y02P90/14

摘要： A semiconductor manufacturing system includes a program for inspecting a device of the system executing: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The program also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

摘要翻译： 半导体制造系统包括用于检查执行系统的装置的程序：显示用于选择包括具有操作项目和/或检查项目的检查项目的检查集合的屏幕; 检索检查项目，按照工作流程顺序排列检查项目，并在屏幕上显示每个检查项目，其中执行属性指示每个检查项目是自动还是手动执行; 接收检查开始命令并从存储单元读取第一检查项目。 该程序还执行与以下情况（a）至（d）相对应的步骤，直到不再有检查项目：（a）作为操作项目的读出检查项目并自动; （b）读出的检查项目是操作项目和手册; （c）读出检查项目为检查项目并自动; 和（d）读出的检查项目是检查项目和手册。

公开(公告)号：US20050169033A1

公开(公告)日：2005-08-04

申请号：US11095571

申请日：2005-04-01

申请人： Norihiko Sugita ,  Takafumi Kikuchi ,  Koichi Miyashita ,  Hikaru Ikegami

发明人： Norihiko Sugita ,  Takafumi Kikuchi ,  Koichi Miyashita ,  Hikaru Ikegami

IPC分类号： G11C5/00 ,  G11C5/06 ,  H05K1/02 ,  H05K1/14

CPC分类号： G11C5/06 ,  G11C5/005 ,  G11C5/04 ,  H01L23/50 ,  H01L23/552 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/141

摘要： A high speed operating circuit such as a data processor chip and memory chips constituting an electronic circuit is mounted to a multilayer wiring substrate in the state of a bare chip, and is set to a multichip module. This multichip module is mounted to a wiring substrate constituting the electronic circuit. In the multichip module, buffer circuits are inserted into a module internal bus commonly connected to the data processor chip and the memory chips. The buffer circuits are set to an address output buffer, a control signal output buffer and a data input/output buffer set to a high impedance state in accordance with an operating selection of the memory chips. When high frequency noise resisting characteristics are strengthened by the multilayer wiring substrate and the data processor chip gets access to the memory chips, an external noise tends to flow into a memory through the module internal bus connected to the data processor chip and the memory chips. However, the buffer circuits restrain the flow-in of such an external noise and prevent memory data from being broken by the high frequency noise during a memory access operation.

摘要翻译： 构成电子电路的数据处理器芯片和存储器芯片等高速运算电路以裸芯片的状态安装在多层布线基板上，设置于多芯片模块。 该多芯片模块安装到构成电子电路的布线基板。 在多芯片模块中，缓冲电路被插入到共同连接到数据处理器芯片和存储器芯片的模块内部总线中。 根据存储器芯片的操作选择，将缓冲电路设置为地址输出缓冲器，控制信号输出缓冲器和设置为高阻抗状态的数据输入/输出缓冲器。 当通过多层布线基板和数据处理器芯片获得对存储器芯片的访问来增强高频抗噪声特性时，通过连接到数据处理器芯片和存储器芯片的模块内部总线，外部噪声趋于流入存储器。 然而，缓冲电路抑制这种外部噪声的流入，并且在存储器访问操作期间防止存储器数据被高频噪声破坏。

公开(公告)号：US20130062758A1

公开(公告)日：2013-03-14

申请号：US13422424

申请日：2012-03-16

申请人： Takashi IMOTO ,  Yoriyasu Ando ,  Akira Tanimoto ,  Masaji Iwamoto ,  Yasuo Takemoto ,  Hideo Taguchi ,  Naoto Takebe ,  Koichi Miyashita ,  Jun Tanaka ,  Katsuhiro Ishida ,  Shogo Watanabe ,  Yuichi Sano

发明人： Takashi IMOTO ,  Yoriyasu Ando ,  Akira Tanimoto ,  Masaji Iwamoto ,  Yasuo Takemoto ,  Hideo Taguchi ,  Naoto Takebe ,  Koichi Miyashita ,  Jun Tanaka ,  Katsuhiro Ishida ,  Shogo Watanabe ,  Yuichi Sano

IPC分类号： H01L25/07 ,  H01L23/48

CPC分类号： H01L23/3135 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a semiconductor device has a substrate, a first semiconductor chip, an electrode, a first and second connection member, and a first and second sealing member. The electrode is disposed on the first semiconductor chip and contains Al. The first connection member electrically connects the electrode and the substrate and contains Au or Cu. The first sealing member seals the first semiconductor chip and the first connection member. One or more second semiconductor chips are stacked on the first sealing member. The second sealing member seals the first connection member, the one or more second semiconductor chips, and the one or more second connection members. A ratio of a total weight W1 of Cl ions and Br ions in the first sealing member to a weight W0 of resins of the substrate and the first sealing member is 7.5 ppm or lower.

摘要翻译： 在一个实施例中，半导体器件具有衬底，第一半导体芯片，电极，第一和第二连接构件以及第一和第二密封构件。 电极设置在第一半导体芯片上并且包含Al。 第一连接构件电连接电极和衬底并且包含Au或Cu。 第一密封构件密封第一半导体芯片和第一连接构件。 一个或多个第二半导体芯片堆叠在第一密封构件上。 第二密封构件密封第一连接构件，一个或多个第二半导体芯片和一个或多个第二连接构件。 第一密封部件中的Cl离子和Br离子的总重量W1与基板和第一密封部件的树脂的重量W0的比例为7.5ppm以下。

公开(公告)号：US08328974B2

公开(公告)日：2012-12-11

申请号：US12573318

申请日：2009-10-05

申请人： Takeshi Tokunaga ,  Koichi Miyashita

发明人： Takeshi Tokunaga ,  Koichi Miyashita

IPC分类号： B29C53/08

CPC分类号： B28B11/007 ,  B28B11/006 ,  Y10T156/1002 ,  Y10T156/1033

摘要： The film sticking apparatus includes: a gripping member; a pressing member pressing the adhesive face of the film being held in a planar state against one end face of a cylindrical honeycomb structure having a plurality of cells, and thus sticking the film to the one end face; and a folding member having an opening portion formed that allows an end of the honeycomb structure on the side to which the film is stuck to be inserted, wherein the folding member folds a protruding portion of the film protruding from the one end face of the honeycomb structure by inserting the honeycomb structure into the opening portion, toward a side face of the honeycomb structure, and simultaneously presses at least a part of the folded protruding portion against a part of the side face of the honeycomb structure to stick the film to the side face.

摘要翻译： 胶片粘贴装置包括：夹持构件; 按压构件，其将具有多个单元的圆筒形蜂窝结构体的一个端面压在保持平面状态的膜的粘合面上，从而将薄膜粘贴在一个端面上; 以及折叠构件，其具有形成为允许蜂窝结构体在粘合膜侧的端部插入的开口部，其中，折叠构件折叠从蜂窝体的一个端面突出的膜的突出部分 通过将蜂窝结构体插入到蜂窝结构体的侧面的开口部中，同时将折叠的突出部的至少一部分压靠在蜂窝结构体的侧面的一部分上，以将膜粘附到侧面 面对。

公开(公告)号：US20070214964A1

公开(公告)日：2007-09-20

申请号：US11712950

申请日：2007-03-02

申请人： Koichi Miyashita ,  Yukihito Ichikawa

发明人： Koichi Miyashita ,  Yukihito Ichikawa

IPC分类号： B01D19/00

CPC分类号： B01D19/0036

摘要： There is disclosed a method for removing bubbles from a slurry and a device therefor capable of efficiently optimizing the removal of bubbles from a slurry and the viscosity of the slurry as well as dramatically reducing the bubble removing time. The device for removing bubbles from a slurry comprises a hopper 1 for charging a predetermined amount of slurry 2 including liquid and a high concentration of solid material agitated and dispersed in the liquid with the slurry containing bubbles to be removed therein; a bubble removing unit 20 disposed downstream of the hopper 1 and having a bubble removing plate 10 disposed downstream of the hopper 1 for discharging the slurry 2 containing bubbles to be removed therein in the form of and noncontact filaments or noodles; a slurry tank 3 connected downstream of the bubble removing unit 20; a vacuum unit 30 for evacuating the slurry tank 3 when the bubble removing unit 20 is used; and an air introduction unit 40 for introducing air for pressure-delivering the slurry 6 which is contained in the slurry tank 3 from the bubble removing unit 20 with bubbles removed to the outside.

摘要翻译： 公开了一种用于从浆料中除去气泡的方法及其装置，其能够有效地优化从浆料中除去气泡和浆料的粘度以及显着减少气泡去除时间。 用于从浆料中除去气泡的装置包括：料斗1，用于对包含液体的预定量的浆料2和搅拌并分散在液体中的高浓度固体物料填充含有待除去气泡的浆料; 气泡去除单元20设置在料斗1的下游，并且具有设置在料斗1下游的气泡去除板10，用于排出含有以非接触丝或面的形式除去的气泡的浆料2; 连接在气泡去除单元20的下游的浆料槽3; 用于在使用气泡去除单元20时抽出浆料罐3的真空单元30; 以及空气引入单元40，用于引入空气，用于将除去气泡的气泡从气泡去除单元20压缩输送到浆料罐3中的浆料6。

公开(公告)号：US20070212483A1

公开(公告)日：2007-09-13

申请号：US11708592

申请日：2007-02-21

申请人： Koichi Miyashita ,  Yukihito Ichikawa

发明人： Koichi Miyashita ,  Yukihito Ichikawa

IPC分类号： B05D7/22 ,  B05C13/02

CPC分类号： B05C11/08 ,  B01D46/0001 ,  B01D46/0086 ,  B01D46/2418 ,  B01D2279/30 ,  B05C5/02 ,  B05C11/1005

摘要： Problem to be solved is to provide a means to make the thickness of a ceramic slurry in a container uniformly in a process to form plugged portions in a honeycomb structure. The solution is provided with a slurry applying device 1 comprising a plate shaped container 2 which a base 21 is flat, a fixed quantity non-pulsatile pump 3 to which a slurry 31 is discharged to the base 21 of the container 2, a discharge opening moving means which relatively moves a position of a discharge opening of the pump 3 between center 22 and periphery 23 of the base 21 of the container 2, and a container rotating means for application which rotates the container 2 as a rotating axis with the center 22 of the base 21.

摘要翻译： 要解决的问题是提供一种使蜂窝状结构中形成堵塞部分的过程中的陶瓷浆料的厚度均匀地均匀的方法。 该溶液设置有浆料施加装置1，该浆料施加装置1包括基部21平坦的板状容器2，固定量非脉动泵3，浆料31向容器2的基部21排出，排出口 将容器2的基座21的中心22与周边23之间的泵3的排出口的位置相对移动的移动装置，以及容器旋转装置，其将容器2作为旋转轴线与中心22旋转 的基地21。

公开(公告)号：US09223305B2

公开(公告)日：2015-12-29

申请号：US13617950

申请日：2012-09-14

申请人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

发明人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

IPC分类号： G01N21/88 ,  G01N21/75 ,  G01N21/95 ,  G06F3/00 ,  G05B19/4065

CPC分类号： G05B19/4065 ,  G05B2219/32226 ,  Y02P90/14

摘要： A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

摘要翻译： 半导体制造系统包括：电路，被配置为执行：显示用于选择包括具有操作项目和/或检查项目的检查项目的检查集合的屏幕; 检索检查项目，按照工作流程顺序排列检查项目，并在屏幕上显示每个检查项目，其中执行属性指示每个检查项目是“自动”还是“手动”执行; 接收检查开始命令并从存储单元读取第一检查项目。 电路还执行与以下情况（a）至（d）相对应的步骤，直到不再有检查项目：（a）作为操作项目的读出检查项目和“自动”; （b）作为操作项目的读出检查项目和“手册”; （c）读出的检查项目是检查项目和“自动”; 和（d）读出的检查项目是检查项目和“手册”。