公开(公告)号：US09327418B2

公开(公告)日：2016-05-03

申请号：US13615782

申请日：2012-09-14

申请人： Kouhei Horiuchi ,  Michio Uruno ,  Hiroaki Takahashi ,  Tomoyuki Nakamura ,  Mitsuyoshi Shimamura

发明人： Kouhei Horiuchi ,  Michio Uruno ,  Hiroaki Takahashi ,  Tomoyuki Nakamura ,  Mitsuyoshi Shimamura

IPC分类号： C09J7/02 ,  B26D3/08 ,  B32B38/10

CPC分类号： B26D3/08 ,  C09J7/29 ,  Y10T83/0341 ,  Y10T156/1062 ,  Y10T428/14

摘要： An adhesive film includes a film-like adhesive layer and a pair of separators sandwiching the adhesive layer. The outer edges of both separators extend outward beyond the outer edge of the adhesive layer, and a blade is used to form a notch on the adhesive layer side of the heavy release separator, along the outer edge of the adhesive layer. The thickness of the heavy release separator is between 50 μm and 200 μm, the average notch depth is between 5 μm and 45 μm and the standard deviation for the notch depth is no greater than 15 μm. Specifying the notch depth allows complete cutting of the adhesive layer with the blade, while also limiting release problems between the heavy release separator and the adhesive layer.

摘要翻译： 粘合剂膜包括膜状粘合剂层和夹着粘合剂层的一对隔板。 两个分离器的外边缘向外延伸超过粘合剂层的外边缘，并且使用刀片沿着粘合剂层的外边缘在重型剥离分离器的粘合剂层侧上形成切口。 重型脱模分离器的厚度在50μm和200μm之间，平均切口深度在5μm和45μm之间，凹口深度的标准偏差不大于15μm。 指定切口深度允许用刀片完全切割粘合剂层，同时也限制了重型分离器和粘合剂层之间的释放问题。

公开(公告)号：US20130071596A1

公开(公告)日：2013-03-21

申请号：US13615782

申请日：2012-09-14

申请人： Kouhei HORIUCHI ,  Michio Uruno ,  Hiroaki Takahashi ,  Tomoyuki Nakamura ,  Mitsuyoshi Shimamura

发明人： Kouhei HORIUCHI ,  Michio Uruno ,  Hiroaki Takahashi ,  Tomoyuki Nakamura ,  Mitsuyoshi Shimamura

IPC分类号： C09J7/02 ,  B32B38/10 ,  B26D3/08

CPC分类号： B26D3/08 ,  C09J7/29 ,  Y10T83/0341 ,  Y10T156/1062 ,  Y10T428/14

摘要： An adhesive film includes a film-like adhesive layer and a pair of separators sandwiching the adhesive layer. The outer edges of both separators extend outward beyond the outer edge of the adhesive layer, and a blade is used to form a notch on the adhesive layer side of the heavy release separator, along the outer edge of the adhesive layer. The thickness of the heavy release separator is between 50 μm and 200 μm, the average notch depth is between 5 μm and 45 μm and the standard deviation for the notch depth is no greater than 15 μm. Specifying the notch depth allows complete cutting of the adhesive layer with the blade, while also limiting release problems between the heavy release separator and the adhesive layer.

摘要翻译： 粘合剂膜包括膜状粘合剂层和夹着粘合剂层的一对隔板。 两个分离器的外边缘向外延伸超过粘合剂层的外边缘，并且使用刀片沿着粘合剂层的外边缘在重型剥离分离器的粘合剂层侧上形成切口。 重型脱模分离器的厚度在50μm和200μm之间，平均切口深度在5μm和45μm之间，凹口深度的标准偏差不大于15μm。 指定切口深度允许用刀片完全切割粘合剂层，同时也限制了重型分离器和粘合剂层之间的释放问题。

公开(公告)号：US09034449B2

公开(公告)日：2015-05-19

申请号：US13571792

申请日：2012-08-10

申请人： Kouhei Horiuchi ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

发明人： Kouhei Horiuchi ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

IPC分类号： B32B7/12 ,  B32B9/00 ,  B32B33/00 ,  C09J7/02

CPC分类号： B32B37/02 ,  B32B37/12 ,  B32B2307/412 ,  B32B2457/202 ,  C09J7/20 ,  C09J7/40 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/1333 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/24777 ,  Y10T428/2839 ,  Y10T428/2848

摘要： The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order.

摘要翻译： 粘合剂膜包括层压在粘合剂层的两侧的膜状粘合剂层，光分离器和重分离分离器，以及进一步层压在重型剥离分离器上的载体膜。 形成外层的光分离器和载体膜的外边缘向外延伸超过粘合剂层的外边缘，而形成内层的重型剥离隔离物。 因此，粘合剂层的外边缘部分被保护。 首先抓住并释放载体膜的外缘部分，然后夹紧释放光分离器的外边缘部分，最后释放分离器，从而使分离器和载体膜可靠地 并以规定的顺序轻松释放。

公开(公告)号：US20130040093A1

公开(公告)日：2013-02-14

申请号：US13571792

申请日：2012-08-10

申请人： Kouhei HORIUCHI ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

发明人： Kouhei HORIUCHI ,  Michio Uruno ,  Junichi Imaizumi ,  Seiji Sunohara ,  Yasushi Numaguchi

IPC分类号： C09J7/02

CPC分类号： B32B37/02 ,  B32B37/12 ,  B32B2307/412 ,  B32B2457/202 ,  C09J7/20 ,  C09J7/40 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/1333 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/24777 ,  Y10T428/2839 ,  Y10T428/2848

摘要： The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order.

公开(公告)号：US08017444B2

公开(公告)日：2011-09-13

申请号：US11578939

申请日：2005-04-20

申请人： Teiichi Inada ,  Michio Mashino ,  Michio Uruno ,  Tetsuro Iwakura

发明人： Teiichi Inada ,  Michio Mashino ,  Michio Uruno ,  Tetsuro Iwakura

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  C08K3/36 ,  C08L2666/02 ,  C09J7/10 ,  C09J163/00 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/67132 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/15311 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/20752 ,  H01L2224/27 ,  H01L2224/32245 ,  H01L2224/48247

摘要： An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.

摘要翻译： 本发明的目的是提供一种能够填充由于基板的布线或者附着在半导体芯片等上的线的不规则性的粘合片，在切割时不会形成树脂毛刺，并且具有令人满意的耐热性和耐湿性 。 本发明涉及一种粘合片，其包含100重量份的树脂，其包含15〜40重量％的含有交联官能团的高分子量组分，其重均分子量为100,000以上，Tg为 - 50〜50℃，60〜85重量％的以环氧树脂为主要成分的热固性成分和40〜180重量份的填料，所述粘合片的厚度为10〜250 μm。

公开(公告)号：US20080261039A1

公开(公告)日：2008-10-23

申请号：US11577255

申请日：2005-09-30

申请人： Maiko Tanaka ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

发明人： Maiko Tanaka ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

IPC分类号： B32B7/12 ,  H01L21/00 ,  H01L23/52 ,  H01L23/495

CPC分类号： H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

摘要翻译： 一种粘合片，其包括放置在剥离基板10和基材膜14之间的剥离基板10，基材膜14和第一粘性层12，其中环状切口D从剥离基板10的表面形成 第一粘合剂层12侧，第一粘合剂层12层叠以覆盖剥离基板10中的切口D的整个内表面，并且切口D的深度d小于 释放基板10和25或更小。

公开(公告)号：US20070026572A1

公开(公告)日：2007-02-01

申请号：US10556535

申请日：2005-03-15

申请人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shunichi Ishiwata

发明人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shunichi Ishiwata

IPC分类号： H01L21/00

CPC分类号： C09J163/10 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/35 ,  C09J133/068 ,  C09J161/06 ,  C09J161/28 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2475/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73265 ,  H01L2224/83191

摘要： The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

摘要翻译： 本发明提供一种切割/切片接合片，其可以在切割时用作切割带，能够在拾取期间将半导体元件和粘合剂层与压敏粘合剂层容易地分离，并且其中粘合剂层具有令人满意的 作为芯片接合材料的粘合性。 一种切片/芯片粘接片，其中所述压敏粘合剂层包含含有碘值为0.5至20的分子内，可辐射固化碳 - 碳双键的化合物（A）和至少一种选自以下的化合物（B）： 由聚异氰酸酯，三聚氰胺 - 甲醛树脂和环氧树脂组成的组，并且粘合剂层包含环氧树脂（a），羟基当量至少为150g / eq的酚醛树脂（b），环氧基 - 含有丙烯酸共聚物（c），包含0.5-6重量％的丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯，重均分子量至少为100,000，填料（d）和固化促进剂（e）。

公开(公告)号：US20060128065A1

公开(公告)日：2006-06-15

申请号：US10559684

申请日：2004-06-04

申请人： Teiichi Inada ,  Michio Mashino ,  Michio Uruno

发明人： Teiichi Inada ,  Michio Mashino ,  Michio Uruno

IPC分类号： H01L21/50 ,  B32B7/12

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  H01L21/67132 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31587 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31736 ,  Y10T428/31757 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/3183 ,  Y10T428/31909 ,  Y10T428/31913 ,  Y10T428/3192 ,  Y10T428/31928 ,  Y10T428/31938 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/27

摘要： The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

摘要翻译： 本发明提供了一种粘合片，其可以在100℃或更低的低温下粘附到晶片上，该粘合片柔软到在室温下可以处理的程度，并且可以在通常情况下与晶片同时切割 切割条件; 通过粘合片和切割带的层叠而形成的切割带一体型粘合片; 以及使用它们的半导体器件的制造方法。 为了达到上述目的，本发明的特征在于，在特定数值范围内指定粘合片的断裂强度，断裂伸长率和弹性模量。

公开(公告)号：US20120068312A1

公开(公告)日：2012-03-22

申请号：US13310515

申请日：2011-12-02

申请人： Maikoi TANAKA ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

发明人： Maikoi TANAKA ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

IPC分类号： H01L23/00 ,  B32B38/04 ,  H01L21/302 ,  B32B33/00

CPC分类号： H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

公开(公告)号：US20080171187A1

公开(公告)日：2008-07-17

申请号：US12047200

申请日：2008-03-12

申请人： Teiichi INADA ,  Michio Mashino ,  Michio Uruno

发明人： Teiichi INADA ,  Michio Mashino ,  Michio Uruno

IPC分类号： B32B7/12 ,  C08L55/00

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  H01L21/67132 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31587 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31736 ,  Y10T428/31757 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/3183 ,  Y10T428/31909 ,  Y10T428/31913 ,  Y10T428/3192 ,  Y10T428/31928 ,  Y10T428/31938 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/27

摘要： The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

摘要翻译： 本发明提供了一种粘合片，其可以在100℃或更低的低温下粘附到晶片上，该粘合片柔软到在室温下可以处理的程度，并且可以在通常情况下与晶片同时切割 切割条件; 通过粘合片和切割带的层叠而形成的切割带一体型粘合片; 以及使用它们的半导体器件的制造方法。 为了达到上述目的，本发明的特征在于，在特定数值范围内指定粘合片的断裂强度，断裂伸长率和弹性模量。