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    Packaged Semiconductor Chip Comprising An Integrated Circuit Chip Ablated With Laser And Cut With Saw Blade From Wafer
    3.
    发明申请
    Packaged Semiconductor Chip Comprising An Integrated Circuit Chip Ablated With Laser And Cut With Saw Blade From Wafer 有权
    封装的半导体芯片包括一个集成电路芯片，激光切割与锯片从晶片切割

    公开(公告)号：US20070257365A1

    公开(公告)日：2007-11-08

    申请号：US11777878

    申请日：2007-07-13

    申请人： Szu Wei Lu ,  Hsin-Hui Lee ,  Ming-Chung Sung ,  Mirng-Ji Lii

    发明人： Szu Wei Lu ,  Hsin-Hui Lee ,  Ming-Chung Sung ,  Mirng-Ji Lii

    IPC分类号： H01L23/48

    CPC分类号： H01L21/78 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A packaged semiconductor chip comprising an integrated circuit chip including a low-k dielectric layer and a chip substrate, wherein an edge of the integrated circuit chip has a first edge portion and a second edge portion. At least part of the first edge portion being across a same level as the low-k dielectric layer, and the first edge portion having been laser ablated to have a series of rounded recesses formed therein. The second edge portion being across a same level as at least part of the chip substrate, and the second edge portion having a different surface texture than that of the first edge portion. The packaged semiconductor chip also comprises a packaging substrate having the integrated circuit chip attached and a plurality of solder bumps electrically connecting between the packaging substrate and the integrated circuit chip.

    摘要翻译： 一种封装半导体芯片，包括具有低k电介质层和芯片基板的集成电路芯片，其中所述集成电路芯片的边缘具有第一边缘部分和第二边缘部分。 所述第一边缘部分的至少一部分与所述低k电介质层相同，并且所述第一边缘部分被激光烧蚀以在其中形成一系列圆形凹陷。 所述第二边缘部分与所述芯片基板的至少一部分处于相同的高度，并且所述第二边缘部分具有与所述第一边缘部分不同的表面纹理。 封装的半导体芯片还包括具有附接的集成电路芯片的封装基板和电连接在封装基板和集成电路芯片之间的多个焊料凸块。

    System and Method for Forming Uniform Rigid Interconnect Structures
    4.
    发明申请
    System and Method for Forming Uniform Rigid Interconnect Structures 有权
    形成均匀刚性互连结构的系统和方法

    公开(公告)号：US20140004660A1

    公开(公告)日：2014-01-02

    申请号：US13539188

    申请日：2012-06-29

    申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    IPC分类号： H01L21/50

    CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

    摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。

    Method and Apparatus for Die Assembly
    5.
    发明申请
    Method and Apparatus for Die Assembly 有权
    模具组装方法与装置

    公开(公告)号：US20130093094A1

    公开(公告)日：2013-04-18

    申请号：US13276184

    申请日：2011-10-18

    申请人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

    发明人： Ming-Chung Sung ,  Yu-Chih Liu ,  Wei-Ting Lin ,  Chien-Hsiun Lee

    IPC分类号： H01L23/48 ,  H01L21/78

    CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/73104

    摘要： Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits.

    摘要翻译： 模具组装的方法和装置 一种方法包括形成从半导体衬底的有源表面延伸的沟槽，其包括多个集成电路管芯，所述多个集成电路管芯具有从所述有源表面延伸的连接器端子， 形成覆盖在半导体衬底和沟槽的有源表面上的保护层，并覆盖连接器端子的下部; 在保护层和沟槽内打开预切割开口; 在半导体晶片的有源表面，保护层和连接器端子上施加带; 以及在半导体衬底的背面进行操作以去除材料，直到在半导体晶片的背面露出预切割开口。 一种装置包括具有集成电路的半导体衬底和围绕集成电路的连接器端子的保护层。

    System and method for forming uniform rigid interconnect structures
    10.
    发明授权
    System and method for forming uniform rigid interconnect structures 有权
    用于形成均匀刚性互连结构的系统和方法

    公开(公告)号：US08796132B2

    公开(公告)日：2014-08-05

    申请号：US13539188

    申请日：2012-06-29

    申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    IPC分类号： H01L21/60 ,  H01L21/48

    CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

    摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。