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公开(公告)号：US20080015302A1
公开(公告)日：2008-01-17
申请号：US11862423
申请日：2007-09-27
IPC分类号： C08J3/00
CPC分类号： C09D167/06 , C08K5/0025 , C08K5/34922 , C08L33/00 , C08L51/08 , C08L61/00 , C08L61/12 , C08L67/02 , C08L67/06 , C08L87/005 , C09D151/08 , C09D167/00 , C09D167/02 , C09D167/04 , C08L2666/14 , C08L2666/02 , C08L2666/24 , C08L2666/18
摘要： A composition for coating food cans is disclosed. The composition comprises a polyester, an acrylic copolymer and a crosslinker; the polyester and acrylic copolymer have been compatibilized in some way, such as through graft copolymerization. Methods for compatibilizing acrylics and polyesters are also disclosed as are methods for coating cans using compositions comprising acrylic and polyesters.
摘要翻译： 公开了一种用于涂覆食品罐头的组合物。 该组合物包含聚酯，丙烯酸共聚物和交联剂; 聚酯和丙烯酸共聚物已经以某种方式相容，例如通过接枝共聚。 还公开了相容化丙烯酸类和聚酯的方法，其中使用包含丙烯酸和聚酯的组合物涂覆罐的方法。
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公开(公告)号：US5521757A
公开(公告)日：1996-05-28
申请号：US37575
申请日：1993-03-26
申请人： Kevin Olson
发明人： Kevin Olson
CPC分类号： F41G11/001
摘要： An apparatus (10) for removable attachment to the adjustment ring (26) of telescope sights (12) for firearms (14) or the like is disclosed including a pinch clamping band (28) having an integral, elongated linear projection (42) extending axially therefrom. The clamping band (28) includes a split, annular wall (30) having a transverse radial cut defining first and second, free ends (32, 34). The free ends (32, 34) of the annular wall (30) are drawn together by a bolt (40) extending between bosses (36, 38) extending outwardly from the annular wall (30) on opposite sides of the transverse cut. A lever (50) has a securement end (52) positionable between the free ends (32, 34) of the annular wall (30) and including an aperture (60) for slideably receiving the bolt (40). The lever (50) extends axially from the clamping band (28) parallel to the axis (A) of the adjustment ring (26) and the projection ( 42). C-shaped adapters (46) having an internal surface for slideable receipt on the adjustment ring (26) and having an external surface for slideably receiving the annular wall (30) can be provided to allow the annular wall (30) to fit different sizes of adjustment rings (26). The adjustment ring (26) can be rotated by pushing the free ends of the lever (50) and/or the projection (42) at a location axially spaced from the adjustment ring (26) and adjacent to the ocular end of the eyepiece (22) to allow the hands of the shooter to be in an aiming and firing condition on the firearm (14) while adjusting the magnification of the telescope sight (12).
摘要翻译： 公开了一种用于可拆卸地附接到用于枪械（14）等的望远镜瞄准具（12）的调节环（26）的装置（10），其包括夹紧夹紧带（28），该夹紧夹紧带（28）具有一体的细长线性突起（42） 从其轴向。 夹紧带（28）包括分开的环形壁（30），其具有限定第一和第二自由端（32,34）的横向径向切口。 环形壁（30）的自由端（32,34）通过在横向切口的相对侧上从环形壁（30）向外延伸的凸台（36,38）之间延伸的螺栓（40）而被拉伸在一起。 杆（50）具有可定位在环形壁（30）的自由端（32,34）之间的固定端（52），并包括用于可滑动地接收螺栓（40）的孔（60）。 杆（50）从平行于调节环（26）的轴线（A）的夹紧带（28）和突起（42）轴向延伸。 可以设置具有可在调节环（26）上滑动接收并具有用于可滑动地接收环形壁（30）的外表面的内表面的C形适配器（46），以允许环形壁（30）适应不同尺寸 的调节环（26）。 调节环（26）可以通过在与调节环（26）轴向间隔开并且靠近目镜（...）的目视的位置处推动杆（50）和/或突起（42）的自由端 22），以允许射手的手在调整望远镜瞄准器（12）的放大倍数时在枪械（14）上处于瞄准和击发状态。
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公开(公告)号：US20080022523A1
公开(公告)日：2008-01-31
申请号：US11868148
申请日：2007-10-05
申请人： Alan Wang , Kevin Olson
发明人： Alan Wang , Kevin Olson
CPC分类号： H05K3/445 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/403 , H05K3/426 , H05K3/44 , H05K3/4614 , H05K3/4641 , H05K3/4644 , H05K2201/0129 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/09154 , H05K2201/09181 , H05K2201/0919 , H05K2201/09554 , H05K2201/09645 , H05K2201/09827 , H05K2203/1105 , H05K2203/135 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
摘要翻译： 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。
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4.发明申请公开(公告)号：US20080015333A1
公开(公告)日：2008-01-17
申请号：US11862377
申请日：2007-09-27
申请人： Kevin Olson , Gregory McCollum , Linda Anderson
发明人： Kevin Olson , Gregory McCollum , Linda Anderson
IPC分类号： C08G73/00
CPC分类号： C08L79/085 , C08G73/12
摘要： The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.
摘要翻译： 本发明涉及包含至少一种具有多个酰亚胺官能团的化合物的非胶凝的可固化组合物。 该化合物特别包含至少一种仲胺和至少一种马来酰亚胺的反应产物，并且适用于涂料和铸件。
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公开(公告)号：US20060005995A1
公开(公告)日：2006-01-12
申请号：US11224197
申请日：2005-09-12
申请人： Alan Wang , Kevin Olson , Thomas Di Stefano
发明人： Alan Wang , Kevin Olson , Thomas Di Stefano
IPC分类号： H05K1/03
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.
摘要翻译： 提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分 到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 以及（d）以一种方式将第一电路板与一次性部分分开，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。 还提供了通过该方法形成的电路板。
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公开(公告)号：US20080021402A1
公开(公告)日：2008-01-24
申请号：US11831891
申请日：2007-07-31
申请人： Stephen Jacobsen , Clark Davis , Clay Northrop , Ted Layman , Kevin Olson , Edward Snyder , D. Backman , Todd Turnlund
发明人： Stephen Jacobsen , Clark Davis , Clay Northrop , Ted Layman , Kevin Olson , Edward Snyder , D. Backman , Todd Turnlund
IPC分类号： A61M25/09
CPC分类号： A61M25/09 , A61M25/0013 , A61M25/01 , A61M25/09016
摘要： Medical devices for navigation through anatomy, including guidewires, which may have a core wire, a slotted tubular member, or both. Embodiments may have coils, including non-circular cross-section edge-wound marker coils, extended coil tips, and soldered or glued mesial joint coils. Core wires may have a step, ridge, or taper at the joints to the tubular member, and may be flattened at the distal tip. Radiopaque material may be located inside the tubular member, and the distal tip may be heat treated to make it shapeable. Additional tubular members or coils may be used concentrically or in line and may enhance flexibility, provide radiopacity, reduce friction, or reduce material or manufacturing cost. Tubular members may be chamfered or tapered continuously or incrementally. Slots may be arranged in groups, such as groups of three, and may be equal in depth or unequal in depth to provide a steerable or compressible tip.
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公开(公告)号：US20070226998A1
公开(公告)日：2007-10-04
申请号：US11760217
申请日：2007-06-08
申请人： Kevin Olson , Alan Wang
发明人： Kevin Olson , Alan Wang
IPC分类号： H05K3/10 , H01L23/495
CPC分类号： H01L21/486 , C09D5/4488 , H01L21/481 , H01L21/4857 , H01L23/142 , H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K1/056 , H05K3/0023 , H05K3/0032 , H05K3/0035 , H05K3/388 , H05K3/426 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K2201/0179 , H05K2201/09554 , H05K2201/09609 , H05K2203/0582 , H05K2203/135 , H01L2924/00
摘要： Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.
摘要翻译： 提供了用于制造多层电路组件的工艺和通过这些工艺制造的多层电路组件。 该方法包括（a）提供基底，其至少一个区域包括多个通孔，这些区域的通孔密度为500至10,000个孔/平方英寸（75至1550个孔/平方厘米）; （b）将介电涂层施加到所述基底的所有暴露表面上以在其上形成保形涂层; 和（c）在基片的所有表面上涂一层金属。 可以包括诸如电路化的附加处理步骤。
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公开(公告)号：US20070111561A1
公开(公告)日：2007-05-17
申请号：US11565715
申请日：2006-12-01
申请人： Alan Wang , Kevin Olson , Thomas DiStefano
发明人： Alan Wang , Kevin Olson , Thomas DiStefano
IPC分类号： H01R12/00
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.
摘要翻译： 提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分 到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 和（d）以一种方式将第一电路板与一次性部分分离，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。 还提供了通过该方法形成的电路板。
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9.发明申请Single or multi-layer printed circuit board with improved edge via design 审中-公开单层或多层印刷电路板，具有改进的边缘通孔设计公开(公告)号：US20060213685A1
公开(公告)日：2006-09-28
申请号：US11442016
申请日：2006-05-26
申请人： Alan Wang , Kevin Olson
发明人： Alan Wang , Kevin Olson
IPC分类号： H05K1/11
CPC分类号： H05K3/445 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/403 , H05K3/426 , H05K3/44 , H05K3/4614 , H05K3/4641 , H05K3/4644 , H05K2201/0129 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/09154 , H05K2201/09181 , H05K2201/0919 , H05K2201/09554 , H05K2201/09645 , H05K2201/09827 , H05K2203/1105 , H05K2203/135 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
摘要翻译： 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。
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10.发明申请公开(公告)号：US20050124196A1
公开(公告)日：2005-06-09
申请号：US10987480
申请日：2004-11-11
申请人： Kevin Olson , Alan Wang , Peter Elenius , Thomas Goodman
发明人： Kevin Olson , Alan Wang , Peter Elenius , Thomas Goodman
CPC分类号： H05K3/002 , H05K1/056 , H05K3/0052 , H05K3/403 , H05K3/44 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/09181 , H05K2201/0919 , H05K2201/09309 , H05K2201/09536 , H05K2201/09545 , H05K2201/09554 , H05K2201/09645 , H05K2201/09827 , H05K2203/1105 , H05K2203/135
摘要： A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
摘要翻译： 多层电路板的电路板或每个电路板包括涂覆有覆盖导电片的一个表面的绝缘顶层的导电片，覆盖导电片的另一表面的绝缘底层和覆盖 导电片的边缘。 绝缘中间层可以夹在多层电路板组件的一对相邻电路板之间。 无地通孔或通孔可以延伸通过一个或多个电路板，用于连接其相对表面上的电导体。
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