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    Diffusion isolation layer for maskless cladding process
    1.
    发明授权
    Diffusion isolation layer for maskless cladding process 失效
    用于无掩模包层工艺的扩散隔离层

    公开(公告)号：US4786674A

    公开(公告)日：1988-11-22

    申请号：US817634

    申请日：1986-01-10

    申请人： Lester W. Herron ,  Ananda H. Kumar ,  Robert W. Nufer

    发明人： Lester W. Herron ,  Ananda H. Kumar ,  Robert W. Nufer

    IPC分类号： C23C10/04 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  C08K3/36 ,  C08K3/22

    CPC分类号： H01L21/4846 ,  C23C10/04 ,  H05K3/246 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0317 ,  H05K2203/025 ,  H05K2203/0743 ,  H05K3/048

    摘要： In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    摘要翻译： 在用于电镀现有冶金图案的无掩模金属包覆工艺中，使用保护层来隔离不期望附加金属镀覆的下方冶金的那些区域。 该层用作隔离屏障，以保护底层冶金免受重金属覆层的沉积和随后的扩散。 保护层的组成选择为具有足够的机械完整性的组合物，以承受工艺处理并支撑金覆层并具有耐热金属溅射和扩散过程中达到的高温的热完整性。 隔离阻挡层具有作为粘合剂的有机组分，其在金属沉积之前的加热步骤或扩散循环期间热分解，不留下含碳残留物，而留下惰性的无机支架以支撑金属。 在金属扩散之后，剩余的无机隔离层，覆盖的金属和残留在非图案化衬底上的任何未扩散的金属都可以通过诸如超声波的标准技术容易地去除。

    Diffusion isolation layer for maskless cladding process
    2.
    发明授权
    Diffusion isolation layer for maskless cladding process 失效
    用于无掩模包层工艺的扩散隔离层

    公开(公告)号：US4582722A

    公开(公告)日：1986-04-15

    申请号：US666954

    申请日：1984-10-30

    申请人： Lester W. Herron ,  Ananda H. Kumar ,  Robert W. Nufer

    发明人： Lester W. Herron ,  Ananda H. Kumar ,  Robert W. Nufer

    IPC分类号： H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  B05D3/12 ,  B05D5/12 ,  C23C14/00

    CPC分类号： H01L21/4846 ,  C23C10/04 ,  H05K3/246 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0317 ,  H05K2203/025 ,  H05K2203/0743 ,  H05K3/048

    摘要： Disclosed is a maskless metal cladding process for plating an existing metallurgical pattern by utilizing a protective layer to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal (e.g., gold) overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

    摘要翻译： 公开了一种无掩模金属包覆工艺，用于通过利用保护层来电镀现有的冶金图案，以隔离不期望附加金属镀覆的下方冶金的那些区域。 该层用作隔离屏障，以保护底层冶金不沉积和随后扩散重金属（例如，金）覆盖层。 保护层的组成选择为具有足够的机械完整性的组合物，以承受工艺处理并支撑金覆层并具有耐热金属溅射和扩散过程中达到的高温的热完整性。 隔离阻挡层具有作为粘合剂的有机组分，其在金属沉积之前的加热步骤或扩散循环期间热分解，不留下含碳残留物，而留下惰性的无机支架以支撑金属。 在金属扩散之后，剩余的无机隔离层，覆盖的金属和残留在非图案化衬底上的任何未扩散的金属都可以通过诸如超声波的标准技术容易地去除。

    Stepwise/ultimate density milling
    6.
    发明授权
    Stepwise/ultimate density milling 失效
    逐步/极限密度铣削

    公开(公告)号：US4598107A

    公开(公告)日：1986-07-01

    申请号：US763157

    申请日：1985-08-07

    申请人： Lester W. Herron ,  Robert W. Nufer

    发明人： Lester W. Herron ,  Robert W. Nufer

    IPC分类号： C04B35/111 ,  C04B35/634 ,  H01L21/48 ,  C08K5/09 ,  C04B33/34 ,  C08L1/08

    CPC分类号： H01L21/48 ,  C04B35/111 ,  C04B35/634

    摘要： Disclosed is a method of forming a slurry for casting into ceramic green sheets. Starting from selected quantities of a solvent, plasticizer, polymeric binder material, frit and aluminum oxide, a low viscosity pre-mix is formed by combining predetermined portions of the solvent and binder material and all of the plasticizer. The remaining portions of the solvent and binder material are combined into a post-mix. Next, the pre-mix and frit are milled in a ball mill. Then the aluminum oxide is added to the ball mill in steps using predetermined portions and milled for predetermined periods of time to achieve the desired degree of aluminum oxide deagglomeration and particle packing density. Finally, the post-mix is added to the ball mill and milled to obtain the final slurry.

    摘要翻译： 公开了一种形成用于铸造成陶瓷生片的浆料的方法。 从选定量的溶剂，增塑剂，聚合物粘合剂材料，玻璃料和氧化铝开始，通过将预定部分的溶剂和粘合剂材料以及所有的增塑剂组合形成低粘度预混物。 溶剂和粘合剂材料的剩余部分组合成后混合物。 接下来，将预混合物和玻璃料在球磨机中研磨。 然后，使用预定的部分，将步骤中的氧化铝加入到球磨机中并研磨预定的时间以达到所需程度的氧化铝解聚和颗粒堆积密度。 最后，将后混合物添加到球磨机中并研磨以获得最终的浆料。

    Method of controlling the sintering of metal particles
    9.
    发明授权
    Method of controlling the sintering of metal particles 失效
    控制金属颗粒烧结的方法

    公开(公告)号：US4776978A

    公开(公告)日：1988-10-11

    申请号：US42922

    申请日：1987-04-27

    申请人： Lester W. Herron ,  Raj N. Master ,  Robert W. Nufer

    发明人： Lester W. Herron ,  Raj N. Master ,  Robert W. Nufer

    IPC分类号： B22F1/00 ,  B22F3/10 ,  C04B41/51 ,  C04B41/88 ,  H01L21/48 ,  H05K1/09 ,  H01B1/06

    CPC分类号： H01L21/4867 ,  B22F1/0059 ,  B22F3/10 ,  B22F3/1021 ,  C04B41/51 ,  C04B41/88 ,  H05K1/092 ,  Y10T428/2998

    摘要： Sintering of metal particles at their normal sintering temperature is inhibited by coating the metal particles with an organic material such as polyvinyl butyral, polyvinyl formvar, polyvinyl alcohol, polyacrylonitrile epoxies, urethanes and cross-linked polyvinyl butyral. The organic coating serves as a barrier preventing physical contact between metal particles during the initial phase of the sintering cycle and degrades into a carbonaceous coating followed by volatilization during the intermediate phase of the cycle permitting coalescence of the metal particles into a dense mass along with the coalescence of the glass-ceramic particles. Co-sintering of the metal particles and the glass-ceramic particles with the aid of the organic coating results in a hermetic multi-layer glass ceramic substrate free of dimensional stability problems without deleteriously affecting the electrical conductivity of the metal conductor pattern.

    摘要翻译： 通过用有机材料如聚乙烯醇缩丁醛，聚乙烯基甲醛，聚乙烯醇，聚丙烯腈环氧化合物，聚氨酯和交联的聚乙烯醇缩丁醛涂覆金属颗粒来抑制金属颗粒在其正常烧结温度下的烧结。 有机涂层用作防止金属颗粒在烧结循环的初始阶段期间物理接触的屏障，并降解成碳质涂层，随后在循环的中间阶段挥发，使得金属颗粒与 玻璃陶瓷颗粒的聚结。 借助于有机涂层来共同烧结金属颗粒和玻璃 - 陶瓷颗粒导致密封的多层玻璃陶瓷衬底没有尺寸稳定性问题，而不会有害地影响金属导体图案的导电性。