公开(公告)号：US20150126653A1

公开(公告)日：2015-05-07

申请号：US14595028

申请日：2015-01-12

申请人： Ligui Zhou ,  Richard A. Spear ,  Roger Yu-Kwan Leung ,  Wenya Fan ,  Helen X. Xu ,  Lea M. Metin ,  Anil Shriram Bhanap

发明人： Ligui Zhou ,  Richard A. Spear ,  Roger Yu-Kwan Leung ,  Wenya Fan ,  Helen X. Xu ,  Lea M. Metin ,  Anil Shriram Bhanap

IPC分类号： C09D11/02 ,  C08K5/5419 ,  C09D11/10

CPC分类号： C09D11/02 ,  C08K5/5419 ,  C09D11/03 ,  C09D11/10 ,  C09D11/38 ,  C09D11/52 ,  H01L21/2225

摘要： Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element. Further, the dopant ink composition includes a silicon-containing compound.

摘要翻译： 提供了用于在半导体衬底中形成掺杂区域的掺杂剂油墨组合物和用于制造掺杂剂油墨组合物的方法。 在示例性实施方案中，掺杂剂油墨组合物包含包含至少一个与第13族元素键合的烷基的掺杂剂化合物。 此外，掺杂剂油墨组合物包含含硅化合物。

公开(公告)号：US08975170B2

公开(公告)日：2015-03-10

申请号：US13280077

申请日：2011-10-24

申请人： Ligui Zhou ,  Richard A. Spear ,  Roger Yu-Kwan Leung ,  Wenya Fan ,  Helen X. Xu ,  Lea M. Metin ,  Anil Shriram Bhanap

发明人： Ligui Zhou ,  Richard A. Spear ,  Roger Yu-Kwan Leung ,  Wenya Fan ,  Helen X. Xu ,  Lea M. Metin ,  Anil Shriram Bhanap

IPC分类号： H01L21/22 ,  C09D11/03 ,  C09D11/38 ,  C09D11/52

CPC分类号： C09D11/02 ,  C08K5/5419 ,  C09D11/03 ,  C09D11/10 ,  C09D11/38 ,  C09D11/52 ,  H01L21/2225

摘要： Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element or a Group 15 element. Further, the dopant ink composition includes a silicon-containing compound.

摘要翻译： 提供了用于在半导体衬底中形成掺杂区域的掺杂剂油墨组合物和用于制造掺杂剂油墨组合物的方法。 在示例性实施方案中，掺杂剂油墨组合物包含掺杂剂化合物，其包括至少一个与第13族元素或第15族元素键合的烷基。 此外，掺杂剂油墨组合物包含含硅化合物。

公开(公告)号：US20130098266A1

公开(公告)日：2013-04-25

申请号：US13280077

申请日：2011-10-24

申请人： Ligui Zhou ,  Richard A. Spear ,  Roger Yu-Kwan Leung ,  Wenya Fan ,  Helen X. Xu ,  Lea M. Metin ,  Anil Shriram Bhanap

发明人： Ligui Zhou ,  Richard A. Spear ,  Roger Yu-Kwan Leung ,  Wenya Fan ,  Helen X. Xu ,  Lea M. Metin ,  Anil Shriram Bhanap

IPC分类号： C09D11/02

CPC分类号： C09D11/02 ,  C08K5/5419 ,  C09D11/03 ,  C09D11/10 ,  C09D11/38 ,  C09D11/52 ,  H01L21/2225

摘要： Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element or a Group 15 element. Further, the dopant ink composition includes a silicon-containing compound.

摘要翻译： 提供了用于在半导体衬底中形成掺杂区域的掺杂剂油墨组合物和用于制造掺杂剂油墨组合物的方法。 在示例性实施方案中，掺杂剂油墨组合物包含掺杂剂化合物，其包括至少一个与第13族元素或第15族元素键合的烷基。 此外，掺杂剂油墨组合物包含含硅化合物。

公开(公告)号：US06518677B1

公开(公告)日：2003-02-11

申请号：US09662641

申请日：2000-09-15

申请人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

公开(公告)号：US20090141218A1

公开(公告)日：2009-06-04

申请号：US12257380

申请日：2008-10-23

申请人： Ligui Zhou ,  Quanyuan Shang

发明人： Ligui Zhou ,  Quanyuan Shang

IPC分类号： G02F1/1335 ,  G03F1/00

CPC分类号： G02F1/133516 ,  G02B5/201 ,  G03F7/0007 ,  G03F7/40

摘要： In the formation of color filters for flat panel displays, the invention includes concurrently curing and shrinking a pixel matrix and a color material on a substrate to achieve a substantially co-planar top surface. The invention includes applying a first activation energy to a pixel matrix material to render the material partially cured, minimally shrunk, hardened, and chemically ready for the application of a color material; applying the color material; and concurrently shrinking the color material and pixel material by the application of at least an additional activation energy wherein the additional activation energy is greater than the first activation energy. Numerous other aspects are provided.

摘要翻译： 在形成用于平板显示器的滤色器时，本发明包括同时固化和收缩基板上的像素矩阵和彩色材料，以实现基本上共平面的顶表面。 本发明包括将第一活化能应用于像素矩阵材料，以使材料部分固化，最小程度地收缩，硬化和化学地准备用于施加彩色材料; 应用颜色材料; 并且通过施加至少另外的活化能量同时使着色材料和像素材料收缩，其中附加活化能大于第一活化能。 提供了许多其他方面。

公开(公告)号：US06440257B1

公开(公告)日：2002-08-27

申请号：US09573760

申请日：2000-05-18

申请人： Ligui Zhou ,  Philippe D. Christou

发明人： Ligui Zhou ,  Philippe D. Christou

IPC分类号： C09J502

CPC分类号： B32B37/146 ,  B29D24/005 ,  B32B3/12 ,  Y10T442/30

摘要： Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.

摘要翻译： 提供了与纤维组合使用的树脂组合物，以形成应用于芯材料以形成夹芯板的自粘式预浸料片材。 预浸料树脂包括热固性树脂，固化剂和粘度控制剂。 预浸料树脂还包括某些热塑性颗粒，其用于控制​​预浸料树脂的流动特性和在将预浸料坯粘合到芯材料时形成圆角。

公开(公告)号：US6121689A

公开(公告)日：2000-09-19

申请号：US120172

申请日：1998-07-21

申请人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： B23K35/02 ,  B23K35/36 ,  B32B7/12 ,  C09J4/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/433 ,  H01L23/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/32 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

公开(公告)号：US06774493B2

公开(公告)日：2004-08-10

申请号：US10390603

申请日：2003-03-19

申请人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

摘要翻译： 通过使用具有分离的分离焊料柱的密封剂底部填充材料预涂芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触，然后将芯片和预包封的密封剂围绕第一接触点枢转，排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。

公开(公告)号：US06566234B1

公开(公告)日：2003-05-20

申请号：US09662642

申请日：2000-09-15

申请人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： H01L2130

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

摘要翻译： 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触，然后将芯片和预包封的密封剂围绕第一接触点枢转，排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。

公开(公告)号：US06508910B2

公开(公告)日：2003-01-21

申请号：US09795177

申请日：2001-02-27

申请人： Ligui Zhou ,  Philippe D. Christou

发明人： Ligui Zhou ,  Philippe D. Christou

IPC分类号： C09J502

CPC分类号： B32B37/146 ,  B29D24/005 ,  B32B3/12 ,  Y10T156/1025 ,  Y10T442/30

摘要： Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.

摘要翻译： 提供了与纤维组合使用的树脂组合物，以形成应用于芯材料以形成夹芯板的自粘式预浸料片材。 预浸料树脂包括热固性树脂，固化剂和粘度控制剂。 预浸料树脂还包括某些热塑性颗粒，其用于控制​​预浸料树脂的流动特性和在将预浸料坯粘合到芯材料时形成圆角。