公开(公告)号：US20230371264A1

公开(公告)日：2023-11-16

申请号：US17662982

申请日：2022-05-11

Applicant: Micron Technology, Inc.

Inventor： Albert Fayrushin ,  Kamal Karda ,  Gianpietro Carnevale ,  Aurelio Giancarlo Mauri

IPC: H01L27/11597 ,  H01L27/1159

CPC classification number: H01L27/11597 ,  H01L27/1159

Abstract: Methods, systems, and devices for NAND structures with polarized materials are described. A memory device may include a polarized dielectric material located relatively near to a channel, which may reduce interference between cells. The polarized dielectric material may include a dielectric material with a fixed polarity and having a first surface with a negative polarity oriented towards the channel. The negative polarity of the polarized dielectric material may affect an electron distribution of the channel by shifting the electron distribution closer to an associated charge trapping material. The shifted electron distribution may reduce an effect of an electric field of any aggressor cells of the memory device on one or more victim cells, by creating a more uniform channel electron distribution and increasing gate control relative to a channel without the effects of the polarized dielectric material.

公开(公告)号：US10170639B2

公开(公告)日：2019-01-01

申请号：US14987147

申请日：2016-01-04

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L29/788 ,  H01L29/423 ,  H01L29/66 ,  H01L27/11556 ,  H01L29/40 ,  H01L21/28 ,  H01L27/11582 ,  H01L29/51 ,  H01L27/11524 ,  H01L29/78

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

公开(公告)号：US20150287472A1

公开(公告)日：2015-10-08

申请号：US14746416

申请日：2015-06-22

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/32 ,  G11C16/04

CPC classification number: G11C16/3459 ,  G11C8/08 ,  G11C16/0483 ,  G11C16/06 ,  G11C16/08 ,  G11C16/16 ,  G11C16/26 ,  G11C16/32 ,  G11C16/3445 ,  G11C2213/71

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

Abstract translation: 一些实施例包括具有存储单元串的装置和方法，所述存储单元串包括位于装置的不同级别中的存储器单元和耦合到存储单元串的数据线。 存储单元串包括与存储单元相关联的柱体。 这种装置中的至少一个可以包括被配置为在存储器单元之间存储信息到存储器单元中的模块和/或确定存储器单元中存储在存储单元中的信息的值。 该模块还可以被配置为向数据线和/或源施加具有正值的电压以控制身体的电位。 描述其他实施例。

公开(公告)号：US20160133752A1

公开(公告)日：2016-05-12

申请号：US14987147

申请日：2016-01-04

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L29/788 ,  H01L27/115

CPC classification number: H01L29/7887 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11582 ,  H01L29/401 ,  H01L29/42324 ,  H01L29/518 ,  H01L29/66825 ,  H01L29/7827 ,  H01L29/7881 ,  H01L29/7889

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

公开(公告)号：US09230986B2

公开(公告)日：2016-01-05

申请号：US14610755

申请日：2015-01-30

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L29/788 ,  H01L27/115 ,  H01L29/423 ,  H01L29/66 ,  H01L29/40 ,  H01L21/28 ,  H01L29/51

CPC classification number: H01L29/7887 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11582 ,  H01L29/401 ,  H01L29/42324 ,  H01L29/518 ,  H01L29/66825 ,  H01L29/7827 ,  H01L29/7881 ,  H01L29/7889

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

公开(公告)号：US09064577B2

公开(公告)日：2015-06-23

申请号：US13707067

申请日：2012-12-06

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/04 ,  G11C11/34 ,  G11C16/06 ,  G11C16/16

CPC classification number: G11C16/3459 ,  G11C8/08 ,  G11C16/0483 ,  G11C16/06 ,  G11C16/08 ,  G11C16/16 ,  G11C16/26 ,  G11C16/32 ,  G11C16/3445 ,  G11C2213/71

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body.

Abstract translation: 一些实施例包括具有存储单元串的装置和方法，所述存储单元串包括位于装置的不同级别中的存储器单元和耦合到存储单元串的数据线。 存储单元串包括与存储单元相关联的柱体。 这种装置中的至少一个可以包括被配置为在存储器单元之间存储信息到存储器单元中的模块和/或确定存储器单元中存储在存储单元中的信息的值。 该模块还可以被配置为向数据线和/或源施加具有正值的电压以控制身体的电位。

公开(公告)号：US20240069749A1

公开(公告)日：2024-02-29

申请号：US18236087

申请日：2023-08-21

Applicant: Micron Technology, Inc.

Inventor： Augusto Benvenuti ,  Giovanni Maria Paolucci ,  Alessio Urbani ,  Gianpietro Carnevale ,  Aurelio Giancarlo Mauri

IPC: G06F3/06

CPC classification number: G06F3/0619 ,  G06F3/0655 ,  G06F3/0679

Abstract: A memory access operation is initiated to read a set of target memory cells of a target wordline of the memory device. During the memory access operation, a read voltage level is caused to be applied to the target wordline. During the memory access operation, a first pass through voltage level is caused to be applied to a first wordline adjacent to the target wordline. During the memory access operation, a second pass through voltage is caused to be applied to a second wordline adjacent to the target wordline, wherein the first pass through voltage level is less than the second pass through voltage level.

公开(公告)号：US20190147966A1

公开(公告)日：2019-05-16

申请号：US16228733

申请日：2018-12-20

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/34 ,  G11C16/06 ,  G11C16/16 ,  G11C16/04 ,  G11C16/26 ,  G11C16/08 ,  G11C16/32

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

公开(公告)号：US20150140797A1

公开(公告)日：2015-05-21

申请号：US14610755

申请日：2015-01-30

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L27/115 ,  H01L29/51 ,  H01L21/28

CPC classification number: H01L29/7887 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11582 ,  H01L29/401 ,  H01L29/42324 ,  H01L29/518 ,  H01L29/66825 ,  H01L29/7827 ,  H01L29/7881 ,  H01L29/7889

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

Abstract translation: 三维存储器单元以及制造和使用存储器单元的方法一般在此讨论。 在一个或多个实施例中，三维垂直存储器可以包括存储器堆栈。 这样的存储器堆可以包括存储器单元和相邻存储单元之间的电介质，每个存储单元包括控制栅极和电荷存储结构。 存储单元还可以包括电荷存储结构和控制栅极之间的阻挡材料，电荷存储结构和阻挡材料具有基本相等的尺寸。

公开(公告)号：US08946807B2

公开(公告)日：2015-02-03

申请号：US13748747

申请日：2013-01-24

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L29/788 ,  H01L29/423 ,  H01L29/40

CPC classification number: H01L29/7887 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11582 ,  H01L29/401 ,  H01L29/42324 ,  H01L29/518 ,  H01L29/66825 ,  H01L29/7827 ,  H01L29/7881 ,  H01L29/7889

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

Abstract translation: 三维存储器单元以及制造和使用存储器单元的方法一般在此讨论。 在一个或多个实施例中，三维垂直存储器可以包括存储器堆栈。 这样的存储器堆可以包括存储器单元和相邻存储单元之间的电介质，每个存储单元包括控制栅极和电荷存储结构。 存储单元还可以包括电荷存储结构和控制栅极之间的阻挡材料，电荷存储结构和阻挡材料具有基本相等的尺寸。