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公开(公告)号：US11197379B2
公开(公告)日：2021-12-07
申请号：US16495259
申请日：2018-03-29
摘要： The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).
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2.发明授权公开(公告)号：US11664240B2
公开(公告)日：2023-05-30
申请号：US16763796
申请日：2018-11-01
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K3/02 , H05K3/22 , H05K3/38 , H01L21/48 , H01L21/50 , H01L21/78 , H01L23/00 , H01L23/495 , H01L23/538 , H01L23/498 , H05K3/00 , H05K3/46
CPC分类号： H01L21/4857 , H01L23/49822 , H01L23/49838 , H05K3/0038 , H05K3/02 , H05K3/4658 , H05K3/0076
摘要： The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 μm and a second metal foil laminated in this order, and patterning the second metal foil.
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公开(公告)号：US10727081B2
公开(公告)日：2020-07-28
申请号：US16314568
申请日：2017-06-23
IPC分类号： H01L21/48 , B32B15/08 , H05K3/46 , H01L23/498 , B32B15/20 , C23C18/38 , C23F17/00 , C25D7/00
摘要： A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 μm to 5 μm, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.
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公开(公告)号：US20150056454A1
公开(公告)日：2015-02-26
申请号：US14384025
申请日：2013-03-12
发明人： Keisuke Takada , Syunsuke Hirano , Koji Morishita , Hidetoshi Kawai , Yuichi Koga , Yoshihiro Kato
IPC分类号： C09D183/06 , H05K1/05 , H05K1/03
CPC分类号： C09D183/06 , B32B5/022 , B32B5/024 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2262/0276 , B32B2262/10 , B32B2262/101 , B32B2307/306 , B32B2307/734 , B32B2457/08 , C08G77/14 , C08J5/24 , C08J2383/06 , C08J2479/08 , C08K2003/2241 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H05K2201/2054 , Y10T156/10 , Y10T428/31529 , C08L79/08
摘要： Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin.
摘要翻译： 提供一种可以在紫外线区域和可见光区域实现高反射率的预浸料，金属箔覆层压体等的树脂组合物，由于加热处理而导致的光反射率的降低小 照射处理，金属箔的剥离强度好，吸湿后的耐热性也优异，外观好，保存稳定性优异，使用该预浸料，覆盖箔的层压板等也可以。 本发明的树脂组合物至少含有环氧改性有机硅化合物（A），具有异氰脲酸酯基和羧基的支链酰亚胺树脂（B），磷固化促进剂（C），二氧化钛（D）和 分散剂（E）。 支链酰亚胺树脂（B）优选为选自环氧改性的支链酰亚胺树脂，醇改性的支化酰亚胺树脂和胺改性的支化酰亚胺树脂中的至少一种。
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公开(公告)号：US12119277B2
公开(公告)日：2024-10-15
申请号：US17413277
申请日：2019-10-21
IPC分类号： H05K3/46 , H01L21/48 , H01L23/14 , H01L23/373 , H05K1/03
CPC分类号： H01L23/142 , H01L21/4857 , H01L23/3735 , H05K1/036 , H05K3/4682
摘要： A method for producing a package substrate for mounting a semiconductor device includes:
forming a first substrate by forming a laminate in which a first metal layer that has a thickness of 1 μm to 70 μm and that is peelable from a core resin layer, a first insulating resin layer, and a second metal layer are arranged on both sides of the core resin layer having a thickness of 1 μm to 80 μm, and heating and pressurizing the laminate simultaneously;
forming a pattern on the second metal layer;
forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer on a surface of the second metal layer; and
peeling, from the core resin layer, a third substrate including the first metal and insulating resin layers, the second metal and insulating layers, and the third metal layer.-
公开(公告)号：US11990349B2
公开(公告)日：2024-05-21
申请号：US17413355
申请日：2019-10-21
CPC分类号： H01L21/4857 , C23C18/1603 , C23C18/1803 , C23C18/38 , C25D3/38 , C25D5/02 , C25D5/34 , C25D7/00
摘要： A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.
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公开(公告)号：US11877396B2
公开(公告)日：2024-01-16
申请号：US17271062
申请日：2019-08-16
CPC分类号： H05K1/036 , C08G18/58 , C08G18/7692 , H01L21/4857 , H01L23/145 , H01L23/49822 , H05K3/4682
摘要： Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 μm; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 μm.
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公开(公告)号：US11217445B2
公开(公告)日：2022-01-04
申请号：US16323172
申请日：2017-08-04
IPC分类号： H01L21/02 , H01L23/12 , H01L21/48 , H01L23/538 , H05K3/00 , H01L23/498 , H01L23/522 , H01L23/528 , H05K3/46
摘要： A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.
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9.发明申请RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD LAMINATE 审中-公开树脂板，树脂层，层压板和金属箔层压板的支撑公开(公告)号：US20150210832A1
公开(公告)日：2015-07-30
申请号：US14421622
申请日：2013-08-13
发明人： Keisuke Takada , Syunsuke Hirano , Koji Morishita , Hidetoshi Kawai , Yuichi Koga , Yoshihiro Kato
CPC分类号： C08K5/549 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/281 , B32B27/283 , B32B2264/102 , B32B2270/00 , B32B2457/00 , C08G59/3218 , C08G59/4042 , C08G59/688 , C08G73/0638 , C08G73/1085 , C08G77/14 , C08J5/18 , C08J2379/08 , C08K3/22 , C08K3/36 , C08K5/5435 , C08K2003/2227 , C08K2003/2241 , C08K2003/2244 , C08K2003/2296 , C08L63/00 , C08L79/04 , C08L79/08 , C08L83/06 , H05K1/0353 , H05K2201/0209 , H05K2201/10106 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a resin sheet that exhibits a small reduction in light reflectance due to a heating treatment and a light irradiation treatment with an excellent heat resistance being maintained. The present invention provides a resin sheet including a layer including a resin composition containing an aliphatic epoxy-modified silicone compound (A), a branched imide resin having an isocyanurate group and a carboxyl group (B), titanium dioxide (C) and a wetting and dispersing agent (D).
摘要翻译： 本发明提供一种由于加热处理而导致光反射率降低小的树脂片和保持耐热性优异的光照射处理。 本发明提供一种树脂片，其包括含有脂肪族环氧改性硅氧烷化合物（A）的树脂组合物，具有异氰脲酸酯基和羧基（B）的支链酰亚胺树脂，二氧化钛（C）和润湿剂 和分散剂（D）。
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