利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

27 条记录 (耗时 0.02 秒)

    Sampling management for a process analysis tool to minimize sample usage and decrease sampling time
    1.
    发明申请
    Sampling management for a process analysis tool to minimize sample usage and decrease sampling time 有权
    用于过程分析工具的抽样管理，以最小化样本使用量并减少采样时间

    公开(公告)号：US20050053522A1

    公开(公告)日：2005-03-10

    申请号：US10658948

    申请日：2003-09-10

    申请人： Mackenzie King ,  Thomas Chatterton ,  Richard Bhella

    发明人： Mackenzie King ,  Thomas Chatterton ,  Richard Bhella

    IPC分类号： C25D21/12 ,  G01N20060101 ,  G01N1/20 ,  G01N33/00 ,  G01N35/00

    CPC分类号： G01N35/1097 ,  C25D21/12 ,  G01N2001/205 ,  Y10T436/118339

    摘要： A method and system for analysis of additives in electrolysis plating solutions, using a flow management system that minimizes loss of plating solutions and decreases sampling time. The system includes at least one analysis chamber, a sampling duct connected to processing tool, a four-way valve positioned between the processing tool and the sampling duct, at least one carrier fluid duct connected to the analysis chamber, at least one actuatable multi-port valve that provides a transference platform between the sampling duct and the at least one carrier fluid duct, and a flow sensor connected to the sampling duct and positioned downstream from the at least one actuatable multi-port valve.

    摘要翻译： 一种用于分析电解电镀溶液中添加剂的方法和系统，使用最小化电镀溶液损失并减少采样时间的流量管理系统。 该系统包括至少一个分析室，连接到处理工具的采样管道，位于处理工具和采样管道之间的四通阀，连接到分析室的至少一个载体流体管道，至少一个可致动的多通道， 在所述采样管道和所述至少一个载体流体管道之间提供转移平台的端口阀，以及连接到所述采样管道并且位于所述至少一个可致动多通阀的下游的流量传感器。

    SIMULTANEOUS INORGANIC, ORGANIC AND BYPRODUCT ANALYSIS IN ELECTROCHEMICAL DEPOSITION SOLUTIONS
    2.
    发明申请
    SIMULTANEOUS INORGANIC, ORGANIC AND BYPRODUCT ANALYSIS IN ELECTROCHEMICAL DEPOSITION SOLUTIONS 审中-公开
    电化学沉积解决方案中的同时无机，有机和副产物分析

    公开(公告)号：US20070261963A1

    公开(公告)日：2007-11-15

    申请号：US11670507

    申请日：2007-02-02

    申请人： Jianwen Han ,  Mackenzie King ,  Glenn Tom ,  Steven Lurcott

    发明人： Jianwen Han ,  Mackenzie King ,  Glenn Tom ,  Steven Lurcott

    IPC分类号： C25D21/00

    CPC分类号： C25D21/14 ,  G01N27/42

    摘要： Real-time analysis of electrochemical deposition (ECD) metal plating solutions is described, for the purpose of reducing plating defects and achieving high quality metal deposition. Improved plating protocols are utilized for increasing potential signal strength and reducing the time required for each measurement cycle. New methods and algorithms for simultaneously determining concentrations of organic additives, inorganic additives, and/or byproducts in a sample ECD solution are described. In one aspect, a method is provided for simultaneously determining concentrations of all organic additives, inorganic additives, and/or byproducts within a single experimental run by using a single analytical cell, while interactions between such additives are properly accounted for.

    摘要翻译： 描述了电化学沉积（ECD）金属电镀溶液的实时分析，目的是减少电镀缺陷并实现高质量的金属沉积。 改进的电镀方案用于增加潜在的信号强度并减少每个测量周期所需的时间。 描述了用于同时测定样品ECD溶液中有机添加剂，无机添加剂和/或副产物浓度的新方法和算法。 在一个方面，提供了一种方法，用于通过使用单个分析单元同时确定单个实验运行中的所有有机添加剂，无机添加剂和/或副产物的浓度，同时适当地考虑了这些添加剂之间的相互作用。

    Methods and apparatus for determining organic component concentrations in an electrolytic solution
    4.
    发明申请
    Methods and apparatus for determining organic component concentrations in an electrolytic solution 有权
    用于测定电解液中有机组分浓度的方法和装置

    公开(公告)号：US20060102475A1

    公开(公告)日：2006-05-18

    申请号：US11318129

    申请日：2005-12-23

    申请人： Jianwen Han ,  Mackenzie King

    发明人： Jianwen Han ,  Mackenzie King

    IPC分类号： G01N27/416

    CPC分类号： C25D21/14 ,  C25D3/38

    摘要： The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample solution. Specifically, the present invention utilizes the correlation between double layer capacitance and the organic additive concentration for concentration mapping, based on the double layer capacitance measured for the sample electrolytic solution.

    摘要翻译： 本发明涉及一种通过测量这种样品溶液中的测量电极的双层电容来测定样品电解溶液（优选铜电镀溶液）中的有机添加剂浓度的方法和装置。 具体地说，本发明基于对样品电解液测量的双层电容，利用双层电容与浓度映射的有机添加剂浓度之间的相关性。

    Bodysuit
    7.
    发明申请
    Bodysuit 有权

    公开(公告)号：US20210177067A1

    公开(公告)日：2021-06-17

    申请号：US16863561

    申请日：2020-04-30

    申请人： Mackenzie King

    发明人： Mackenzie King

    IPC分类号： A41B1/06

    摘要： A novel bodysuit is provided. In particular, the present invention provides a bodysuit that presents a neat and kept appearance of a tucked-in shirt without the use of cumbersome elastic garters and loose magnetic attachments. The unique arrangement of the present bodysuit garment allows the user to engage in vigorous activities, such as horseback rodeo riding, while maintaining a kept appearance without dislodgement of fasteners or connectors through inadvertent contact with a saddle horn or other type of exterior object.

    Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
    9.
    发明授权
    Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon 有权
    用于回收其上具有低k电介质材料的半导体晶片的组合物和方法

    公开(公告)号：US08642526B2

    公开(公告)日：2014-02-04

    申请号：US13103536

    申请日：2011-05-09

    申请人： Pamela M. Visintin ,  Ping Jiang ,  Michael B. Korzenski ,  Mackenzie King

    发明人： Pamela M. Visintin ,  Ping Jiang ,  Michael B. Korzenski ,  Mackenzie King

    IPC分类号： G03F7/42

    CPC分类号： C09K13/08 ,  H01L21/02032 ,  H01L21/02079 ,  H01L21/31111 ,  H01L21/32134

    摘要： A removal composition and process for removing low-k dielectric material, etch stop material, and/or metal stack material from a rejected microelectronic device structure having same thereon. The removal composition includes hydrofluoric acid. The composition achieves at least partial removal of the material(s) from the surface of the microelectronic device structure having same thereon, for recycling and/or reuse of said structure, without damage to the underlying polysilicon or bare silicon layer employed in the semiconductor architecture.

    摘要翻译： 一种去除组合物和用于从其上具有相同材料的废弃微电子器件结构去除低k电介质材料，蚀刻停止材料和/或金属堆叠材料的去除组合物和方法。 除去组合物包括氢氟酸。 该组合物至少部分地从其上具有相同的微电子器件结构的表面去除材料，用于所述结构的再循环和/或再利用，而不会损坏半导体结构中使用的下面的多晶硅或裸硅层 。