公开(公告)号：US20130156371A1

公开(公告)日：2013-06-20

申请号：US13819507

申请日：2011-05-31

申请人： Maraki Maetani ,  Takahiro Matsubara ,  Yuji Masuda ,  Kaori Tanaka

发明人： Maraki Maetani ,  Takahiro Matsubara ,  Yuji Masuda ,  Kaori Tanaka

IPC分类号： G02B6/12 ,  G02B6/13

CPC分类号： G02B6/12 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214

摘要： Provided are an optical transmission structure having a high degree of flexibility in the design of an optical waveguide and a method for manufacturing the optical transmission structure, and also an optical transmission module. An optical transmission structure includes a main substrate (30), a cladding member (40), and core members (50). The main substrate (30) has a through hole (30a) penetrating therethrough in a thickness direction thereof. The cladding member (40) is disposed inside the through hole (30a) and has a plurality of optical waveguide holes (40a) penetrating therethrough in a thickness direction thereof. The core members (50) are disposed inside the plurality of optical waveguide holes (40a), respectively, and have a refractive index larger than the cladding member (40).

摘要翻译： 提供了一种在光波导的设计中具有高度灵活性的光传输结构以及用于制造光传输结构的方法，以及光传输模块。 光传输结构包括主基板（30），包层部件（40）和芯部件（50）。 主基板（30）具有在其厚度方向贯穿其的通孔（30a）。 包层部件（40）配置在贯通孔（30a）的内部，并且在其厚度方向上具有穿过其的多个光波导孔（40a）。 芯部件（50）分别设置在多个光波导孔（40a）的内部，折射率大于包覆部件（40）。

公开(公告)号：US09057827B2

公开(公告)日：2015-06-16

申请号：US13819507

申请日：2011-05-31

申请人： Maraki Maetani ,  Takahiro Matsubara ,  Yuji Masuda ,  Kaori Tanaka

发明人： Maraki Maetani ,  Takahiro Matsubara ,  Yuji Masuda ,  Kaori Tanaka

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/13 ,  G02B6/138

CPC分类号： G02B6/12 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214

摘要： Provided are an optical transmission structure having a high degree of flexibility in the design of an optical waveguide and a method for manufacturing the optical transmission structure, and also an optical transmission module. An optical transmission structure includes a main substrate (30), a cladding member (40), and core members (50). The main substrate (30) has a through hole (30a) penetrating therethrough in a thickness direction thereof. The cladding member (40) is disposed inside the through hole (30a) and has a plurality of optical waveguide holes (40a) penetrating therethrough in a thickness direction thereof. The core members (50) are disposed inside the plurality of optical waveguide holes (40a), respectively, and have a refractive index larger than the cladding member (40).

摘要翻译： 提供了一种在光波导的设计中具有高度灵活性的光传输结构以及用于制造光传输结构的方法，以及光传输模块。 光传输结构包括主基板（30），包层部件（40）和芯部件（50）。 主基板（30）具有在其厚度方向贯穿其的通孔（30a）。 包层部件（40）配置在贯通孔（30a）的内部，并且在其厚度方向上具有穿过其的多个光波导孔（40a）。 芯部件（50）分别设置在多个光波导孔（40a）的内部，折射率大于包覆部件（40）。

公开(公告)号：US09360638B2

公开(公告)日：2016-06-07

申请号：US13819943

申请日：2011-08-31

申请人： Maraki Maetani ,  Yuji Masuda

发明人： Maraki Maetani ,  Yuji Masuda

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4214 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/4228 ,  G02B6/423 ,  G02B6/4245 ,  G02B6/43

摘要： An optical transmission body includes a substrate having a through hole penetrating therethrough in a thickness direction thereof; a cladding member at least a part of which is positioned to be filled in the through hole, and which has an optical waveguide hole which is positioned inside the through hole and penetrates through the cladding member in a thickness direction thereof and a guide hole portion which is positioned away from the optical waveguide hole and is concave in the thickness direction; and a core member disposed inside the optical waveguide hole.

摘要翻译： 光传输体包括：基板，具有贯通其贯穿其厚度方向的通孔; 至少一部分被填充在所述通孔中的包层部件，并且具有位于所述贯通孔的内侧并沿其厚度方向贯通所述包层部件的光波导孔，以及导孔部， 被定位成远离光波导孔，并且在厚度方向上是凹的; 以及设置在光波导孔内的芯体。

公开(公告)号：US20130188908A1

公开(公告)日：2013-07-25

申请号：US13819943

申请日：2011-08-31

申请人： Maraki Maetani ,  Yuji Masuda

发明人： Maraki Maetani ,  Yuji Masuda

IPC分类号： G02B6/032 ,  G02B6/12

CPC分类号： G02B6/4214 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/4228 ,  G02B6/423 ,  G02B6/4245 ,  G02B6/43

摘要： An optical transmission body includes a substrate having a through hole penetrating therethrough in a thickness direction thereof; a cladding member at least a part of which is positioned to be filled in the through hole, and which has an optical waveguide hole which is positioned inside the through hole and penetrates through the cladding member in a thickness direction thereof and a guide hole portion which is positioned away from the optical waveguide hole and is concave in the thickness direction; and a core member disposed inside the optical waveguide hole.

摘要翻译： 光传输体包括：基板，具有贯通其贯穿其厚度方向的通孔; 至少一部分被填充在所述通孔中的包层部件，并且具有位于所述贯通孔的内侧并沿其厚度方向贯通所述包层部件的光波导孔，以及导孔部， 被定位成远离光波导孔，并且在厚度方向上是凹的; 以及设置在光波导孔内的芯体。

公开(公告)号：US20120014641A1

公开(公告)日：2012-01-19

申请号：US13259460

申请日：2010-03-30

申请人： Maraki Maetani ,  Masahiko Hirose

发明人： Maraki Maetani ,  Masahiko Hirose

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01S5/02292 ,  H01S5/183 ,  H05K1/0245 ,  H05K1/0274 ,  H05K3/4644 ,  H05K2201/09672 ,  H05K2201/09972

摘要： The invention relates to an optical-electrical wiring board (2) and an optical module (1). The optical-electrical wiring board (2) includes a substrate (8), a dielectric layer (11), first conductive layers (16a) and second conductive layers (16b). The dielectric layer (11) includes a first region (B) and a second region (C). The first region (B) constitutes a plurality of light transmission portions (11B). The second region (C) has a plurality of pairs of conductive layers each having an overlap portion (10) in which one of the plurality of second conductive layers (16b) and one of the plurality of first conductive layers (16a) overlap each other when seen through in a laminated direction (a) of the dielectric layer (11) and the substrate (8).

摘要翻译： 本发明涉及光电布线板（2）和光模块（1）。 光电布线板（2）包括基板（8），电介质层（11），第一导电层（16a）和第二导电层（16b）。 电介质层（11）包括第一区域（B）和第二区域（C）。 第一区域（B）构成多个光透射部分（11B）。 第二区域（C）具有多个导电层，每对导电层具有重叠部分（10），多个第二导电层（16b）中的一个与多个第一导电层（16a）中的一个彼此重叠 当通过介电层（11）和基板（8）的层叠方向（a）观察时。

公开(公告)号：US08989531B2

公开(公告)日：2015-03-24

申请号：US13259460

申请日：2010-03-30

申请人： Maraki Maetani ,  Masahiko Hirose

发明人： Maraki Maetani ,  Masahiko Hirose

IPC分类号： G02B6/12 ,  G02B6/43 ,  H01S5/022 ,  H01S5/183 ,  H05K1/02 ,  H05K3/46

CPC分类号： G02B6/43 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01S5/02292 ,  H01S5/183 ,  H05K1/0245 ,  H05K1/0274 ,  H05K3/4644 ,  H05K2201/09672 ,  H05K2201/09972

摘要： The invention relates to an optical-electrical wiring board (2) and an optical module (1). The optical-electrical wiring board (2) includes a substrate (8), a dielectric layer (11), first conductive layers (16a) and second conductive layers (16b). The dielectric layer (11) includes a first region (B) and a second region (C). The first region (B) constitutes a plurality of light transmission portions (11B). The second region (C) has a plurality of pairs of conductive layers each having an overlap portion (10) in which one of the plurality of second conductive layers (16b) and one of the plurality of first conductive layers (16a) overlap each other when seen through in a laminated direction (a) of the dielectric layer (11) and the substrate (8).

摘要翻译： 本发明涉及光电布线板（2）和光模块（1）。 光电布线板（2）包括基板（8），电介质层（11），第一导电层（16a）和第二导电层（16b）。 电介质层（11）包括第一区域（B）和第二区域（C）。 第一区域（B）构成多个光透射部分（11B）。 第二区域（C）具有多个导电层，每对导电层具有重叠部分（10），多个第二导电层（16b）中的一个与多个第一导电层（16a）中的一个彼此重叠 当通过介电层（11）和基板（8）的层叠方向（a）观察时。

公开(公告)号：US08013427B2

公开(公告)日：2011-09-06

申请号：US12548371

申请日：2009-08-26

申请人： Maraki Maetani

发明人： Maraki Maetani

IPC分类号： H01L23/58 ,  H05K1/11

CPC分类号： H05K1/0245 ,  H01L2924/0002 ,  H05K1/0251 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09636 ,  H05K2201/09672 ,  H01L2924/00

摘要： A wiring board equipped with differential lines which compensate for differences in via lengths to minimize signal deterioration is disclosed. Two conductors are couple to different substrate levels through vias of different lengths. Compensation means are provided to correct for the phase difference caused by the different lengths.

摘要翻译： 公开了配备有差分线路的布线板，其补偿通路长度的差异以最小化信号劣化。 两个导体通过不同长度的通孔耦合到不同的衬底层。 提供补偿装置来校正由不同长度引起的相位差。

公开(公告)号：US06566601B2

公开(公告)日：2003-05-20

申请号：US10107540

申请日：2002-03-26

申请人： Maraki Maetani

发明人： Maraki Maetani

IPC分类号： H01L2302

CPC分类号： H01L23/49838 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6622 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/0715 ,  H05K2201/09809 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： The invention is directed to a high frequency semiconductor device housing package comprising: an insulating substrate having on its top surface a high frequency semiconductor device mounting and housing portion; a plurality of wiring conductors delivered from the mounting and housing portion through the under surface of the insulating substrate, to which an electrode of the high frequency semiconductor device is electrically connected; and a plurality of ball-shaped signal terminals and ball-shaped grounding terminals arranged on the under surface of the insulating substrate and electrically connected to the wiring conductor, the ball-shaped grounding terminals being arranged substantially circularly so as to surround the centered ball-shaped signal terminal. This construction achieves efficient transmission of high-frequency signals because of its excellent high frequency characteristics in the ball-shaped terminals. It also excels in easiness of mass production and mounting accuracy.

公开(公告)号：US06538316B2

公开(公告)日：2003-03-25

申请号：US10108922

申请日：2002-03-27

申请人： Maraki Maetani

发明人： Maraki Maetani

IPC分类号： H01L23053

CPC分类号： H01L23/66 ,  H01L23/49816 ,  H01L2223/6616 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K3/3436

摘要： A high frequency semiconductor device housing package comprises a dielectric substrate, an internal signal wiring conductor, an interlayer grounding conductor layer, a signal wiring conductor, a ball-shaped signal terminal mounting pad, and a grounding conductor layer. In the interlayer grounding conductor layer opposed to the signal wiring conductor is provided a conductive layer non-forming portion so as to be located in a region directly above the ball-shaped signal terminal mounting pad. An effective distance from the ball-shaped signal terminal mounting pad to the interlayer grounding conductor layer is made greater than an effective distance from the ball-shaped signal terminal mounting pad to the grounding conductor layer. With this configuration, the parasitic capacitance at the pad is reduced and a high frequency signal is efficiently transmitted.

公开(公告)号：US08811782B2

公开(公告)日：2014-08-19

申请号：US13819485

申请日：2011-08-31

申请人： Maraki Maetani

发明人： Maraki Maetani

IPC分类号： G02B6/43

CPC分类号： G02B6/12 ,  G02B6/12002 ,  G02B6/43

摘要： An optical transmission board includes a substrate being provided with a through hole formed in a thickness direction of the substrate so as to penetrate from top to bottom of the substrate; a cladding member at least part of which locates inside the through hole, having an optical waveguide hole being inside the through hole and penetrating the cladding member in the thickness direction thereof, and having an upper surface having a surface roughness smaller than that of an upper surface of the substrate; a core member disposed inside the optical waveguide hole; an electrically conductive body disposed on the upper surface of the cladding member; and an optical element electrically connected to the electrically conductive body, having a light-receiving surface or a light-emitting surface opposed to an upper surface of the core member.

摘要翻译： 光传输板包括：衬底，其具有沿衬底的厚度方向形成的通孔，以从衬底的顶部到底部穿透; 至少一部分位于贯通孔内的包层部件，具有位于通孔的内侧的光波导孔，并且在其厚度方向上贯通包层部件，并且具有比上部的表面粗糙度小的上表面 基材表面; 设置在所述光波导孔内的芯体; 设置在所述包层部件的上表面的导电体; 以及与导电体电连接的光学元件，具有与芯体的上表面相对的受光面或发光面。