摘要:
The invention discloses an integrated circuit (10) for securely storing a codeword. The value of the codeword is dependent on the mobility (μA, μB, μC) of at least one transistor (TRA, TRB, TRC) of the integrated circuit. The invention further discloses a reader means (15), a method for determining the value of the codeword from the integrated circuit (10), and a method for altering the value of the codeword.
摘要:
The invention discloses an integrated circuit (10) for securely storing a codeword. The value of the codeword is dependent on the mobility (μA, μB, μC) of at least one transistor (TRA, TRB, TRC) of the integrated circuit. The invention further discloses a reader means (15), a method for determining the value of the codeword from the integrated circuit (10), and a method for altering the value of the codeword.
摘要:
A flash analog-to-digital converter comprises a resistive string powered by a reference voltage source for providing a set of equidistant reference voltages and a set of comparators for comparing the analog input signal with the reference voltages. A set of switches are arranged and controlled to perform an algorithm for mitigating the influence of mismatches between the components. The switches are arranged between the reference voltage source and the resistive string so that switches in the reference inputs to the comparators are avoided. The resistive string is preferably circular. The converter can handle differential signals.
摘要:
Apparatus and method for IR-drop and supply noise measurements in electronic circuits. A first voltage at a point of interest in the circuit is sampled and stored during a quiescent mode of the circuit the voltage is to be measured in. Subsequently, the circuit is brought in an operating mode and a second voltage is sampled and held at the same point of interest. The first and the second voltage are compared and a corresponding voltage signal is passed to a system output.
摘要:
The present invention relates to a detection circuitry for detecting bonding conditions on segmented bond pads of a semiconductor device, the bonding conditions representing good or bad contacts on the bond pads. The detection circuitry comprises a segmented bond pad (1, 11) having at least two parts (2, 3, 12, 13) being electrically separated from each other, and a supplying unit (S1, S2, R1, R2) being adapted for supplying predetermined signals to at least one of the at least two parts of the segmented bond pad. Furthermore, a detector (4, 14) is provided for receiving from at least one of the at least two parts of the segmented bond pad sensing signals derived from said predetermined signals, and for determining the bonding conditions based on said received sensing signals indicative of a good or bad bonding contact on the segmented bond pad.
摘要:
An integrated circuit comprises a plurality of sensing circuits (12), each for detecting whether a respective physical operating parameter is above or below a respective reference value. The integrated circuit contains a serial shift register (11) for shifting digital data signals that represent the respective reference values from a successive approximation update circuit (14) to the sensing circuits (12) and back to the successive approximation update circuit (14). Detection results of the sensing circuits (12) are shifted to the successive approximation update circuit (14) with the digital data signals. The successive approximation update circuit (14) is used to form the digital data so that the reference values form successive approximations of the physical operating parameter values during an analog to digital conversion process. In this way the successive approximation update circuit (14) is shared by a plurality of sensing circuits (12).
摘要:
The invention relates to a semiconductor device comprising a test structure (100) for detecting variations in the structure of the semiconductor device, the test structure (100) comprising a first supply rail (110), a second supply rail (120), a ring oscillator (130) coupled between the first supply rail (110) and second supply rail (120), the ring oscillator (130) having an output (132) for providing a test result signal, and an array (140) of individually controllable transistors (142) coupled in parallel between the first supply rail (110) and the ring oscillator (130). Variations in the current output of the respective transistors (142) in the array (140) lead to variations in the respective output frequencies of the ring oscillator (130). This gives a qualitative indication of the aforementioned structural variations. More accurate results can be obtained by inclusion of a reference current source (160) for calibrating the ring oscillator (130) prior to the measurement of the current output of the individual transistors (142).
摘要:
The present invention relates to a on-chip circuit for on silicon interconnect capacitance (Cx) extraction that is self compensated for process variations in the integrated transistors. The circuit (10) comprises signal generation means (20) for generating a periodical pulse signal connected to first and to second signal delaying means (31, 32) for respective delaying said pulse signal, wherein said second signal delaying means (32) are configured to have a delay affected by said interconnect capacitance (Cx); a logical XOR gate (35) for connecting respective first and said second delay signals of said respective first and second delay means (31, 32), said logical XOR gate (35) being connected to signal integrating means (40); and said signal integrating means (40) being connected to analog to digital converting means (50). Whilst the error in conventional uncompensated systems, like delay line only, the error can be up to 30%, in the circuit according to the invention, the error due to process variations in the front-end is about 2%. Further, an output is provided in a digital format and thus, can be measured quickly with simple external hardware. Furthermore, the pulse signal frequency can be used as a monitor to measure process variations in the front-end. Moreover, since the circuit (10) is remarkably accurate and very easy to measure, it is the best choice as a process monitor for every chip fabricated in the future.
摘要:
Apparatus and method for IR-drop and supply noise measurements electronic circuits. A first voltage at a point of interest in the circuit is sampled and stored during a quiescent mode of the circuit the voltage is to be measured in. Subsequently, the circuit is brought in an operating mode and a second voltage is sampled and held at the same point of interest. The first and the second voltage are compared and a corresponding voltage signal is passed to a system output.
摘要:
An integrated circuit comprises a plurality of sensing circuits (12), each for detecting whether a respective physical operating parameter is above or below a respective reference value. The integrated circuit contains a serial shift register (11) for shifting digital data signals that represent the respective reference values from a successive approximation update circuit (14) to the sensing circuits (12) and back to the successive approximation update circuit (14). Detection results of the sensing circuits (12) are shifted to the successive approximation update circuit (14) with the digital data signals. The successive approximation update circuit (14) is used to form the digital data so that the reference values form successive approximations of the physical operating parameter values during an analog to digital conversion process. In this way the successive approximation update circuit (14) is shared by a plurality of sensing circuits (12).