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14 条记录 (耗时 0.029 秒)

    Sensor module
    3.
    发明授权
    Sensor module 有权
    传感器模块

    公开(公告)号：US07323766B2

    公开(公告)日：2008-01-29

    申请号：US10982982

    申请日：2004-11-04

    申请人： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

    发明人： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

    IPC分类号： H01L23/495

    CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P1/023 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/3025 ,  H01R13/6594 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

    摘要翻译： 传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器 系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。 由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。 当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。 传感器模块可以被模制或者可以具有预成型的壳体。 盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。

    Housing for a semiconductor component
    5.
    发明授权
    Housing for a semiconductor component 有权
    半导体元件的外壳

    公开(公告)号：US08063479B2

    公开(公告)日：2011-11-22

    申请号：US12460567

    申请日：2009-07-20

    申请人： Thorsten Wallisch ,  Christian Solf ,  Florian Grabmaier

    发明人： Thorsten Wallisch ,  Christian Solf ,  Florian Grabmaier

    IPC分类号： H01L23/48 ,  H01L23/495

    CPC分类号： H01L23/49551 ,  B81B7/0077 ,  G01P1/023 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

    摘要翻译： 一种用于半导体部件的壳体，其中壳体具有设置在壳体的边缘处的距离的多个销，每个销具有宽度，厚度和长度。 为了形成其特征频率在壳体的特征频率不利地影响半导体部件的范围之外的半导体部件的壳体，至少一个距离在1.24mm至1.30mm的范围之外，在 宽度中的至少一个宽度在0.33mm至0.51mm的范围之外，至少一个厚度在0.23至0.32mm的范围之外，或者至少一个长度在2.05至4.12mm的范围之外。

    Chip Housing Having Reduced Induced Vibration
    8.
    发明申请
    Chip Housing Having Reduced Induced Vibration 有权
    降低感应振动的芯片外壳

    公开(公告)号：US20090194860A1

    公开(公告)日：2009-08-06

    申请号：US12226999

    申请日：2007-03-21

    申请人： Martin Holzmann ,  Frieder Haag ,  Michael Knauss ,  Florian Grabmaier

    发明人： Martin Holzmann ,  Frieder Haag ,  Michael Knauss ,  Florian Grabmaier

    IPC分类号： H01L23/12

    CPC分类号： B81B7/0058 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/053

    摘要： A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

    摘要翻译： 用于容纳芯片结构的预制外壳包括壳体的第一部分，其连接到芯片结构，并且以可弹性偏转的方式连接到紧固到支撑整个壳体的支撑结构的外壳的附加部分。 提供了一种用于阻尼壳体的连接到芯片结构的第一部分的偏转的机构。