Copper alloy and method of manufacturing the same
    1.
    发明授权
    Copper alloy and method of manufacturing the same 有权
    铜合金及其制造方法

    公开(公告)号:US07485200B2

    公开(公告)日:2009-02-03

    申请号:US11827860

    申请日:2007-07-12

    IPC分类号: C22F1/08

    CPC分类号: C22C9/00 C22F1/08

    摘要: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.

    摘要翻译: 该铜合金至少含有不小于0.005重量%且不大于0.5重量%的锆,包括包含晶粒尺寸不大于1.5μm的晶粒的第一晶粒组,第二晶粒组包括 具有大于1.5μm和小于7μm的粒度的晶粒,具有沿一个方向延伸的形状的晶粒和包括具有不小于7μm的晶粒的晶粒的第三晶粒组,以及总和 α和β大于γ,α小于β,其中α是第一颗粒组的总面积比,β是第二颗粒组的总面积比,γ是总面积比 基于单位面积的第三颗粒组,α+β+γ= 1。

    Copper alloy and method of manufacturing the same

    公开(公告)号:US20080041507A1

    公开(公告)日:2008-02-21

    申请号:US11827860

    申请日:2007-07-12

    IPC分类号: C22F1/08

    CPC分类号: C22C9/00 C22F1/08

    摘要: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.

    Copper alloy and method of manufacturing the same
    3.
    发明申请
    Copper alloy and method of manufacturing the same 有权
    铜合金及其制造方法

    公开(公告)号:US20050230014A1

    公开(公告)日:2005-10-20

    申请号:US10949097

    申请日:2004-09-23

    CPC分类号: C22C9/00 C22F1/08

    摘要: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.

    摘要翻译: 该铜合金至少含有不小于0.005重量%且不大于0.5重量%的锆,包括包含晶粒尺寸不大于1.5μm的晶粒的第一晶粒组,第二晶粒组包括 具有大于1.5μm和小于7μm的粒度的晶粒,具有沿一个方向延伸的形状的晶粒和包括具有不小于7μm的晶粒的晶粒的第三晶粒组,以及总和 α和β大于γ,α小于β,其中α是第一颗粒组的总面积比,β是第二颗粒组的总面积比,γ是总面积比 基于单位面积的第三颗粒组,α+β+γ= 1。

    Copper alloy and method of manufacturing the same
    4.
    发明授权
    Copper alloy and method of manufacturing the same 有权
    铜合金及其制造方法

    公开(公告)号:US07338631B2

    公开(公告)日:2008-03-04

    申请号:US10949097

    申请日:2004-09-23

    IPC分类号: C22C9/00

    CPC分类号: C22C9/00 C22F1/08

    摘要: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.

    摘要翻译: 该铜合金至少含有不小于0.005重量%且不大于0.5重量%的锆,包括包含晶粒尺寸不大于1.5μm的晶粒的第一晶粒组,第二晶粒组包括 具有大于1.5μm和小于7μm的粒度的晶粒,具有沿一个方向延伸的形状的晶粒和包括具有不小于7μm的晶粒的晶粒的第三晶粒组,以及总和 α和β大于γ,α小于β,其中α是第一颗粒组的总面积比,β是第二颗粒组的总面积比,γ是总面积比 基于单位面积的第三颗粒组,α+β+γ= 1。

    Plated material and method of manufacturing the same, terminal member for connector, and connector
    6.
    发明授权
    Plated material and method of manufacturing the same, terminal member for connector, and connector 有权
    电镀材料及其制造方法,连接器端子构件和连接器

    公开(公告)号:US07029760B2

    公开(公告)日:2006-04-18

    申请号:US10617125

    申请日:2003-07-10

    摘要: A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 μm.

    摘要翻译: 电镀材料在连接器中使用时可减少插拔力。 还提供了用于连接器的端子构件和连接器。 电镀材料包括由Cu或Cu合金制成的基板3和形成在基板3的表面上的金属镀层6。 由软区域6A的网络包围的网状形状的软区域6A和硬区域6B共存在金属镀层6中。 软区域6A具有20至250的维氏硬度,而硬区域6B具有60至700的维氏硬度,其比软区域6A的维氏硬度高至少30度。网络的平均尺寸 的软区域6A为5〜500μm。

    SiC single crystal and production method thereof

    公开(公告)号:US09856582B2

    公开(公告)日:2018-01-02

    申请号:US13428395

    申请日:2012-03-23

    IPC分类号: C30B17/00 C30B29/36 C30B9/10

    CPC分类号: C30B29/36 C30B9/10 C30B17/00

    摘要: A method is disclosed with provides stable growth of SiC single crystals, particularly 4H—SiC single crystals, with an effective crystal growth rate for a prolonged time even at a low temperature range of 2000° C. or lower. A raw material containing Si, Ti and Ni is charged into a crucible made of graphite and heat-melted to obtain a solvent. At the same time, C is dissolved out from the crucible into the solvent to obtain a melt. A SiC seed crystal substrate is then brought into contact with the melt such that SiC is supersaturated in the melt in the vicinity of the surface of the SiC seed crystal substrate, thereby allowing growth and production of an SiC single crystal on the SiC seed crystal substrate.

    Apparatus for continuous electrolytic treatment of steel sheet and method for producing surface-treated steel sheet using the same
    9.
    发明授权
    Apparatus for continuous electrolytic treatment of steel sheet and method for producing surface-treated steel sheet using the same 有权
    钢板的连续电解处理装置及使用该钢板的表面处理钢板的制造方法

    公开(公告)号:US09580816B2

    公开(公告)日:2017-02-28

    申请号:US13819500

    申请日:2011-09-14

    摘要: Provided are an apparatus for continuous electrolytic treatment of a steel sheet that is suitable for producing a surface-treated steel sheet and a method for producing the surface-treated steel sheet using the apparatus for continuous electrolytic treatment of a steel sheet. The apparatus includes N pairs of tabular electrodes having a length L and being arranged to respectively face two surfaces of a steel sheet. Each electrode includes n sections arranged in the longitudinal direction of the electrode and disposed on the surface of the electrode facing the steel sheet surface. Each section is constituted by a conductive portion including an electrode portion having a length T1 and a nonconductive portion made by making an electrode portion having a length T2 nonconductive, where n×N≧10, 0.96≧T2/(T1+T2)≧0.05, and 0.9≧T1/L≧0.1.

    摘要翻译: 提供一种适用于生产表面处理钢板的钢板的连续电解处理装置以及使用钢板的连续电解处理装置的表面处理钢板的制造方法。 该装置包括N对长度为L的平板状电极,并分别面对钢板的两个表面。 每个电极包括沿着电极的纵向布置的n个部分,并且设置在面对钢板表面的电极的表面上。 每个部分由包括具有长度T1的电极部分和通过制造具有长度T2不导电的电极部分制成的非导电部分的导电部分构成,其中n×N≥10,0.96≥T2/(T1 + T2)≥0.05 ,0.9≥T1/L≥0.1。