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1.发明授权3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules 失效3D电路模块，由其形成的多层3D电路模块，使用电路模块的移动终端装置和用于制造电路模块的方法公开(公告)号：US07759784B2
公开(公告)日：2010-07-20
申请号：US11196269
申请日：2005-08-04
IPC分类号： H01L23/02
CPC分类号： H05K1/183 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1064 , H01L2924/1627 , H01L2924/3511 , H05K2201/0382 , H05K2201/10674 , H05K2201/2018 , H05K2203/0278
摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。
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2.发明申请3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules 失效3D电路模块，由其形成的多层3D电路模块，使用电路模块的移动终端装置和用于制造电路模块的方法公开(公告)号：US20060038274A1
公开(公告)日：2006-02-23
申请号：US11196269
申请日：2005-08-04
IPC分类号： H01L23/02
CPC分类号： H05K1/183 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1064 , H01L2924/1627 , H01L2924/3511 , H05K2201/0382 , H05K2201/10674 , H05K2201/2018 , H05K2203/0278
摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。
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3.发明申请公开(公告)号：US20050260867A1
公开(公告)日：2005-11-24
申请号：US11118403
申请日：2005-05-02
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
CPC分类号： H05K1/144 , H01L2224/16225 , H01L2924/19105 , H01R12/52 , H05K3/3426 , H05K2201/042 , H05K2201/10189 , H05K2201/10424 , H05K2201/2018
摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.
摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。
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4.发明授权公开(公告)号：US07090502B2
公开(公告)日：2006-08-15
申请号：US11118403
申请日：2005-05-02
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
CPC分类号： H05K1/144 , H01L2224/16225 , H01L2924/19105 , H01R12/52 , H05K3/3426 , H05K2201/042 , H05K2201/10189 , H05K2201/10424 , H05K2201/2018
摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.
摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。
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5.发明申请Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效立体电子电路装置，其中使用的继电器板和继电器框架公开(公告)号：US20050168961A1
公开(公告)日：2005-08-04
申请号：US10985325
申请日：2004-11-10
IPC分类号： H01L23/538 , H01L25/065 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K3/40 , H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。
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6.发明授权Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效立体电子电路装置，其中使用的继电器板和继电器框架公开(公告)号：US07613010B2
公开(公告)日：2009-11-03
申请号：US10985325
申请日：2004-11-10
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。
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公开(公告)号：US20080102701A1
公开(公告)日：2008-05-01
申请号：US11719035
申请日：2005-11-22
申请人： Hiroyuki Suzuki , Kiyoshi Nakanishi , Ken Muramatsu , Tooru Saitou , Noriaki Amano , Masahiro Ono , Shigeru Kondou
发明人： Hiroyuki Suzuki , Kiyoshi Nakanishi , Ken Muramatsu , Tooru Saitou , Noriaki Amano , Masahiro Ono , Shigeru Kondou
IPC分类号： H01R13/648 , H05K1/11
CPC分类号： H01R13/658 , H01L23/552 , H01L2924/0002 , H01L2924/16195 , H01R12/52 , H01L2924/00
摘要： A first printed board on which a ground pattern is provided and an electronic part is mounted and a second printed board on which a ground pattern is provided and an electronic part is mounted are oppositely arranged, and circuits of the first printed board and the second printed board are connected by a connector with a frame-like shield. In the connector with a shield, a frame body is formed of an insulator such as a resin, a connection terminal is provided inside the frame body, and a conductor is provided on the entire outer periphery of the frame body. In the conductor, the shield is formed by both the ground pattern of the first printed board and the ground pattern of the second printed board. The frame body shields the electronic parts.
摘要翻译： 设有接地图案的第一印刷电路板和安装有电子部件的第一印刷电路板和设置有接地图案并且安装有电子部件的第二印刷电路板相对布置，并且第一印刷电路板和第二印刷电路 板由具有框架状屏蔽的连接器连接。 在具有屏蔽的连接器中，框架体由诸如树脂的绝缘体形成，在框体内部设置有连接端子，并且在框体的整个外周设有导体。 在导体中，屏蔽由第一印刷电路板的接地图案和第二印刷电路板的接地图案形成。 框架体屏蔽电子部件。
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8.发明授权Electronic circuit device, electronic device using the same, and method for manufacturing the same 有权电子电路装置，使用该电子装置的电子装置及其制造方法公开(公告)号：US07768795B2
公开(公告)日：2010-08-03
申请号：US11660515
申请日：2005-08-31
IPC分类号： H01R12/16
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译： 电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制 电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。 该电子电路装置（100）分配母基板。 此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。
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9.发明申请Electronic Circuit Device, Electronic Device Using the Same, and Method for Manufacturing the Same 有权电子电路装置，使用其的电子装置及其制造方法公开(公告)号：US20080094793A1
公开(公告)日：2008-04-24
申请号：US11660515
申请日：2005-08-31
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译： 电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制 电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。 该电子电路装置（100）分配母基板。 此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。
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公开(公告)号：US09072204B2
公开(公告)日：2015-06-30
申请号：US13384502
申请日：2010-07-15
CPC分类号： H05K3/284 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2924/01019 , H01L2924/3025 , H01L2924/3511 , H05K1/0218 , H05K1/0313 , H05K2203/1316
摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.
摘要翻译： 电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。 电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。 屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度 。 模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。
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