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1.发明授权公开(公告)号：US07090502B2
公开(公告)日：2006-08-15
申请号：US11118403
申请日：2005-05-02
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
CPC分类号： H05K1/144 , H01L2224/16225 , H01L2924/19105 , H01R12/52 , H05K3/3426 , H05K2201/042 , H05K2201/10189 , H05K2201/10424 , H05K2201/2018
摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.
摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。
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2.发明授权3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules 失效3D电路模块，由其形成的多层3D电路模块，使用电路模块的移动终端装置和用于制造电路模块的方法公开(公告)号：US07759784B2
公开(公告)日：2010-07-20
申请号：US11196269
申请日：2005-08-04
IPC分类号： H01L23/02
CPC分类号： H05K1/183 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1064 , H01L2924/1627 , H01L2924/3511 , H05K2201/0382 , H05K2201/10674 , H05K2201/2018 , H05K2203/0278
摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。
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3.发明申请3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules 失效3D电路模块，由其形成的多层3D电路模块，使用电路模块的移动终端装置和用于制造电路模块的方法公开(公告)号：US20060038274A1
公开(公告)日：2006-02-23
申请号：US11196269
申请日：2005-08-04
IPC分类号： H01L23/02
CPC分类号： H05K1/183 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1064 , H01L2924/1627 , H01L2924/3511 , H05K2201/0382 , H05K2201/10674 , H05K2201/2018 , H05K2203/0278
摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。
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4.发明申请公开(公告)号：US20050260867A1
公开(公告)日：2005-11-24
申请号：US11118403
申请日：2005-05-02
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
CPC分类号： H05K1/144 , H01L2224/16225 , H01L2924/19105 , H01R12/52 , H05K3/3426 , H05K2201/042 , H05K2201/10189 , H05K2201/10424 , H05K2201/2018
摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.
摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。
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5.发明申请STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN 审中-公开立体电子电路设备及其继电器和继电器框架公开(公告)号：US20100008056A1
公开(公告)日：2010-01-14
申请号：US12562444
申请日：2009-09-18
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。
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6.发明申请Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效立体电子电路装置，其中使用的继电器板和继电器框架公开(公告)号：US20050168961A1
公开(公告)日：2005-08-04
申请号：US10985325
申请日：2004-11-10
IPC分类号： H01L23/538 , H01L25/065 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K3/40 , H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。
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7.发明授权Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效立体电子电路装置，其中使用的继电器板和继电器框架公开(公告)号：US07613010B2
公开(公告)日：2009-11-03
申请号：US10985325
申请日：2004-11-10
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。
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8.发明申请Electronic circuit device, and method and apparatus for manufacturing the same 审中-公开电子电路装置及其制造方法和装置公开(公告)号：US20050093172A1
公开(公告)日：2005-05-05
申请号：US10959324
申请日：2004-10-07
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/31 , H01L23/498 , H05K3/28 , H01L21/48 , H01L23/52
CPC分类号： G06K19/07718 , G06K19/07728 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/81 , H01L2224/1134 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/83192 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H05K3/281 , H05K3/284 , H01L2924/00
摘要： An electronic circuit device has a substrate having a wiring pattern, an electronic component electrically connected to a terminal section of the wiring pattern by contacting a projection electrode with it, a cover that is disposed at a position facing the substrate and grapples the electronic component between it and the substrate, and a resin layer made of thermoplastic resin filled in a gap between the substrate and the cover. The gap includes a space in a connection region except an electric connection part between the projection electrode and the terminal section. The electronic component is adhered to the substrate and the substrate is adhered to the cover through the resin layer. Thus, the electronic circuit device having high connection reliability and high mass productivity, and a method and apparatus for manufacturing the electronic circuit device can be provided.
摘要翻译： 电子电路器件具有布线图案的基板，通过与突起电极接触而与布线图案的端子部分电连接的电子部件，设置在面向基板的位置并且将电子部件与第二电路部件之间抓握的盖 以及填充在基板和盖之间的间隙中的由热塑性树脂制成的树脂层。 间隙包括除了突起电极和端子部之间的电连接部分以外的连接区域中的空间。 电子部件粘附到基板上，并且基板通过树脂层粘附到盖上。 因此，可以提供具有高连接可靠性和高质量生产率的电子电路装置，以及用于制造电子电路装置的方法和装置。
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公开(公告)号：US07771561B2
公开(公告)日：2010-08-10
申请号：US11598067
申请日：2006-11-13
申请人： Naoki Suzuki , Kazuto Nishida , Kazuyuki Tomita
发明人： Naoki Suzuki , Kazuto Nishida , Kazuyuki Tomita
CPC分类号： H05K3/26 , H01J37/32009 , H01J37/32935 , H01J37/3299 , H05K3/323 , H05K2203/095
摘要： An apparatus and a method for surface treatment of substrates whereby the quality of substrates can be maintained by preventing excessive plasma treatment of substrates. In carrying out the plasma treatment on a surface of the substrate in a reaction chamber, there are provided an emission spectroscopic analysis device or a mass analyzer, and a controller, so that the energy of ions in plasma is controlled to decrease when, e.g., bromine included in the substrate is detected, and the surface treatment to the substrate is controlled to stop when the removal of impurities of the substrate is detected to end. The bromine once separated from the substrate is prevented from adhering again to the substrate and corroding the substrate. Moreover, ions are prevented from being excessively irradiated to the substrate when the removal of impurities ends, thereby reducing damage to the substrate.
摘要翻译： 用于表面处理基板的装置和方法，由此通过防止基板的过度等离子体处理可以保持基板的质量。 在反应室中对基板的表面进行等离子体处理时，设置有发光光谱分析装置或质量分析装置以及控制器，使得等离子体中的离子的能量被控制为减少，例如， 检测包含在基板中的溴，并且当检测到去除基板的杂质结束时，控制对基板的表面处理以停止。 与基板分离的溴被防止再次粘附到基板上并腐蚀基板。 此外，当去除杂质结束时，防止离子过度照射到基板，从而减少对基板的损坏。
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公开(公告)号：US07683482B2
公开(公告)日：2010-03-23
申请号：US11527461
申请日：2006-09-27
CPC分类号： H01L24/27 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/31 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05568 , H01L2224/05571 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13023 , H01L2224/13099 , H01L2224/13118 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/45 , H01L2224/45118 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48624 , H01L2224/48824 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81191 , H01L2224/81801 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/83856 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。
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