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    Optical apparatus and optical module using the same
    1.
    发明授权
    Optical apparatus and optical module using the same 有权
    光学装置和使用其的光学模块

    公开(公告)号：US07582944B2

    公开(公告)日：2009-09-01

    申请号：US11698100

    申请日：2007-01-26

    申请人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

    发明人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

    IPC分类号： H01L31/0232

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00014

    摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

    摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光​​学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。

    Optic device
    3.
    发明申请
    Optic device 有权
    光学器件

    公开(公告)号：US20060083459A1

    公开(公告)日：2006-04-20

    申请号：US11152253

    申请日：2005-06-15

    申请人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

    发明人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

    IPC分类号： G02B6/12

    CPC分类号： H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49433 ,  H01L2924/00014

    摘要： An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the optic device, wherein a pair of positioning pins are provided at the bottom of the cylinder mirror. First positioning holes for defining a mounting position of the cylinder mirror to the base and second positioning holes having a smaller diameter than that of the first positioning holes for defining a mounting position of the optical chip to the base are formed in the base of the optic device.

    摘要翻译： 光学装置包括基座，安装在基座上的光学芯片和透明板。 其中结合有成像光学系统的圆柱镜装配在光学装置的基座上，其中一对定位销设置在气缸镜的底部。 用于将气缸镜的安装位置定义到基座的第一定位孔和具有比用于将光学芯片安装到基座的安装位置的第一定位孔的直径小的第二定位孔形成在光学器件的基座中 设备。

    Solid-state imaging device and method for manufacturing the same
    4.
    发明授权
    Solid-state imaging device and method for manufacturing the same 失效
    固态成像装置及其制造方法

    公开(公告)号：US06897428B2

    公开(公告)日：2005-05-24

    申请号：US10877927

    申请日：2004-06-25

    申请人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

    发明人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

    IPC分类号： H01L27/14 ,  H01L23/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08 ,  H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H04N3/14 ,  H04N5/335

    CPC分类号： H01L27/14601 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A solid-state imaging device includes: a housing having a base and a rectangular-frame-shaped rib that are resin molded integrally; metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space, an external terminal portion exposed on a bottom face, and a side electrode portion exposed on an external side face; an imaging element fixed on the base; connection members connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion. In the resin molding, the internal terminal portion is pressed against the upper mold, whereby the occurrence of resin burrs is suppressed.

    摘要翻译： 固态成像装置包括：壳体，其具有基部和矩形框状的肋，其一体地树脂模制; 嵌入壳体中的金属引线片，其中每个具有面向内部空间的内部端子部分，暴露在底面上的外部端子部分和暴露在外侧面上的侧面电极部分; 固定在基座上的成像元件; 连接构件分别连接成像元件的电极和金属引线片的内部端子部分; 以及固定在肋的上端面上的透明板。 每个金属引线片在其内部端子部分的位置处的厚度基本上等于基部的厚度，并且外部端子部分在与内部端子部分对应的位置处形成有金属引线片的反面 。 在树脂成型中，将内部端子部压在上模上，抑制树脂毛刺的发生。

    Optical semiconductor device
    6.
    发明授权
    Optical semiconductor device 有权
    光半导体器件

    公开(公告)号：US07928547B2

    公开(公告)日：2011-04-19

    申请号：US12244324

    申请日：2008-10-02

    申请人： Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio

    发明人： Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio

    IPC分类号： H01L23/02

    CPC分类号： H01L31/0203 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

    摘要翻译： 光学半导体器件包括：具有底部和侧壁部分的封装; 半导体芯片，其具有在其一个表面上形成并且具有与固定到封装的底部的一个表面相对的表面的光学元件; 固定到所述半导体芯片以便覆盖所述光学元件的透明构件; 以及填充封装和半导体芯片之间的空间的密封树脂。 侧壁部分的上部具有向包装内部突出的突出部分。 透明构件从由突出部形成的窗口部露出。

    Semiconductor device and electronic apparatus using the same
    7.
    发明授权
    Semiconductor device and electronic apparatus using the same 有权
    半导体装置及使用其的电子设备

    公开(公告)号：US07884437B2

    公开(公告)日：2011-02-08

    申请号：US12481252

    申请日：2009-06-09

    申请人： Masanori Minamio ,  Tetsushi Nishio

    发明人： Masanori Minamio ,  Tetsushi Nishio

    IPC分类号： H01L31/0232

    CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L27/14627 ,  H01L27/1463 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A semiconductor device includes: a semiconductor substrate having an imaging region in which a plurality of photoreceptors are arranged, and a peripheral circuit region arranged around the imaging region; a plurality of microlenses formed on the imaging region; a low-refractive-index film formed on the semiconductor substrate to cover the plurality of microlenses and part of the peripheral circuit region; and a transparent substrate formed on part of the low-refractive-index film above the imaging region. A through hole is formed in part of the low-refractive-index film above an amplifier circuit arranged in the peripheral circuit region.

    摘要翻译： 半导体器件包括：半导体衬底，具有配置有多个感光体的摄像区域和配置在摄像区域周围的外围电路区域; 形成在成像区域上的多个微透镜; 形成在所述半导体衬底上以覆盖所述多个微透镜和所述外围电路区域的一部分的低折射率膜; 以及在成像区域上方的低折射率膜的一部分上形成的透明基板。 在布置在外围电路区域中的放大器电路之上的低折射率膜的一部分中形成有通孔。

    OPTICAL SEMICONDUCTOR DEVICE
    9.
    发明申请
    OPTICAL SEMICONDUCTOR DEVICE 审中-公开
    光学半导体器件

    公开(公告)号：US20110163328A1

    公开(公告)日：2011-07-07

    申请号：US13048221

    申请日：2011-03-15

    申请人： Yoshiki TAKAYAMA ,  Masanori Minamio ,  Tetsushi Nishio

    发明人： Yoshiki TAKAYAMA ,  Masanori Minamio ,  Tetsushi Nishio

    IPC分类号： H01L33/48

    CPC分类号： H01L31/0203 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

    摘要翻译： 光学半导体器件包括：具有底部和侧壁部分的封装; 半导体芯片，其具有在其一个表面上形成并且具有与固定到封装的底部的一个表面相对的表面的光学元件; 固定到所述半导体芯片以便覆盖所述光学元件的透明构件; 以及填充封装和半导体芯片之间的空间的密封树脂。 侧壁部分的上部具有向包装内部突出的突出部分。 透明构件从由突出部形成的窗口部露出。