公开(公告)号：USD505964S1

公开(公告)日：2005-06-07

申请号：US29194887

申请日：2003-12-03

申请人： Masanori Minamio ,  Yoshinobu Kunitomo ,  Mutsuo Tsuji ,  Koichi Yamauchi

设计人： Masanori Minamio ,  Yoshinobu Kunitomo ,  Mutsuo Tsuji ,  Koichi Yamauchi

公开(公告)号：USD501664S1

公开(公告)日：2005-02-08

申请号：US29194886

申请日：2003-12-03

申请人： Masanori Minamio ,  Yoshinobu Kunitomo ,  Mutsuo Tshuji ,  Koichi Yamauchi

设计人： Masanori Minamio ,  Yoshinobu Kunitomo ,  Mutsuo Tshuji ,  Koichi Yamauchi

公开(公告)号：US07286729B2

公开(公告)日：2007-10-23

申请号：US11396651

申请日：2006-04-04

申请人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

发明人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/92247 ,  H01L2924/01021 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.

摘要翻译： 光学器件腔结构包括：彼此交替层叠的绝缘体层和金属层; 第一端子部，形成在安装在布线基板上的与布线基板电连接的安装面上; 空腔部分，其具有形成在所述上表面的中心部分中的大致矩形的开口; 以及透光部件配置部，其形成在所述开口的周围的上表面上，用于容纳透光部件，其中，所述透光部件用于透射由所述光学元件芯片接收的光或从所述光学元件芯片发出的光 。

公开(公告)号：US20060222285A1

公开(公告)日：2006-10-05

申请号：US11396651

申请日：2006-04-04

申请人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

发明人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/92247 ,  H01L2924/01021 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.

摘要翻译： 光学器件腔结构包括：彼此交替层叠的绝缘体层和金属层; 第一端子部，形成在安装在布线基板上的与布线基板电连接的安装面上; 空腔部分，其具有形成在所述上表面的中心部分中的大致矩形的开口; 以及透光部件配置部，其形成在所述开口的周围的上表面上，用于容纳透光部件，其中，所述透光部件用于透射由所述光学元件芯片接收的光或从所述光学元件芯片发出的光 。

公开(公告)号：US07154156B2

公开(公告)日：2006-12-26

申请号：US10676135

申请日：2003-09-30

申请人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

发明人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： H01L27/14618 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/49121 ,  Y10T29/49158 ,  Y10T29/49167 ,  Y10T29/49176 ,  Y10T29/49204 ,  Y10T29/4922 ,  H01L2224/0401

摘要： A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.

摘要翻译： 一种固态成像装置，包括：由绝缘材料制成的底座，具有平面形状的框架形状，其内部形成有孔; 多个布线设置在基座的一个表面上，并沿着孔径从基座的外周延伸; 以及安装在基座表面上的成像元件，其上设置有布线，使得成像元件的光接收区域面向孔。 多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接 与成像元件的电极电连接。 所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述 基础。 通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

公开(公告)号：US07367120B2

公开(公告)日：2008-05-06

申请号：US11599125

申请日：2006-11-14

申请人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

发明人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

IPC分类号： H01K3/22

CPC分类号： H01L27/14618 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/49121 ,  Y10T29/49158 ,  Y10T29/49167 ,  Y10T29/49176 ,  Y10T29/49204 ,  Y10T29/4922 ,  H01L2224/0401

摘要： A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.

摘要翻译： 一种制造固态成像装置的方法。 多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接 与成像元件的电极电连接。 所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述 基础。 通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

公开(公告)号：US20070069319A1

公开(公告)日：2007-03-29

申请号：US11599125

申请日：2006-11-14

申请人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

发明人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

IPC分类号： H01L31/0203 ,  H01K3/22 ,  H01R43/00

CPC分类号： H01L27/14618 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/49121 ,  Y10T29/49158 ,  Y10T29/49167 ,  Y10T29/49176 ,  Y10T29/49204 ,  Y10T29/4922 ,  H01L2224/0401

摘要： A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.

摘要翻译： 一种固态成像装置，包括：由绝缘材料制成的底座，具有平面形状的框架形状，其内部形成有孔; 多个布线设置在基座的一个表面上，并沿着孔径从基座的外周延伸; 以及安装在基座表面上的成像元件，其上设置有布线，使得成像元件的光接收区域面向孔。 多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接 与成像元件的电极电连接。 所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述 基础。 通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

公开(公告)号：US20140299982A1

公开(公告)日：2014-10-09

申请号：US13982720

申请日：2012-12-10

申请人： Masanori Minamio ,  Zyunya Tanaka

发明人： Masanori Minamio ,  Zyunya Tanaka

IPC分类号： H01L23/02 ,  H01L23/00 ,  H01L23/495 ,  H01L23/36

CPC分类号： H01L23/02 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/66 ,  H01L24/85 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K3/306 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A semiconductor device includes a package 1, a block-module 2, and a control board 3 for controlling power semiconductor elements 11a. The block-module 2 has embedded power semiconductor elements 11a and second leads 4b and first leads 4a that are drawn from the block-module 2. The package 1 has external connection terminals 6a in contact with the first leads 4a of the block-module 2. The second leads 4b are connected to the control board 3 while the first leads 4a are joined to the external connection terminals 6a.

摘要翻译： 半导体器件包括封装1，块模块2和用于控制功率半导体元件11a的控制板3。 块模块2具有从块模块2拉出的嵌入式功率半导体元件11a和第二引线4b以及第一引线4a。封装1具有与块模块2的第一引线4a接触的外部连接端子6a 第二引线4b连接到控制板3，而第一引线4a连接到外部连接端子6a。

公开(公告)号：US20130056885A1

公开(公告)日：2013-03-07

申请号：US13697886

申请日：2012-03-26

申请人： Masanori Minamio ,  Tatsuo Sasaoka

发明人： Masanori Minamio ,  Tatsuo Sasaoka

IPC分类号： H01L23/36 ,  H01L21/56

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L21/566 ,  H01L23/29 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An encapsulated semiconductor device includes: a first conduction path formative plate (1); a second conduction path formative plate (5) joined to the first conduction path formative plate; a power element (12) bonded to the first conduction path formative plate; a heatsink (14) held by the first conduction path formative plate with an insulation sheet (13) interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin (9) configured to encapsulate the first and second conduction path formative plates. A through hole (3) or a lead gap (1b) is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.

摘要翻译： 封装的半导体器件包括：第一导电路径形成板（1）; 连接到第一传导路径形成板的第二传导路径形成板（5） 功率元件（12），其接合到所述第一传导路径形成板; 由所述第一导电路径形成板保持的散热片（14），其间插入在所述散热器和所述第一导电路径形成板之间的绝缘片（13） 以及被配置为封装所述第一和第二导电路径形成板的封装树脂（9）。 在与绝缘片接触的第一传导路径形成板的区域中形成有通孔（3）或引线间隙（1b）。 绝缘片被压配合到通孔或引线间隙中。

公开(公告)号：US08193091B2

公开(公告)日：2012-06-05

申请号：US10173900

申请日：2002-06-19

申请人： Fumihiko Kawai ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Noboru Takeuchi ,  Shuichi Ogata ,  Katsushi Tara ,  Tadayoshi Nakatsuka

发明人： Fumihiko Kawai ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Noboru Takeuchi ,  Shuichi Ogata ,  Katsushi Tara ,  Tadayoshi Nakatsuka

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/4554

摘要： The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

摘要翻译： 本发明包括一个管芯焊盘; 信号引线，接地连接引线连接到管芯焊盘; 包括用于接地的电极焊盘的半导体芯片; 金属细线，以及用于封装芯片焊盘和半导体芯片的封装树脂，并封装信号引线和接地连接引线，使得信号引线和接地连接引线的下部被暴露为外部端子。 接地连接引线连接到电极焊盘用于接地，使得树脂封装的半导体器件电稳定。 此外，可以通过管芯焊盘和接地连接引线来抑制通过信号引线的高频信号之间的干扰。