公开(公告)号：US08193091B2

公开(公告)日：2012-06-05

申请号：US10173900

申请日：2002-06-19

申请人： Fumihiko Kawai ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Noboru Takeuchi ,  Shuichi Ogata ,  Katsushi Tara ,  Tadayoshi Nakatsuka

发明人： Fumihiko Kawai ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Noboru Takeuchi ,  Shuichi Ogata ,  Katsushi Tara ,  Tadayoshi Nakatsuka

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/4554

摘要： The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

摘要翻译： 本发明包括一个管芯焊盘; 信号引线，接地连接引线连接到管芯焊盘; 包括用于接地的电极焊盘的半导体芯片; 金属细线，以及用于封装芯片焊盘和半导体芯片的封装树脂，并封装信号引线和接地连接引线，使得信号引线和接地连接引线的下部被暴露为外部端子。 接地连接引线连接到电极焊盘用于接地，使得树脂封装的半导体器件电稳定。 此外，可以通过管芯焊盘和接地连接引线来抑制通过信号引线的高频信号之间的干扰。

公开(公告)号：US06984880B2

公开(公告)日：2006-01-10

申请号：US10702603

申请日：2003-11-07

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

公开(公告)号：US06720207B2

公开(公告)日：2004-04-13

申请号：US09971731

申请日：2001-10-09

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L2150

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

公开(公告)号：US07816777B2

公开(公告)日：2010-10-19

申请号：US11607001

申请日：2006-12-01

申请人： Masanori Minamio ,  Noboru Takeuchi ,  Kenichi Itou ,  Toshiyuki Fukuda ,  Hideki Sakota

发明人： Masanori Minamio ,  Noboru Takeuchi ,  Kenichi Itou ,  Toshiyuki Fukuda ,  Hideki Sakota

IPC分类号： H01L21/48

CPC分类号： H01L25/0655 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665

摘要： A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.

摘要翻译： 半导体元件安装基板是用于安装半导体元件的基板，并且包括基板主体。 基板主体具有安装面，安装面的中心部设置有模具图案。 通过导体设置在位于模具图案外部的基板主体的一部分中，以在厚度方向上穿透基板主体。 第一端子和第二端子分别连接到贯通导体。 第一端子各自朝向安装表面的外边缘延伸，并且它们电连接到半导体元件。 第二端子设置在基板主体的与安装表面相对的表面上。

公开(公告)号：US20070158855A1

公开(公告)日：2007-07-12

申请号：US11607001

申请日：2006-12-01

申请人： Masanori Minamio ,  Noboru Takeuchi ,  Kenichi Itou ,  Toshiyuki Fukuda ,  Hideki Sakota

发明人： Masanori Minamio ,  Noboru Takeuchi ,  Kenichi Itou ,  Toshiyuki Fukuda ,  Hideki Sakota

IPC分类号： H01L23/48

CPC分类号： H01L25/0655 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665

摘要： A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.

摘要翻译： 半导体元件安装基板是用于安装半导体元件的基板，并且包括基板主体。 基板主体具有安装面，安装面的中心部设置有模具图案。 通过导体设置在位于模具图案外部的基板主体的一部分中，以在厚度方向上穿透基板主体。 第一端子和第二端子分别连接到贯通导体。 第一端子各自朝向安装表面的外边缘延伸，并且它们电连接到半导体元件。 第二端子设置在基板主体的与安装表面相对的表面上。

公开(公告)号：US06674154B2

公开(公告)日：2004-01-06

申请号：US10083311

申请日：2002-02-27

申请人： Masanori Minamio ,  Toru Nomura ,  Fumihiko Kawai

发明人： Masanori Minamio ,  Toru Nomura ,  Fumihiko Kawai

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, a connecting portion therebetween has a smaller thickness than that of the frame body so that the first lead and the third lead can be separated from each other in a subsequent step.

摘要翻译： 引线框架包括管芯焊盘，悬架引线和多个引线。 该组线索包括至少三种线，包括第一，第二和第三线。 虽然第一引线和第三引线在制造引线框架时彼此连接，但是它们之间的连接部分具有比框架体更小的厚度，使得第一引线和第三引线可以彼此分离 随后的一步。

公开(公告)号：US06710430B2

公开(公告)日：2004-03-23

申请号：US10083160

申请日：2002-02-27

申请人： Masanori Minamio ,  Toru Nomura ,  Fumihiko Kawai

发明人： Masanori Minamio ,  Toru Nomura ,  Fumihiko Kawai

IPC分类号： H01L23495

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/32014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-encapsulated semiconductor device includes a die pad, a semiconductor chip mounted on the die pad, and a group of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, the first lead and the third lead are separated from each other in a subsequent step. Moreover, a thin metal wire for connecting an electrode of the semiconductor chip to the bonding pad of each lead, and an encapsulation resin for encapsulating the semiconductor chip, the leads, the thin metal wire, etc., are provided. The pad of each lead is exposed on a surface of the encapsulation resin so that the pad can function as an external terminal.

摘要翻译： 树脂封装的半导体器件包括管芯焊盘，安装在管芯焊盘上的半导体芯片和一组引线。 该组线索包括至少三种线，包括第一，第二和第三线。 当第一引线和第三引线在制造引线框架时彼此连接时，在随后的步骤中，第一引线和第三引线彼此分离。 此外，提供了用于将半导体芯片的电极连接到每个引线的焊盘的薄金属线，以及用于封装半导体芯片，引线，细金属丝等的封装树脂。 每个引线的焊盘暴露在封装树脂的表面上，使得焊盘可以用作外部端子。

公开(公告)号：US07745834B2

公开(公告)日：2010-06-29

申请号：US11471659

申请日：2006-06-21

申请人： Masanori Minamio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： H01L27/148

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height.

摘要翻译： 半导体图像传感器包括：半导体成像元件，包括成像区域，外围电路区域和电极区域; 设置在电极端子上以与外部装置电连接的圆柱形电极; 以及设置在半导体摄像元件的上表面上的透明树脂层。 每个圆柱形电极的上表面和透明树脂层的上表面基本上具有相同的高度。

公开(公告)号：US20100091630A1

公开(公告)日：2010-04-15

申请号：US12525227

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L21/78 ,  H01L23/29

CPC分类号： G11B7/1275 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices.

摘要翻译： 多个平行肋原型设置在平坦的基板上。 多个半导体元件被放置在相邻的肋原型之间的每个沟槽中，并且透明构件被结合到每个半导体元件。 半导体元件的电极焊盘被引线接合到连接电极。 然后用封装树脂填充沟槽。 此后，用切割锯切割肋骨原型的纵向中间部分，并且相邻的半导体元件彼此分离，从而获得半导体器件。

公开(公告)号：US07629688B2

公开(公告)日：2009-12-08

申请号：US11491029

申请日：2006-07-24

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Atsuhito Mizutani ,  Hisaki Fujitani ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Atsuhito Mizutani ,  Hisaki Fujitani ,  Toshiyuki Fukuda

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  H01L21/2007 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00015

摘要： An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.

摘要翻译： 通过将铝线压靠在硅电极上的楔形工具将铝线结合到硅电极。 以这种方式，通过依次层叠铝，氧化铝，氧化硅和硅来获得牢固结合的结构。