公开(公告)号：US07286729B2

公开(公告)日：2007-10-23

申请号：US11396651

申请日：2006-04-04

申请人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

发明人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/92247 ,  H01L2924/01021 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.

摘要翻译： 光学器件腔结构包括：彼此交替层叠的绝缘体层和金属层; 第一端子部，形成在安装在布线基板上的与布线基板电连接的安装面上; 空腔部分，其具有形成在所述上表面的中心部分中的大致矩形的开口; 以及透光部件配置部，其形成在所述开口的周围的上表面上，用于容纳透光部件，其中，所述透光部件用于透射由所述光学元件芯片接收的光或从所述光学元件芯片发出的光 。

公开(公告)号：US20060222285A1

公开(公告)日：2006-10-05

申请号：US11396651

申请日：2006-04-04

申请人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

发明人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/92247 ,  H01L2924/01021 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.

摘要翻译： 光学器件腔结构包括：彼此交替层叠的绝缘体层和金属层; 第一端子部，形成在安装在布线基板上的与布线基板电连接的安装面上; 空腔部分，其具有形成在所述上表面的中心部分中的大致矩形的开口; 以及透光部件配置部，其形成在所述开口的周围的上表面上，用于容纳透光部件，其中，所述透光部件用于透射由所述光学元件芯片接收的光或从所述光学元件芯片发出的光 。

公开(公告)号：US07822090B2

公开(公告)日：2010-10-26

申请号：US12186979

申请日：2008-08-06

申请人： Masanori Minamio ,  Noriyuki Yoshikawa ,  Shinichi Ijima ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Noriyuki Yoshikawa ,  Shinichi Ijima ,  Toshiyuki Fukuda

IPC分类号： H01S5/00 ,  H01S3/30 ,  H01S3/04 ,  H01L29/16

CPC分类号： B82Y20/00 ,  G11B7/127 ,  H01L2224/48091 ,  H01S5/0021 ,  H01S5/0071 ,  H01S5/02212 ,  H01S5/02216 ,  H01S5/02224 ,  H01S5/02248 ,  H01S5/02292 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/028 ,  H01S5/34333 ,  H01L2924/00014

摘要： A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.

摘要翻译： 半导体器件包括光学半导体元件，包括由用于安装光学半导体元件的金属制成的基座的封装以及用于通过覆盖封装和光学半导体元件来封装光学半导体元件的盖和气体。 用包装封装的气体的氧浓度不小于15％且小于30％，露点不低于-15℃且不大于-5℃。

公开(公告)号：US20100091630A1

公开(公告)日：2010-04-15

申请号：US12525227

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L21/78 ,  H01L23/29

CPC分类号： G11B7/1275 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices.

摘要翻译： 多个平行肋原型设置在平坦的基板上。 多个半导体元件被放置在相邻的肋原型之间的每个沟槽中，并且透明构件被结合到每个半导体元件。 半导体元件的电极焊盘被引线接合到连接电极。 然后用封装树脂填充沟槽。 此后，用切割锯切割肋骨原型的纵向中间部分，并且相邻的半导体元件彼此分离，从而获得半导体器件。

公开(公告)号：US20070217476A1

公开(公告)日：2007-09-20

申请号：US11708478

申请日：2007-02-21

申请人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

发明人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

IPC分类号： H01S3/06

CPC分类号： H01S5/02272 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/20 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/157 ,  H01L2924/3511 ,  H01S5/0071 ,  H01S5/0207 ,  H01S5/02216 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02476 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

摘要翻译： 光半导体器件包括半导体激光器芯片，用于安装半导体激光器芯片的基座和夹在基底的顶表面和半导体激光器芯片的底表面之间的焊料层。 半导体激光芯片翘曲成向上凸出的形状。

公开(公告)号：US20100091633A1

公开(公告)日：2010-04-15

申请号：US12525217

申请日：2008-03-10

申请人： Junya FuruyashikiI ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya FuruyashikiI ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/135 ,  H01L21/50 ,  H01L23/28

CPC分类号： H01L31/0203 ,  G11B7/123 ,  G11B7/1275 ,  G11B7/13 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other.

摘要翻译： 制备包括连接电极，内部互连和外部连接部分的平板预板板。 将该预板板切割成相邻的连接电极之间的部分，从而形成沟槽。 多个半导体元件被放置在每个沟槽中。 电极焊盘和连接电极通过金属线彼此连接。 将透明盖放置在隔离物上并结合到覆盖半导体元件上。 此后，布置在相邻的沟槽之间的两条连接电极彼此分离。 随后，相邻的半导体元件也彼此分离。

公开(公告)号：US20100008203A1

公开(公告)日：2010-01-14

申请号：US12525779

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L31/02 ,  H01L21/50

CPC分类号： H01L27/14618 ,  G11B7/12 ,  H01L23/055 ,  H01L23/3185 ,  H01L24/97 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2224/85 ,  H01L2924/00

摘要： A semiconductor element is mounted on a rectangular base of a package including the base and ribs provided on a pair of opposite external edges of the base. Electrode pads of the semiconductor element and connection electrodes provided on rib upper surfaces are connected to each other by metal wires. On the rib upper surfaces, spacers are provided at locations closer to the outside than the connection electrodes. A transparent lid adheres to the upper surfaces of the spacers to cover the entire surface of the package. The height of the spacers is greater than the diameter of the metal wires.

摘要翻译： 半导体元件安装在包装件的矩形基座上，该基座和肋设置在基座的一对相对的外缘上。 设置在肋上表面上的半导体元件和连接电极的电极焊盘通过金属线彼此连接。 在肋上表面上，间隔件设置在比连接电极更靠近外部的位置处。 透明盖粘附到间隔物的上表面以覆盖整个包装的整个表面。 间隔件的高度大于金属丝的直径。

公开(公告)号：US20090086769A1

公开(公告)日：2009-04-02

申请号：US12186979

申请日：2008-08-06

申请人： Masanori MINAMIO ,  Noriyuki Yoshikawa ,  Shinichi Ijima ,  Toshiyuki Fukuda

发明人： Masanori MINAMIO ,  Noriyuki Yoshikawa ,  Shinichi Ijima ,  Toshiyuki Fukuda

IPC分类号： H01S3/30

CPC分类号： B82Y20/00 ,  G11B7/127 ,  H01L2224/48091 ,  H01S5/0021 ,  H01S5/0071 ,  H01S5/02212 ,  H01S5/02216 ,  H01S5/02224 ,  H01S5/02248 ,  H01S5/02292 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/028 ,  H01S5/34333 ,  H01L2924/00014

摘要： A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.

摘要翻译： 半导体器件包括光学半导体元件，包括由用于安装光学半导体元件的金属制成的基座的封装以及用于通过覆盖封装和光学半导体元件来封装光学半导体元件的盖和气体。 用包装封装的气体的氧浓度不小于15％且小于30％，露点不低于-15℃且不大于-5℃。

公开(公告)号：US20100001174A1

公开(公告)日：2010-01-07

申请号：US12525499

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： H01J3/14 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L27/14683 ,  G11B7/1275 ,  G11B7/13 ,  H01L23/055 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2224/85 ,  H01L2924/00

摘要： In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams.

摘要翻译： 在半导体器件中，半导体元件安装在大致矩形的封装上。 第一肋分别设置在安装表面的一对相对的外边缘上并从该对相对的外边缘向上突出。 盖的外边缘放置在第一肋的上表面上，并用粘合剂固定在其上。 大坝设置在第一肋上表面的外边缘上。 粘合剂从盖的侧表面连续存在于坝。

公开(公告)号：US07359416B2

公开(公告)日：2008-04-15

申请号：US11708478

申请日：2007-02-21

申请人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

发明人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

IPC分类号： H01S3/14 ,  H01S3/07

CPC分类号： H01S5/02272 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/20 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/157 ,  H01L2924/3511 ,  H01S5/0071 ,  H01S5/0207 ,  H01S5/02216 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02476 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

摘要翻译： 光半导体器件包括半导体激光器芯片，用于安装半导体激光器芯片的基座和夹在基底的顶表面和半导体激光器芯片的底表面之间的焊料层。 半导体激光芯片翘曲成向上凸出的形状。