公开(公告)号：US07816180B2

公开(公告)日：2010-10-19

申请号：US12403252

申请日：2009-03-12

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L21/58

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/02 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/06102 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13028 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

摘要翻译： 本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。 电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于 第二温度高于第一温度。 半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

公开(公告)号：US07811835B2

公开(公告)日：2010-10-12

申请号：US12403283

申请日：2009-03-12

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L21/58

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/02 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/06102 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13028 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

摘要翻译： 本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。 电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于 第二温度高于第一温度。 半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

公开(公告)号：US20090181497A1

公开(公告)日：2009-07-16

申请号：US12403283

申请日：2009-03-12

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L21/60

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/02 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/06102 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13028 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

公开(公告)号：US07514295B2

公开(公告)日：2009-04-07

申请号：US11196487

申请日：2005-08-04

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L21/60

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/02 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/06102 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13028 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

摘要翻译： 本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。 电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于 第二温度高于第一温度。 半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

公开(公告)号：US20090176331A1

公开(公告)日：2009-07-09

申请号：US12403252

申请日：2009-03-12

申请人： Masataka MIZUKOSHI ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka MIZUKOSHI ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L21/98 ,  H01L21/50

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/02 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/06102 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13028 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

摘要翻译： 本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。 电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于 第二温度高于第一温度。 半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

公开(公告)号：US20060030071A1

公开(公告)日：2006-02-09

申请号：US11196487

申请日：2005-08-04

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/02 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/06102 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13028 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/13669 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.

摘要翻译： 本发明实现了一种高可靠性的半导体器件，其允许在低负载和低成本下形成具有均匀高度，平坦和平滑的金属端子并且以低损伤安装。 电极5和绝缘膜6均由具有固体特性的材料形成，并且在室温下不显示粘合性，并且在不低于第一温度的温度下显示粘附性，并且在不低于 第二温度高于第一温度。 半导体芯片1a的电极5和绝缘膜6的表面与硬质切削工具一样平坦化，如金刚石等。

公开(公告)号：US20060027936A1

公开(公告)日：2006-02-09

申请号：US11017875

申请日：2004-12-22

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki

IPC分类号： H01L29/40 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/013 ,  H01L2924/01049

摘要： Electrodes and an insulating film are both formed of materials which have characteristics that they are solid and do not exhibit adhesiveness at a room temperature, exhibit adhesiveness at and above a first temperature higher than this, and are cured at and above a second temperature higher than this. Planarication processing is carried out by performing cutting with a hard cutting tool made of diamond and the like so that surfaces film the electrodes and a surface of the insulating film become continuously planar.

摘要翻译： 电极和绝缘膜均由具有固体特性并且在室温下不具有粘合性的材料形成，在高于此的第一温度以上显示粘合性，并且在高于 这个。 通过使用由金刚石等制成的硬切割工具进行切割来进行平面化处理，使得电极的表面和绝缘膜的表面成为连续的平面。

公开(公告)号：US07852439B2

公开(公告)日：2010-12-14

申请号：US12561613

申请日：2009-09-17

申请人： Hisashi Yamaguchi ,  Fumio Yamagishi ,  Shigeo Matsunuma ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki ,  Taiji Sakai ,  Junji Tomita

发明人： Hisashi Yamaguchi ,  Fumio Yamagishi ,  Shigeo Matsunuma ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki ,  Taiji Sakai ,  Junji Tomita

IPC分类号： G02F1/1335

CPC分类号： G02F1/13476 ,  G02F1/133305 ,  G02F1/13452 ,  G02F2203/34

摘要： The invention relates to a multi-layer display element configured by a plurality of layers for use as a display section of electronic paper or others, and a manufacturing method for the multi-layer display element. The invention provides a multi-layer display element that allows a pixel area not being narrowed, a high yield of electrode formation, and interlayer connection with no need for a high-temperature process, and a manufacturing method for such a multi-layer display element. The multi-layer liquid crystal display element includes a data signal output terminal group from which data signals are provided, a scanning signal output terminal group from which scanning signals are provided, a data electrode connection wire rod group respectively connecting data electrodes to the data signal output terminal group, and a scanning electrode connection wire rod group respectively connecting scanning electrodes to the scanning signal output terminal group.

摘要翻译： 本发明涉及一种由多层构成的多层显示元件，用于电子纸等的显示部分，以及多层显示元件的制造方法。 本发明提供了一种多层显示元件，其可以使像素区域不变窄，高产率的电极形成和层间连接，而不需要高温处理，以及这种多层显示元件的制造方法 。 多层液晶显示元件包括提供数据信号的数据信号输出端子组，设置有扫描信号的扫描信号输出端子组，分别将数据电极连接到数据信号的数据电极连接线棒组 输出端子组和扫描电极连接线组，分别将扫描电极连接到扫描信号输出端子组。

公开(公告)号：US20100097550A1

公开(公告)日：2010-04-22

申请号：US12561613

申请日：2009-09-17

申请人： Hisashi Yamaguchi ,  Fumio Yamagishi ,  Shigeo Matsunuma ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki ,  Taiji Sakai ,  Junji Tomita

发明人： Hisashi Yamaguchi ,  Fumio Yamagishi ,  Shigeo Matsunuma ,  Nobuhiro Imaizumi ,  Yoshikatsu Ishizuki ,  Taiji Sakai ,  Junji Tomita

IPC分类号： G02F1/1335 ,  H01J9/20 ,  G09G5/00

CPC分类号： G02F1/13476 ,  G02F1/133305 ,  G02F1/13452 ,  G02F2203/34

摘要： The invention relates to a multi-layer display element configured by a plurality of layers for use as a display section of electronic paper or others, and a manufacturing method for the multi-layer display element. The invention provides a multi-layer display element that allows a pixel area not being narrowed, a high yield of electrode formation, and interlayer connection with no need for a high-temperature process, and a manufacturing method for such a multi-layer display element. The multi-layer liquid crystal display element includes a data signal output terminal group from which data signals are provided, a scanning signal output terminal group from which scanning signals are provided, a data electrode connection wire rod group respectively connecting data electrodes to the data signal output terminal group, and a scanning electrode connection wire rod group respectively connecting scanning electrodes to the scanning signal output terminal group.

摘要翻译： 本发明涉及一种由多层构成的多层显示元件，用于电子纸等的显示部分，以及多层显示元件的制造方法。 本发明提供了一种多层显示元件，其可以使像素区域不变窄，高产率的电极形成和层间连接，而不需要高温处理，以及这种多层显示元件的制造方法 。 多层液晶显示元件包括提供数据信号的数据信号输出端子组，设置有扫描信号的扫描信号输出端子组，分别将数据电极连接到数据信号的数据电极连接线棒组 输出端子组和扫描电极连接线组，分别将扫描电极连接到扫描信号输出端子组。

公开(公告)号：US07402461B2

公开(公告)日：2008-07-22

申请号：US11019157

申请日：2004-12-23

申请人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Taiji Sakai

发明人： Masataka Mizukoshi ,  Nobuhiro Imaizumi ,  Taiji Sakai

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/1134 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/29099

摘要： The present invention is aimed at providing a method of connecting base materials capable of forming metal terminals having a uniform height and smooth surface with a low cost, and of realizing a low-damage mounting, in which a work is planarized while keeping the temperature of the insulating film, possibly elevated due to frictional heat generated during cutting using a cutting tool, lower than 80° C., and keeping the temperature range lower than 80° C. throughout the entire period of the cutting, the electrodes and electrodes are opposed and brought into contact at a temperature of 80° C. or above but lower than the curing temperature of the insulating film, the insulating film is liquefied and a space between the electrodes and electrodes is filled with an insulating resin composing the insulating film, and the insulating resin is cured at the curing temperature or above.

摘要翻译： 本发明旨在提供一种能够以低成本形成具有均匀高度和平滑表面的金属端子的基材的方法，并且实现了低损伤安装，其中工件平坦化同时保持温度 绝缘膜由于在使用切割工具的切割期间产生的摩擦热可能升高，低于80℃，并且在切割的整个整个周期内保持温度范围低于80℃，电极和电极相对 并在80℃以上且低于绝缘膜的固化温度的温度下接触，使绝缘膜液化，并且用构成绝缘膜的绝缘树脂填充电极和电极之间的空间，以及 绝缘树脂在固化温度以上固化。