Probe for measuring periodontal pocket depth
    1.
    发明授权
    Probe for measuring periodontal pocket depth 失效
    探头测量牙周袋深度

    公开(公告)号:US5897509A

    公开(公告)日:1999-04-27

    申请号:US880677

    申请日:1997-06-23

    IPC分类号: A61C19/04 A61B5/103

    CPC分类号: A61C19/043

    摘要: A probe for measuring a depth of a periodontal pocket includes an emitting device for emitting, from a position at a distance from the periodontal pocket, a light beam toward the periodontal pocket, a receiving device for receiving, at a position at another distance from the periodontal pocket, the light beam after being reflected on a bottom of the periodontal pocket, and an analyzing device for displaying the depth of the periodontal pocket after a calculation thereof on the basis of an analysis of the light beam received at the receiving device.

    摘要翻译: 用于测量牙周袋深度的探针包括一个发射装置,用于从与牙周袋一定距离处的一个位置发射朝向牙周袋的光束;一个接收装置,用于在与 在牙周袋的底部反射后的光束,以及分析装置,用于根据在接收装置接收的光束的分析,计算出牙周袋的深度。

    CONCAVE-CONVEX SURFACE INSPECTION APPARATUS
    2.
    发明申请
    CONCAVE-CONVEX SURFACE INSPECTION APPARATUS 有权
    CONCAVE-CONVEX表面检查装置

    公开(公告)号:US20090231570A1

    公开(公告)日:2009-09-17

    申请号:US12400140

    申请日:2009-03-09

    IPC分类号: G01C3/00

    CPC分类号: G01B11/25

    摘要: A concave-convex surface inspection apparatus includes a slit light source unit emitting a slit light to a concave-convex surface of an object to be inspected, an image-taking unit taking an image of the concave-convex surface illuminated by the emitted slit light with an imaging optical axis intersecting with an optical axis of the slit light with a narrow-angle equal to or narrower than 30 degrees, and an evaluation section obtaining a three dimensional shape of the concave-convex surface and evaluating the obtained three dimensional shape, wherein the slit light source unit includes a slit light source and a cylindrical lens, the image-taking unit includes a telecentric lens unit, an image-taking section having an imaging surface tilted relative to the imaging optical axis for increasing a focusing range of the concave-convex surface, and a P polarizer.

    摘要翻译: 凹凸表面检查装置包括将狭缝光发射到被检查物体的凹凸面的狭缝光源单元,摄像单元拍摄由发射的狭缝光照射的凹凸面的图像 具有与狭缝等于或小于30度的狭缝光的光轴相交的成像光轴和获得凹凸表面的三维形状的评估部分,并评估所获得的三维形状, 其中所述狭缝光源单元包括狭缝光源和柱面透镜,所述摄像单元包括远心透镜单元,摄像部分具有相对于成像光轴倾斜的成像表面,用于增加所述摄像部分的聚焦范围 凹凸表面和P偏振器。

    DEFECT DETECTION APPARATUS AND DEFECT DETECTION METHOD
    3.
    发明申请
    DEFECT DETECTION APPARATUS AND DEFECT DETECTION METHOD 审中-公开
    缺陷检测装置和缺陷检测方法

    公开(公告)号:US20110193952A1

    公开(公告)日:2011-08-11

    申请号:US13018817

    申请日:2011-02-01

    IPC分类号: G06K9/00 H04N7/18

    摘要: A defect detection apparatus, detecting a defect on an inspection surface of an inspection object, includes a table including a table surface, a lighting device emitting a light to the inspection surface, an image capturing device capturing an image of the inspection surface, a displacement mechanism changing a direction of at least of one of a relative direction of an optical axis of the lighting device relative to the table surface and a relative direction of an optical axis of the image capturing device relative to the table surface, an image data obtaining portion obtaining an image data from images captured by the image capturing device while changing the relative direction, a feature extracting portion extracting a feature representing a reflection characteristic of the inspection surface from the image data, and a defect specification portion specifying a type of the defect on the inspection surface based on the extracted feature.

    摘要翻译: 一种检测检查对象的检查面上的缺陷的缺陷检测装置,包括:台面,向检查面发射光的照明装置,摄像检查面的图像的摄像装置,位移 改变照明装置的光轴相对于台面的相对方向和摄像装置相对于台面的相对方向中的至少一个的方向的机构,图像数据取得部 在改变相对方向的同时从图像捕获装置拍摄的图像中获取图像数据,从图像数据中提取表示检查表面的反射特性的特征的特征提取部分,以及指定缺陷类型的缺陷指定部分 基于提取的特征的检查表面。

    Concave-convex surface inspection apparatus
    4.
    发明授权
    Concave-convex surface inspection apparatus 有权
    凹凸表面检查装置

    公开(公告)号:US08049868B2

    公开(公告)日:2011-11-01

    申请号:US12400140

    申请日:2009-03-09

    IPC分类号: G01C3/08 G01N21/00

    CPC分类号: G01B11/25

    摘要: A concave-convex surface inspection apparatus includes a slit light source unit emitting a slit light to a concave-convex surface of an object to be inspected, an image-taking unit taking an image of the concave-convex surface illuminated by the emitted slit light with an imaging optical axis intersecting with an optical axis of the slit light with a narrow-angle equal to or narrower than 30 degrees, and an evaluation section obtaining a three dimensional shape of the concave-convex surface and evaluating the obtained three dimensional shape, wherein the slit light source unit includes a slit light source and a cylindrical lens, the image-taking unit includes a telecentric lens unit, an image-taking section having an imaging surface tilted relative to the imaging optical axis for increasing a focusing range of the concave-convex surface, and a P polarizer.

    摘要翻译: 凹凸表面检查装置包括将狭缝光发射到被检查物体的凹凸面的狭缝光源单元,摄像单元拍摄由发射的狭缝光照射的凹凸面的图像 具有与狭缝等于或小于30度的狭缝光的光轴相交的成像光轴和获得凹凸表面的三维形状的评估部分,并评估所获得的三维形状, 其中所述狭缝光源单元包括狭缝光源和柱面透镜,所述摄像单元包括远心透镜单元,摄像部分具有相对于成像光轴倾斜的成像表面,用于增加所述摄像部分的聚焦范围 凹凸表面和P偏振器。

    MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT
    6.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT 有权
    半导体激光元件的制造方法

    公开(公告)号:US20100240159A1

    公开(公告)日:2010-09-23

    申请号:US12676666

    申请日:2008-09-02

    IPC分类号: H01L21/304

    摘要: Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.

    摘要翻译: 最初在被加工物1中形成沿切割线5a,5b延伸的用于切割的切割8a,8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b,同时定位 在物体1内的会聚点,并且形成为沿着切割线的线延伸的部分,除了与切割线5a相交的部分34b。 这样,从切点8a的起点区域切断物体1时,能够切割8b的起点区域的影响更小,从而可以可靠地获得具有精确的切割面的条。 因此,不需要在多个条中形成沿着切割线5b切割的起点区域,从而可以提高半导体激光元件的生产率。

    Laser Processing Method And Device
    7.
    发明申请
    Laser Processing Method And Device 有权
    激光加工方法与装置

    公开(公告)号:US20080218735A1

    公开(公告)日:2008-09-11

    申请号:US10585343

    申请日:2004-12-13

    IPC分类号: G01N21/00 G02B27/02

    摘要: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

    摘要翻译: 提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。 该激光加工方法包括:准备步骤,将透镜保持在初始位置,使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤(S11和S12),以形成修改区域 在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤(S13和S14),然后相对于每个移动透镜和物体 另外沿着主表面,同时在释放之后调整透镜和主表面之间的间隙,从而形成改质区域。

    Laser processing method for forming a modified region in an object
    8.
    发明授权
    Laser processing method for forming a modified region in an object 有权
    用于在物体中形成改质区域的激光加工方法

    公开(公告)号:US08735770B2

    公开(公告)日:2014-05-27

    申请号:US12444125

    申请日:2007-09-27

    IPC分类号: B23K26/14 B23K26/16 B23K26/06

    摘要: While a converging lens 108 is relatively moved along a line 50 including a line to cut 5, measuring laser light L2 is converged with the lens 108 when the lens 108 is positioned on a processing region 30 having an outer shape between an object to be processed 1 and a frame 22, and a reflected light component of the laser light L2 reflected by a front face 3 of the object 1 is detected. While keeping a substantially constant distance between the front face 3 and the lens 108 such that a converging point P of processing laser light L1 is positioned at a constant distance from the front face 3 according to the detection, the laser light L1 is converged by the lens 108, so as to form a molten processed region 13 within the object 1.

    摘要翻译: 当会聚透镜108沿着包括切割线5的线50相对移动时,当透镜108位于具有处于被处理物体之间的外形的处理区域30时,测量激光L2与透镜108会聚 检测出由物体1的正面3反射的激光L2的反射光分量。 在保持前表面3和透镜108之间保持基本上恒定的距离的同时,根据检测,处理激光L1的会聚点P位于距前表面3的恒定距离处,激光L1被 透镜108,以便在物体1内形成熔融处理区域13。

    Laser processing method
    9.
    发明授权
    Laser processing method 有权
    激光加工方法

    公开(公告)号:US08604383B2

    公开(公告)日:2013-12-10

    申请号:US11659376

    申请日:2005-07-27

    IPC分类号: B23K26/42 H01L21/301

    摘要: This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.

    摘要翻译: 该激光加工方法在将聚光点P定位在基板4内的状态下照射激光L的基板4,从而形成质量改质区域71,成为基板4内的切割起点区域, 这里,激光L沿着要切割的线5中的期望部分RP脉动地沿着切割线5中的预定部分RC连续振荡。因此,质量改质区域71形成在基板内 沿着要切割的线5中的期望部分RP 4,而沿着切割线5中的预定部分RC,在基板4内不形成质量改质区域71。

    Laser material processing system
    10.
    发明授权
    Laser material processing system 有权
    激光材料加工系统

    公开(公告)号:US08563893B2

    公开(公告)日:2013-10-22

    申请号:US12096940

    申请日:2006-12-12

    摘要: A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.

    摘要翻译: 激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2,用于致动透镜31的致动器,用于对测距激光的反射光L3增加散光的整形光学系统49, 用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42,以及用于调节致动器的控制器,并将测距激光L2的会聚点P2定位在透镜的焦点P0和 透镜31,从而能够在比正面3更深的位置形成改质区域,由此抑制由反射光L3引起的不利影响。 控制基于经过除以电压值之和的算术值,以防止算术值被反射光量改变。