公开(公告)号：US07569424B2

公开(公告)日：2009-08-04

申请号：US11600289

申请日：2006-11-15

申请人： Michael J. Nystrom ,  Christopher Paul Wade ,  Giles Humpston

发明人： Michael J. Nystrom ,  Christopher Paul Wade ,  Giles Humpston

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L27/14618 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly, positioning a molding surface in contact with the deposited flowable material and controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned between the upper surface and the molding surface.

摘要翻译： 在微电子组件中形成壁结构的方法包括在微电子组件中的第一元件的上表面上选择性地沉积可流动材料，将模制表面定位成与沉积的可流动材料接触并且控制上表面之间的距离 第一元件和模制表面，其中一个或多个物体位于上表面和模制表面之间。

公开(公告)号：US20080113470A1

公开(公告)日：2008-05-15

申请号：US11600289

申请日：2006-11-15

申请人： Michael J. Nystrom ,  Christopher Paul Wade ,  Giles Humpston

发明人： Michael J. Nystrom ,  Christopher Paul Wade ,  Giles Humpston

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly, positioning a molding surface in contact with the deposited flowable material and controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned between the upper surface and the molding surface.

摘要翻译： 在微电子组件中形成壁结构的方法包括在微电子组件中的第一元件的上表面上选择性地沉积可流动材料，将模制表面定位成与沉积的可流动材料接触并且控制上表面之间的距离 第一元件和模制表面，其中一个或多个物体位于上表面和模制表面之间。

公开(公告)号：US20080165519A1

公开(公告)日：2008-07-10

申请号：US11650356

申请日：2007-01-05

申请人： Michael J. Nystrom ,  Giles Humpston

发明人： Michael J. Nystrom ,  Giles Humpston

IPC分类号： B23P17/04 ,  H05K7/04

CPC分类号： H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

摘要： A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

摘要翻译： 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。

公开(公告)号：US06958446B2

公开(公告)日：2005-10-25

申请号：US10124166

申请日：2002-04-17

申请人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Heidi L. Reynolds ,  Gary R. Trott

发明人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Heidi L. Reynolds ,  Gary R. Trott

IPC分类号： G02B26/08 ,  B23K1/00 ,  B23K35/26 ,  G02B6/12 ,  G02B6/35 ,  G02B6/36 ,  G02B6/42 ,  H01J5/00 ,  H05K5/06

CPC分类号： G02B6/12 ,  B23K1/0016 ,  B23K35/26 ,  B23K2101/40 ,  B23K2103/18 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  G02B6/3512 ,  G02B6/3582 ,  G02B6/36 ,  G02B6/4248 ,  G02B2006/12104

摘要： A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

摘要翻译： 具有不同的热膨胀系数的焊接接头或密封件附接部件被制成薄（例如，小于20μm，优选约5μm）以及具有蠕变趋势的诸如铟基焊料的焊料。 焊料是环形或其他形状，以避免焊料中的拉伸应力。 焊料中的轴向剪切应力引起可逆蠕变，而不会导致接头或密封件的故障。 在一个实施例中，环形焊接密封件的直径，占地面积和厚度约为5000：200：1。

公开(公告)号：US07936062B2

公开(公告)日：2011-05-03

申请号：US11655777

申请日：2007-01-19

申请人： Giles Humpston ,  Michael J. Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky ,  Mitchell Hayes Reifel

发明人： Giles Humpston ,  Michael J. Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky ,  Mitchell Hayes Reifel

IPC分类号： H01L23/12

CPC分类号： B81C1/00269 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/10 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.

摘要翻译： 提供封装的微电子元件。 在一个示例性实施例中，具有前表面和限定前表面的多个周边边缘的微电子元件在前表面具有一个器件区域，以及一个接触区域与多个暴露的接触件相邻，至少一个周边边缘。 封装元件可以包括覆盖微电子元件的前表面的多个支撑壁，使得盖可以安装到微电子元件上方的支撑壁上。 例如，盖可以具有面向正面的内表面。 在一个具体实施例中，一些触点可以暴露在盖的边缘之外。

公开(公告)号：US07453139B2

公开(公告)日：2008-11-18

申请号：US11318815

申请日：2005-12-27

申请人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L23/495

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。

公开(公告)号：US07449779B2

公开(公告)日：2008-11-11

申请号：US11322617

申请日：2005-12-30

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L23/48

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US07858445B2

公开(公告)日：2010-12-28

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US20080191300A1

公开(公告)日：2008-08-14

申请号：US12004149

申请日：2007-12-20

申请人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

发明人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

IPC分类号： H01L27/146

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.

摘要翻译： 本发明涉及摄像机模块。 相机模块包括具有顶侧，底侧和透明区域的电路板，电路板具有导体。 该模块还包括设置在电路板的底侧上的传感器单元，并且传感器单元包括半导体芯片，该半导体芯片具有前表面，该前表面包括与透明区域对准的向前方向的成像区域和适于 产生表示入射到成像区域上的光学图像的信号。 模块还包括从电路板的底侧突出的柱，其中至少一些柱是具有底表面的接合柱，并且至少一些底表面邻接传感器单元的接合表面。

公开(公告)号：US08604605B2

公开(公告)日：2013-12-10

申请号：US11650356

申请日：2007-01-05

申请人： Michael J. Nystrom ,  Giles Humpston

发明人： Michael J. Nystrom ,  Giles Humpston

IPC分类号： H01L23/12

CPC分类号： H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

摘要： A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

摘要翻译： 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。