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12 条记录 (耗时 0.025 秒)

    Cooling device for cylindrical, coupleable LED modules
    1.
    发明授权
    Cooling device for cylindrical, coupleable LED modules 有权
    圆柱形，可耦合LED模块的冷却装置

    公开(公告)号：US09360200B2

    公开(公告)日：2016-06-07

    申请号：US13810315

    申请日：2011-07-05

    申请人： Michael Peil ,  Florin Oswald ,  Harald Maiweg ,  Bernd Willer

    发明人： Michael Peil ,  Florin Oswald ,  Harald Maiweg ,  Bernd Willer

    IPC分类号： F21V7/20 ,  F21V29/00 ,  F21K99/00 ,  F21V29/02 ,  F21V29/58 ,  F21Y101/02 ,  F21Y111/00

    CPC分类号： F21V29/51 ,  F21K9/20 ,  F21V29/02 ,  F21V29/30 ,  F21V29/58 ,  F21V29/85 ,  F21Y2107/30 ,  F21Y2115/10

    摘要： A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.

    摘要翻译： 提供一种装置和方法，用于控制LED灯的LED灯或LED模块的温度，特别是用于冷却温度，例如用于固化光固化管。 该装置包括：流体供应管线和连接到供应管线的多个热交换器; 相对于热传递耦合到每个热交换器的多个LED; 和流体回流管线。 流体供应和返回管线以流体密封的方式通过在流体供应源和返回管线的端部中或端部处的L形件和T形件的各种组合彼此连接，使得流体从LED流出 在空间上分离的方式中，流体供应和返回管线具有至少两个彼此平行的流体连接，热交换器被布置在流体连接中或构成流体连接。

    COOLING DEVICE FOR CYLINDRICAL, COUPLEABLE LED MODULES
    2.
    发明申请
    COOLING DEVICE FOR CYLINDRICAL, COUPLEABLE LED MODULES 有权
    用于圆柱形，可耦合LED模块的冷却装置

    公开(公告)号：US20130114263A1

    公开(公告)日：2013-05-09

    申请号：US13810315

    申请日：2011-07-05

    申请人： Michael Peil ,  Florin Oswald ,  Harald Maiweg ,  Bernd Willer

    发明人： Michael Peil ,  Florin Oswald ,  Harald Maiweg ,  Bernd Willer

    IPC分类号： F21V29/00

    CPC分类号： F21V29/51 ,  F21K9/20 ,  F21V29/02 ,  F21V29/30 ,  F21V29/58 ,  F21V29/85 ,  F21Y2107/30 ,  F21Y2115/10

    摘要： A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.

    摘要翻译： 提供一种装置和方法，用于控制LED灯的LED灯或LED模块的温度，特别是用于冷却温度，例如用于固化光固化管。 该装置包括：流体供应管线和连接到供应管线的多个热交换器; 相对于热传递耦合到每个热交换器的多个LED; 和流体回流管线。 流体供应和返回管线以流体密封的方式通过在流体供应源和返回管线的端部中或端部处的L形件和T形件的各种组合彼此连接，使得流体从LED流出 在空间上分离的方式中，流体供应和返回管线具有至少两个彼此平行的流体连接，热交换器被布置在流体连接中或构成流体连接。

    LED lamp for homogeneously illuminating hollow bodies
    4.
    发明授权
    LED lamp for homogeneously illuminating hollow bodies 有权
    LED灯用于均匀照明中空体

    公开(公告)号：US09188289B2

    公开(公告)日：2015-11-17

    申请号：US13637661

    申请日：2011-03-25

    申请人： Michael Peil ,  Florin Oswald ,  Harald Maiweg

    发明人： Michael Peil ,  Florin Oswald ,  Harald Maiweg

    IPC分类号： F21V21/00 ,  F21S4/00 ,  F21K99/00 ,  F21Y101/02 ,  F21Y111/00

    CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10

    摘要： A lighting device is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules, which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module has a plurality of light-emitting LEDs. The lighting device is characterized by at least one pair of the adjacent chip-on-board LED modules being arranged at an angle greater than 0° with respect to the surface normals of the modules.

    摘要翻译： 提供照明装置用于均匀照明弯曲的，不均匀的或多面体的表面。 照明装置具有至少成对地彼此相邻布置的多个扁平的板上LED模块。 每个芯片上的LED模块具有多个发光LED。 照明装置的特征在于至少一对相邻的板上LED模块相对于模块的表面法线以大于0°的角度布置。

    Coating Method for an Optoelectronic Chip-on-Board Module
    9.
    发明申请
    Coating Method for an Optoelectronic Chip-on-Board Module 有权
    光电芯片模块的涂覆方法

    公开(公告)号：US20130193592A1

    公开(公告)日：2013-08-01

    申请号：US13818868

    申请日：2011-08-29

    申请人： Michael Peil ,  Florin Oswald ,  Harald Maiweg

    发明人： Michael Peil ,  Florin Oswald ,  Harald Maiweg

    IPC分类号： H01L33/54 ,  H01L31/0203

    CPC分类号： H01L31/0203 ,  F21K9/00 ,  F21K9/90 ,  F21Y2115/10 ,  H01L21/56 ,  H01L23/3121 ,  H01L25/0753 ,  H01L25/13 ,  H01L31/02322 ,  H01L31/02325 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2933/005 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1316 ,  H01L2924/00

    摘要： A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.

    摘要翻译： 提出了一种用于涂覆光电芯片组件模块的方法，该模块包括平坦衬底，所述平坦衬底填充有一个或多个具有至少一个主要光学布置和可选择的至少一个次级光学布置的光电子部件。 通过以下步骤，将由硅树脂制成的透明耐紫外线和耐温涂层涂覆在光电芯片模块上：（a）将液体硅胶浇铸到朝向顶部打开的模具中，并具有相应的外部尺寸 达到或超过衬底的外部尺寸; （b）将基底插入模具中，其中光电子部件完全浸入硅树脂中，并且基底的表面完全接触硅树脂或基底至少部分地以完全表面接触的方式浸入硅树脂中; （c）固化和交联硅氧烷与光电子部件和基底; 和（d）用固化的硅氧烷涂层从模具中除去基材。

    LED LAMP FOR HOMOGENEOUSLY ILLUMINATING HOLLOW BODIES
    10.
    发明申请
    LED LAMP FOR HOMOGENEOUSLY ILLUMINATING HOLLOW BODIES 有权
    LED灯用于均匀照射中空体

    公开(公告)号：US20130010460A1

    公开(公告)日：2013-01-10

    申请号：US13637661

    申请日：2011-03-25

    申请人： Michael Peil ,  Florin Oswald ,  Harald Maiweg

    发明人： Michael Peil ,  Florin Oswald ,  Harald Maiweg

    IPC分类号： F21V21/00 ,  F21V7/00 ,  F21V5/04 ,  F21V11/00 ,  F21V29/00

    CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10

    摘要： A lighting device (40-40″, 45-45″, 50-50″, 60, 80, 93-93″) is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules (1, 11, 11′, 21, 31, 41-41″, 46-46″, 51-51″, 61-61″, 71-71′″, 811-818), which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module (1, 11, 11′, 21, 31, 41-41″, 46-46″, 51-51″, 61-61″, 71-811-818) has a plurality of light-emitting LEDs (4, 4′, 14, 14′, 24, 34, 64, 72). The lighting device (40-40″, 45-45″, 50-50″, 60, 80, 93-93″) is characterized by at least one pair of the adjacent chip-on-board LED modules (1, 11, 11′, 21, 31, 41-41″, 46-46″, 51-51″, 61-61″, 71-71′″, 811-818) being arranged at an angle greater than 0° with respect to the surface normals of the modules.

    摘要翻译： 提供照明装置（40-40“，45-45”，50-50“，60,80,93-93”）用于均匀照明弯曲的，不均匀的或多面体的表面。 照明装置具有多个扁平的板上LED模块（1,11,11'，21,31,41-41“，46-46”，51-51“，61-61”，71-71 '，811-818），它们至少成对地彼此相邻布置。 每个芯片上的LED模块（1,11,11'，21,31,41-41“，46-46”，51-51“，61-61”，71-811-818）具有多个 发光LED（4,4'，14,14'，24,34,64,72）。 照明装置（40-40“，45-45”，50-50“，60,80,93-93”）的特征在于至少一对相邻的板上LED模块（1,11， 11'，21,31,41-41“，46-46”，51-51“，61-61”，71-71“”，811-818）以相对于 表面法线的模块。