公开(公告)号：US20110095419A1

公开(公告)日：2011-04-28

申请号：US12909096

申请日：2010-10-21

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

IPC分类号： H01L23/498 ,  H01L21/768 ,  H05K1/11 ,  B05D5/12

CPC分类号： H05K3/3436 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01078 ,  H01L2924/12044 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y02P70/613

摘要： There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions.

摘要翻译： 提供导电膜。 导电膜包括：阳极化层，其具有在其厚度方向上延伸穿过其中的多个通孔; 多个线状导体，各自形成在所述通孔中的对应的一个中，并且每个具有从所述阳极氧化层突出的第一和第二突起，其中所述第一突起和所述第二突起中的至少一个被涂覆材料覆盖; 以及形成在所述阳极氧化层上以覆盖所述第一和第二突起中的至少一个的未固化的热固性树脂层。

公开(公告)号：US20120327626A1

公开(公告)日：2012-12-27

申请号：US13528987

申请日：2012-06-21

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K7/06

CPC分类号： H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/10378 ,  Y10T29/49124 ,  H01L2924/00

摘要： One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.

摘要翻译： 一个实施例提供一种布线基板，包括：具有绝缘基底构件的芯基板，所述绝缘基底构件具有第一表面和第二表面;多个线状导体，从所述第一表面穿过所述绝缘基底构件到所述第二表面; 连接到所述绝缘基体的第一表面和所述第二表面中的至少一个的无机材料层; 以及穿透无机材料层的穿透线，其中穿透线的一端电连接到线性导体的相应部分，而不会发生凹凸。

公开(公告)号：US08138609B2

公开(公告)日：2012-03-20

申请号：US12832177

申请日：2010-07-08

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC分类号： H01L23/48

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/4605 ,  H05K2201/0116 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10674 ,  H05K2203/0315 ,  H05K2203/1142 ,  H01L2924/00

摘要： In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.

摘要翻译： 在半导体器件中，衬底包括从衬底的顶表面到底表面穿透衬底的多个线导体。 半导体芯片固定在基板的孔中。 在衬底和半导体芯片的顶表面上形成第一绝缘层。 第一布线层形成在第一绝缘层上，并且经由第一绝缘层的通孔与半导体芯片电连接，一些线导体暴露于一个通孔。 在基板和半导体芯片的底面上形成第二绝缘层。 第二布线层形成在第二绝缘层上，并且经由第二绝缘层的通孔与暴露于通孔的一些线导体电连接。

公开(公告)号：US09460983B2

公开(公告)日：2016-10-04

申请号：US13613720

申请日：2012-09-13

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48 ,  H01L21/50 ,  H01L23/373

CPC分类号： H01L23/3677 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K7/2039 ,  H05K7/20509 ,  H01L2924/00

摘要： A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.

摘要翻译： 热界面材料包括金属箔，其具有第一表面和相对的第二表面，以及多个棒状导体，每个棒状导体的侧表面在金属箔的厚度方向上延伸。 棒状导体沿垂直于厚度方向的平面方向布置在金属箔的第一表面和第二表面中的至少一个上。 树脂层至少覆盖金属箔的第一表面和第二表面以及棒状导体的侧表面。

公开(公告)号：US09006586B2

公开(公告)日：2015-04-14

申请号：US13528987

申请日：2012-06-21

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46

CPC分类号： H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/10378 ,  Y10T29/49124 ,  H01L2924/00

摘要： One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.

摘要翻译： 一个实施例提供一种布线基板，包括：具有绝缘基底构件的芯基板，所述绝缘基底构件具有第一表面和第二表面;多个线状导体，从所述第一表面穿过所述绝缘基底构件到所述第二表面; 连接到所述绝缘基体的第一表面和所述第二表面中的至少一个的无机材料层; 以及穿透无机材料层的穿透线，其中穿透线的一端电连接到线性导体的相应部分，而不会发生凹凸。

公开(公告)号：US08664764B2

公开(公告)日：2014-03-04

申请号：US13493123

申请日：2012-06-11

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

摘要： One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films.

摘要翻译： 一个实施例提供一种半导体器件，其具有：具有第一和第二表面的芯基板和贯穿其中的容纳孔; 容纳在所述容纳孔中使得其前表面位于所述第一表面侧的半导体元件; 形成在所述半导体元件的背面上的第一金属膜; 形成在芯基板的第二表面上的第二金属膜; 覆盖第一和第二金属膜的绝缘层; 以及形成在所述绝缘层上的第三金属膜，经由其穿过所述绝缘层的部分分别到达所述第一和第二金属膜。

公开(公告)号：US08638542B2

公开(公告)日：2014-01-28

申请号：US12833185

申请日：2010-07-09

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC分类号： H01G4/06 ,  H01G4/005 ,  H01G7/00

CPC分类号： H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

摘要： A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

摘要翻译： 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

公开(公告)号：US20130081796A1

公开(公告)日：2013-04-04

申请号：US13613720

申请日：2012-09-13

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： F28F7/00 ,  B32B37/02

CPC分类号： H01L23/3677 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K7/2039 ,  H05K7/20509 ,  H01L2924/00

摘要： A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.

摘要翻译： 热界面材料包括金属箔，其具有第一表面和相对的第二表面，以及多个棒状导体，每个棒状导体的侧表面在金属箔的厚度方向上延伸。 棒状导体沿垂直于厚度方向的平面方向布置在金属箔的第一表面和第二表面中的至少一个上。 树脂层至少覆盖金属箔的第一表面和第二表面以及棒状导体的侧表面。

公开(公告)号：US08324513B2

公开(公告)日：2012-12-04

申请号：US13009987

申请日：2011-01-20

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： H05K1/11

CPC分类号： H01L23/552 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00

摘要： A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole.

摘要翻译： 布线基板包括：芯基板，包括具有第一表面和第二表面的无机介电绝缘基材，以及贯穿绝缘基体的线状导体; 第一表面上的第一布线层，电连接到一部分直线导体; 在所述第二表面上的与所述线状导体的所述部分电连接的第二布线层; 在所述第一表面上覆盖所述第一布线层并包括第一通孔的第一绝缘层; 所述第一绝缘层上的第三布线层经由所述第一通孔与所述第一布线层电连接; 覆盖所述第二布线层并且包括第二通孔的所述第二表面上的第二绝缘层; 以及通过第二通孔与第二布线层电连接的第二绝缘层上的第四布线层。

公开(公告)号：US20130048350A1

公开(公告)日：2013-02-28

申请号：US13588013

申请日：2012-08-17

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： H05K1/05

CPC分类号： H05K3/4608 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/002 ,  H05K3/4061 ,  H05K3/42 ,  H05K2201/09609

摘要： A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.

摘要翻译： 基底构件包括：芯层，包括：由氧化铝制成的板状体; 以及在板状体的厚度方向上穿过板状体的多个线状导体; 形成在芯层的第一表面和第二表面中的至少一个上的结合层; 以及形成在所述接合层上的硅层或玻璃层。