摘要:
A radioactive diagnostic agent for bone scanning, which comprises .sup.99m Tc and a non-radioactive carrier comprising (A) at least one chosen from methanehydroxydiphosphonic acid and their salts and (B) at least one reducing agent for pertechnetates in a weight ratio of about 1:1 to 7:1 and prevents the accumulation of radioactivity in liver so that definite diagnosis can be assured.
摘要:
The compound of the present invention is a component originated from a natural material, camu camu (Myrciaria dubia), has strong antioxidative activity and stable whitening effect, and is represented by the formula (1). The antioxidant, whitening agent, skin preparation for external use, cosmetics, and food of the present invention are characterized by the inclusion of the compound represented by the formula (1).
摘要:
An object of the present invention is to provide a thermosetting die-bonding film having both storage modulus and high adhering strength that are necessary in manufacturing a semiconductor device and to provide a dicing die-bonding film including the thermosetting die-bonding film. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used in manufacture of a semiconductor device and includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, has a storage modulus at 80 to 140° C. before thermal curing in a range of 10 kPa to 10 MPa and a storage modulus at 175° C. before thermal curing in a range of 0.1 to 3 MPa.
摘要:
A compound having the formula [I]: ##STR1## wherein R.sup.1 is hydrogen atom or a lower alkyl group, R.sup.2 is a lower alkyl group, R.sup.3 and R.sup.4 are the same or different each other and each is a hydrogen atom, a halogen atom, a lower alkyl group, a lower haloalkyl group or a lower alkoxy group, X is an oxygen atom, a sulfur atom or a methylene group, and Ar is a pyrimidine-4-yl group, a pyridine-2-yl group, a pyrazine-2-yl group or a pyridazine-3-yl group each of which may be substituted by one or two substituents selected from the group consisting of a halogen atom, a lower alkyl group, a lower alkoxy group and a nitro group, or a pyrimidine-2-yl group which is substituted by one or two substituents selected from the group consisting of a halogen atom, a lower alkyl group and a lower alkoxy group, a process for preparing the same and agricultural and/or horticultural fungicides containing the same as an active ingredient. According to the present invention, the excellent agricultural and/or horticultural fungicides can be provided.
摘要:
The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.
摘要:
The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.
摘要:
The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.
摘要:
A fuel cell is provided, which includes a membrane electrode assembly including an electrolytic film sandwiched between an anode catalyst layer and a cathode catalyst layer, an anode gas diffusion layer disposed adjacent to the anode catalyst layer and a cathode gas diffusion layer disposed adjacent to the cathode catalyst layer, and a pair of separators which are in contact with the anode gas diffusion layer and the cathode gas diffusion layer, respectively. At least one of the separators includes a metallic member having a channel and an oxide layer disposed on a bottom of the channel. The oxide layer includes silica and tin oxide which accounts for 0.0001-30% by weight of silica.
摘要:
The invention relates to antioxidants that make effective use of acerola seeds, which have conventionally been discarded, that have high safety and excellent antioxidative effect in skin preparations for external use, cosmetics, and food, and that contain acerola seed extract as an active component. The invention also relates to skin preparations for external use, cosmetics, and food containing the antioxidant.
摘要:
An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.
摘要翻译:本发明的一个目的是提供一种热塑性芯片接合薄膜,通过该热固性芯片接合薄膜,该拉伸粘合薄膜被适当地断裂。 该目的通过热固性芯片接合来实现,其中至少具有用于将半导体芯片固定到被粘物上的粘合剂层,其中每单位面积的断裂能为1J / mm 2或更小,断裂伸长率 在热固化之前的室温下为40%以上至500%以下。