公开(公告)号：US20110057331A1

公开(公告)日：2011-03-10

申请号：US12875383

申请日：2010-09-03

申请人： Miki Hayashi ,  Shumpei Tanaka ,  Kenji Oonishi ,  Yuuichirou Shishido ,  Kouichi Inoue

发明人： Miki Hayashi ,  Shumpei Tanaka ,  Kenji Oonishi ,  Yuuichirou Shishido ,  Kouichi Inoue

IPC分类号： H01L23/52

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L24/45 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.

摘要翻译： 本发明的一个目的是提供一种热塑性芯片接合薄膜，通过该热固性芯片接合薄膜，该拉伸粘合薄膜被适当地断裂。 该目的通过热固性芯片接合来实现，其中至少具有用于将半导体芯片固定到被粘物上的粘合剂层，其中每单位面积的断裂能为1J / mm 2或更小，断裂伸长率 在热固化之前的室温下为40％以上至500％以下。

公开(公告)号：US08779586B2

公开(公告)日：2014-07-15

申请号：US13036277

申请日：2011-02-28

申请人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

发明人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

IPC分类号： H01L25/11

CPC分类号： H01L24/27 ,  C09J7/10 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/24959 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

摘要翻译： 本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率 防止接合线的变形和切断，以及切割模接合膜。 本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上， 接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

公开(公告)号：US20110210455A1

公开(公告)日：2011-09-01

申请号：US13036277

申请日：2011-02-28

申请人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

发明人： Kenji Oonishi ,  Miki Hayashi ,  Kouichi Inoue ,  Yuichiro Shishido

IPC分类号： H01L23/00 ,  B32B27/38 ,  C09J7/00 ,  B32B7/12

CPC分类号： H01L24/27 ,  C09J7/10 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85206 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/24959 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

摘要翻译： 本发明提供一种芯片接合薄膜，用于通过接合线与另一个半导体元件电连接到与被粘物电连接的半导体元件上，并且能够通过以下方式将其它半导体元件加载并提高半导体器件的制造成品率 防止接合线的变形和切断，以及切割模接合膜。 本发明的芯片接合薄膜是一种芯片接合薄膜，用于将至少一个第一粘合剂层粘合到与接合线电连接到被粘物的半导体元件上， 接合线通过在压接时埋入该部分而通过其内部，并且层压防止另一半导体元件与接合线接触的第二粘合层。

公开(公告)号：US20110074050A1

公开(公告)日：2011-03-31

申请号：US12890909

申请日：2010-09-27

申请人： Yasuhiro Amano ,  Yuuichirou Shishido ,  Kouichi Inoue

发明人： Yasuhiro Amano ,  Yuuichirou Shishido ,  Kouichi Inoue

IPC分类号： B32B33/00 ,  H01L29/00

CPC分类号： H01L21/67132 ,  Y10T428/14

摘要： The present invention provides a film for a semiconductor device, which is capable of preventing interface delamination between each of the films, a film lifting phenomenon, and transfer of the adhesive film onto the cover film even during transportation or after long-term storage in a low temperature condition. The film for a semiconductor device of the present invention is a film in which an adhesive film and a cover film are sequentially laminated on a dicing film, in which a peel force F1 between the adhesive film and the cover film in a T type peeling test is within a range of 0.025 to 0.075 N/100 mm, a peel force F2 between the adhesive film and the dicing film is within a range of 0.08 to 10 N/100 mm, and F1 and F2 satisfy a relationship of F1

摘要翻译： 本发明提供一种半导体装置用薄膜，其能够防止各膜之间的界面分层，膜提起现象，以及即使在运输过程中或长期储存后也将胶粘剂膜转印到覆盖膜上 低温条件。 本发明的半导体装置用薄膜是将粘接薄膜和覆盖薄膜依次层叠在切断薄膜上的薄膜，在T型剥离试验中粘合薄膜与覆盖薄膜的剥离力F1 在0.025〜0.075N / 100mm的范围内，粘合膜与切割膜之间的剥离力F2在0.08〜10N / 100mm的范围内，F1和F2满足F1

公开(公告)号：US20110120614A1

公开(公告)日：2011-05-26

申请号：US12948992

申请日：2010-11-18

申请人： Yuki Sugo ,  Kouichi Inoue ,  Kenji Oonishi

发明人： Yuki Sugo ,  Kouichi Inoue ,  Kenji Oonishi

IPC分类号： H01L21/50 ,  B32B5/00 ,  B32B3/00 ,  C09J7/00 ,  C09J7/02

CPC分类号： C08G59/621 ,  C08L33/00 ,  C08L33/08 ,  C08L61/04 ,  C08L63/00 ,  C08L63/08 ,  C08L71/00 ,  C08L2205/03 ,  C08L2666/02 ,  C09J7/10 ,  C09J133/08 ,  C09J161/06 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/29023 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85097 ,  H01L2224/85205 ,  H01L2224/9205 ,  H01L2224/92165 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/265 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/85399

摘要： The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 μm.

摘要翻译： 本发明提供一种热固性粘合剂膜，其能够通过防止由于在具有未充分填充填料的构造的膜的芯片接合期间的压力导致的半导体芯片的损坏而提高封装可靠性，防止了拉伸储能模量的降低 并且防止由于热固化期间的热收缩而产生翘曲。 作为制造半导体装置时使用的热固性粘合膜，该膜在2×105〜5×107Pa的热固化后的拉伸储能模量为260℃，填料的含量为0.1重量％ 或更低，基于整个热固性粘合剂膜，厚度为1至10μm。

公开(公告)号：US09136192B2

公开(公告)日：2015-09-15

申请号：US14353895

申请日：2012-07-13

申请人： Kouichi Inoue ,  Kazuyoshi Maeda ,  Norihito Shibuya

发明人： Kouichi Inoue ,  Kazuyoshi Maeda ,  Norihito Shibuya

IPC分类号： H01L23/58 ,  H01L29/10 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01J37/317 ,  H01L21/265 ,  H01L33/00

CPC分类号： H01L22/12 ,  H01J37/3171 ,  H01L21/26 ,  H01L21/265 ,  H01L21/67288 ,  H01L21/6838 ,  H01L22/20 ,  H01L22/26 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the substrate for which injection treatment has been performed.

摘要翻译： 翘曲修正装置包括：注射机构，其包括执行注射处理的喷嘴;吸附台，其通过主表面侧或膜表面侧的吸附而保持基板;移动机构，其移动吸附台，使得基板相对移动 相对于喷嘴的注射粒子的注入面积，容纳保持在吸附台上的衬底和进行注射处理的内部的注射处理室，测量衬底的翘曲的测量机构，以及 控制装置，其基于目标翘曲量与通过测量机构测量的翘曲量之间的差异，执行喷射机构的喷射处理条件的设定处理以及喷射机构的喷射处理条件的设定处理 已经进行了注射处理的基底。

公开(公告)号：US08430822B2

公开(公告)日：2013-04-30

申请号：US12854345

申请日：2010-08-11

申请人： Kouichi Inoue

发明人： Kouichi Inoue

IPC分类号： A61B5/02

CPC分类号： A61B5/022 ,  A61B5/02116 ,  A61B5/02141 ,  A61B5/02225 ,  A61B5/7239

摘要： A high-accuracy blood pressure value deriving method that is hardly influenced by individual differences of a person to be measured is provided. A blood pressure measuring apparatus includes a cuff member comprising a compression air bladder, a sub air bladder, and a pulse wave detection air bladder, pressure control means for pressurizing or depressurizing each air bladder, a pressure sensor which senses the internal pressure of each air bladder, pulse wave signal extracting means for extracting time-series data of a pulse wave signal superposed on a cuff internal pressure, in the process during which the pressure control means pressurizes or depressurizes each air bladder, and blood pressure value deriving means for deriving a systolic blood pressure value and/or a diastolic blood pressure value based on a change in feature amount of the pulse wave signal and a cuff internal pressure at a point of time of the change.

摘要翻译： 提供了几乎不受被测量者的个体差异影响的高精度血压值导出方法。 一种血压测量装置，包括：包括压缩空气囊，副气囊和脉搏波检测气囊的袖带构件，用于对每个气囊进行加压或减压的压力控制装置，感测每个空气的内部压力的压力传感器 膀胱脉波信号提取装置，用于在压力控制装置对每个气囊进行加压或减压的过程中提取叠加在袖带内压上的脉搏波信号的时间序列数据;以及血压值导出装置，用于导出 基于脉搏波信号的特征量的变化和在变化的时间点的袖带内部压力的收缩压值和/或舒张压值。

公开(公告)号：US20080066205A1

公开(公告)日：2008-03-13

申请号：US10566326

申请日：2005-02-09

申请人： Haruhiko Murase ,  Kouichi Inoue

发明人： Haruhiko Murase ,  Kouichi Inoue

IPC分类号： A01H4/00 ,  A01G31/00 ,  A01H11/00

CPC分类号： B60W20/13 ,  A01G9/025 ,  A01G20/20 ,  A01H4/005 ,  A01H11/00 ,  B60W10/26 ,  Y02P60/244

摘要： The present invention relates to a method of producing young moss seedlings preferable as greenery plants, by which a plenty of young moss seedlings can be produced with high speed under artificially controlled atmosphere. In nutrient solution, young moss seedlings are grown with regeneration buds 2 bred around gametophytes 1, at a temperature of 0 to 60° C., with photosynthetic active photon flux density (PPFD) of not greater than 200 (μmolm−2s−1), fertilizer concentration (mS/cm) of 0 to 1.0, and by repeating light periods and dark periods in cycles of 24 hours or less duration, aerating and stirring, and controlling growth of young moss seedlings.

摘要翻译： 本发明涉及一种优选作为绿化植物的青苔幼苗的生产方法，通过该方法可以在人为控制的气氛下以高速生产大量的青苔。 在营养液中，年轻苔藓幼苗生长在配子体1附近的再生芽2，温度为0至60℃，光合活性光子通量密度（PPFD）不大于200（mumolm-2 0〜1.0的肥料浓度（mS / cm），以及24小时或更短的持续时间的循环中的光周期和暗期，曝气和搅拌，以及 控制青苔幼苗的生长。

公开(公告)号：US06282677B1

公开(公告)日：2001-08-28

申请号：US09280544

申请日：1999-03-30

申请人： Kouichi Inoue

发明人： Kouichi Inoue

IPC分类号： G06F1100

CPC分类号： H03M13/2782

摘要： An interleaving apparatus is provided which stores input bits temporarily and transfers some of the bits only required to execute an operation to code each of the stored bits to a coding circuit. This allows a storage region to be decreased as compared with a conventional system.

摘要翻译： 提供了一种交织装置，其临时存储输入位，并且传送仅执行将每个存储的比特的每一个编码到编码电路的操作所需的一些比特。 与常规系统相比，这允许存储区域减小。

公开(公告)号：US4666981A

公开(公告)日：1987-05-19

申请号：US742527

申请日：1985-06-07

申请人： Fumihiro Doura ,  Kazuo Asada ,  Kouichi Inoue

发明人： Fumihiro Doura ,  Kazuo Asada ,  Kouichi Inoue

IPC分类号： C08L33/00 ,  C08K5/54 ,  C08K5/56 ,  C08L1/00 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L25/14 ,  C08L27/00 ,  C08L33/02 ,  C08L33/04 ,  C08L83/00 ,  C08L101/00 ,  C08L33/14

CPC分类号： C08K5/54 ,  C08L25/14 ,  C08L83/00

摘要： A resin composition which comprises a coupling agent in an amount of about 0.5 part by weight to about 50 parts by weight against 100 parts by weight of a copolymer composed of an aminoalkyl acrylate and/or aminoalkyl methacrylate and an ethylenically unsaturated monomer.The resin composition excels, as compared with the conventional ones, in terms of any properties to be developed toward a wide range of various substrates inclusive of inorganic materials and plastic materials, such as adherence, water resistance, weathering resistance and yellowing resistance, and consequently are advantageously used in such fields as coatings, adhesives and printing ink.

摘要翻译： 一种树脂组合物，其包含相对于100重量份由丙烯酸氨基烷基酯和/或甲基丙烯酸氨基烷基酯和烯属不饱和单体组成的共聚物，其量为约0.5重量份至约50重量份的偶联剂。 与常规的树脂组合物相比，对于包括无机材料和塑料材料在内的各种基材的宽范围，例如粘附性，耐水性，耐候性和耐黄变性等性能而言，该成分优异，因此 有利地用于涂料，粘合剂和印刷油墨等领域。