Electric cutting-tool grinder
    1.
    发明授权
    Electric cutting-tool grinder 有权
    电动切割工具磨床

    公开(公告)号:US09073166B2

    公开(公告)日:2015-07-07

    申请号:US14110497

    申请日:2012-04-24

    申请人: Makoto Fujimura

    发明人: Makoto Fujimura

    IPC分类号: B24B19/00 B24B3/54 B24B55/02

    CPC分类号: B24B3/54 B24B55/02

    摘要: The grinding surface of a grinding stone is formed from a circular conical surface, a drive device for rotation is installed within a housing. The blade of a cutting tool is ground while the longitudinal direction of the cutting tool is aligned with the direction of a generating line of the grinding surface. When grinding the blade, the cutting tool can be aligned with the direction of the generating line of the grinding surface and the blade can be brought in contact with the grinding surface without the handle of the cutting tool and the hand that holds the cutting tool being interfered with the grinder. This is achieved irrespective of in which one of the directions of lines the tip of the blade faces, the lines being obtained by extending the generating line of the grinding surface from both ends of the generating line.

    摘要翻译: 磨石的磨削表面由圆锥形表面形成,用于旋转的驱动装置安装在壳体内。 切削刀具的刀片在切削刀具的纵向方向与研磨表面的生成线的方向对准时被磨削。 当研磨刀片时,切削刀具可以与磨削表面的生成线的方向对准,并且刀片可以与磨削表面接触而不用切割工具的手柄和保持切削工具的手是 干扰研磨机。 无论刀片的前端的线的方向哪一方面,通过从发电线的两端延伸研磨表面的生成线而获得的线是实现的。

    ELECTRIC CUTTING-TOOL GRINDER
    2.
    发明申请
    ELECTRIC CUTTING-TOOL GRINDER 有权
    电动切割工具磨床

    公开(公告)号:US20140030964A1

    公开(公告)日:2014-01-30

    申请号:US14110497

    申请日:2012-04-24

    申请人: Makoto Fujimura

    发明人: Makoto Fujimura

    IPC分类号: B24B3/54

    CPC分类号: B24B3/54 B24B55/02

    摘要: The grinding surface of a grinding stone is formed from a circular conical surface, a drive device for rotation is installed within a housing. The blade of a cutting tool is ground while the longitudinal direction of the cutting tool is aligned with the direction of a generating line of the grinding surface. When grinding the blade, the cutting tool can be aligned with the direction of the generating line of the grinding surface and the blade can be brought in contact with the grinding surface without the handle of the cutting tool and the hand that holds the cutting tool being interfered with the grinder. This is achieved irrespective of in which one of the directions of lines the tip of the blade faces, the lines being obtained by extending the generating line of the grinding surface from both ends of the generating line.

    摘要翻译: 磨石的磨削表面由圆锥形表面形成,用于旋转的驱动装置安装在壳体内。 切削刀具的刀片在切削刀具的纵向方向与研磨表面的生成线的方向对准时被磨削。 当研磨刀片时,切削刀具可以与磨削表面的生成线的方向对准,并且刀片可以与磨削表面接触,而不需要切割工具的手柄和保持切割工具的手是 干扰研磨机。 无论刀片的前端的线的方向哪一方面,通过从发电线的两端延伸研磨表面的生成线而获得的线是实现的。

    Composite resin molded article, laminate, multi-layer circuit board, and electronic device
    3.
    发明申请
    Composite resin molded article, laminate, multi-layer circuit board, and electronic device 审中-公开
    复合树脂成型品,层压板,多层电路板和电子设备

    公开(公告)号:US20090151984A1

    公开(公告)日:2009-06-18

    申请号:US11990912

    申请日:2006-08-25

    申请人: Makoto Fujimura

    发明人: Makoto Fujimura

    摘要: A composite resin molded article produced by impregnating cloth made from long fibers of a liquid crystal polymer with a curable resin composition which comprises a polymer (A) and a curing agent (B), the polymer (A) having a weight average molecular weight of 10,000 to 250,000 and containing 5 to 60 mol % of a carboxyl group or a carboxylic anhydride group; a method for manufacturing the composite resin molded article; a cured product produced by curing the composite resin molded article; a laminate made by laminating a substrate having a conductive layer (I) on the surface and an electrical insulating layer made of the cured product; a method for manufacturing the laminate; a multilayer circuit board comprising the laminate and a conductive layer (II) formed on an electrical insulating layer of the laminate; a method for manufacturing the circuit board; and an electronic device having the multilayer circuit board are provided. The composite resin molded article and the cured product thereof have excellent flame retardancy, electric insulation properties, and crack resistance, and generates only a very small amount of toxic substances during incineration. The laminate and multilayer circuit board have a low thermal expansion and a high modulus of elasticity. The conductive layer (II) exhibits high adhesion to a smooth electrical insulating layer, even if conductive layer (II) is formed on the electrical insulating layer by a deposition method and thus possesses high reliability. The multilayer circuit board has excellent electrical properties, and therefore can be used suitably as a substrate for a semiconductor device such as a CPU and memory, as well as other surface-mounted components in electronic devices.

    摘要翻译: 将由液晶聚合物的长纤维制成的布用含有聚合物(A)和固化剂(B)的固化性树脂组合物浸渍而成的复合树脂成型体,所述聚合物(A)的重均分子量 10,000〜250,000,含有5〜60摩尔%的羧基或羧酸酐基; 复合树脂成型体的制造方法; 通过固化复合树脂模塑制品而生产的固化产物; 通过在表面上层叠具有导电层(I)的基板和由固化物形成的电绝缘层而制成的层压体; 层压体的制造方法; 包括所述层叠体的多层电路板和形成在所述层叠体的电绝缘层上的导电层(II) 制造电路板的方法; 并提供具有多层电路板的电子设备。 复合树脂成型体及其固化物具有优异的阻燃性,电绝缘性,耐裂纹性,并且在焚烧期间仅产生非常少量的有毒物质。 层压板和多层电路板具有低热膨胀和高弹性模量。 即使通过沉积方法在电绝缘层上形成导电层(II),导电层(II)对光滑的电绝缘层具有高粘合性,因此具有高的可靠性。 多层电路板具有优异的电性能,因此可以适当地用作诸如CPU和存储器的半导体器件的基板以及电子设备中的其它表面安装部件。

    CURABLE RESIN COMPOSITION, CURED PRODUCT, SURFACE TREATED CURED PRODUCT, AND LAMINATE
    4.
    发明申请
    CURABLE RESIN COMPOSITION, CURED PRODUCT, SURFACE TREATED CURED PRODUCT, AND LAMINATE 审中-公开
    可固化树脂组合物,固化产品,表面处理固化产品和层压板

    公开(公告)号:US20130309512A1

    公开(公告)日:2013-11-21

    申请号:US13997928

    申请日:2011-12-27

    IPC分类号: H05K1/02

    摘要: A curable resin composition comprised of an alicyclic olefin polymer (A) which has polar groups, a curing agent (B), a hindered phenol compound (C), and a hindered amine compound (D) is provided. According to the curable resin composition of the present invention, it is possible to give a cured product which is small in surface roughness when treated on its surface by an aqueous solution of a permanganate, which is excellent in adhesion to a conductor layer, which is high in peel strength, and which is excellent in electrical characteristics.

    摘要翻译: 提供由具有极性的脂环族烯烃聚合物(A),固化剂(B),受阻酚化合物(C)和受阻胺化合物(D)组成的固化性树脂组合物。 根据本发明的固化性树脂组合物,可以得到表面粗糙度小的固化物,该表面粗糙度在表面上通过与导体层的粘合性优异的高锰酸盐水溶液处理, 剥离强度高,电特性优异。

    Pyrazole derivatives, method for producing the same and agricultural
and/or horticultural fungicides containing the same as active ingredient
    5.
    发明授权
    Pyrazole derivatives, method for producing the same and agricultural and/or horticultural fungicides containing the same as active ingredient 失效
    吡唑衍生物,其生产方法和含有该活性成分的农业和/或农药类杀真菌剂

    公开(公告)号:US5189040A

    公开(公告)日:1993-02-23

    申请号:US701240

    申请日:1991-05-16

    IPC分类号: C07D401/12 C07D403/12

    CPC分类号: C07D401/12 C07D403/12

    摘要: A compound having the formula [I]: ##STR1## wherein R.sup.1 is hydrogen atom or a lower alkyl group, R.sup.2 is a lower alkyl group, R.sup.3 and R.sup.4 are the same or different each other and each is a hydrogen atom, a halogen atom, a lower alkyl group, a lower haloalkyl group or a lower alkoxy group, X is an oxygen atom, a sulfur atom or a methylene group, and Ar is a pyrimidine-4-yl group, a pyridine-2-yl group, a pyrazine-2-yl group or a pyridazine-3-yl group each of which may be substituted by one or two substituents selected from the group consisting of a halogen atom, a lower alkyl group, a lower alkoxy group and a nitro group, or a pyrimidine-2-yl group which is substituted by one or two substituents selected from the group consisting of a halogen atom, a lower alkyl group and a lower alkoxy group, a process for preparing the same and agricultural and/or horticultural fungicides containing the same as an active ingredient. According to the present invention, the excellent agricultural and/or horticultural fungicides can be provided.

    METHOD OF MANUFACTURING ELECTRONIC DEVICE
    6.
    发明申请
    METHOD OF MANUFACTURING ELECTRONIC DEVICE 审中-公开
    制造电子器件的方法

    公开(公告)号:US20100203713A1

    公开(公告)日:2010-08-12

    申请号:US12733595

    申请日:2008-09-05

    IPC分类号: H01L21/28 H01L21/20

    摘要: An object of this invention is to provide a method for manufacturing an electronic device wherein a conductor layer is uniformly formed on a substrate having a super large area. In the method for manufacturing the electronic device, a metal film for forming a gate electrode is selectively embedded in a transparent resin film formed on a substrate, and the metal film is formed by sputtering directly on the substrate at the gate electrode portion, and on an insulating coat film on portions other than the gate electrode portion. The metal film on the insulating coat film is removed by chemical liftoff with removal of the insulating coat film by etching.

    摘要翻译: 本发明的目的是提供一种电子器件的制造方法,其中导体层均匀地形成在具有超大面积的基片上。 在电子设备的制造方法中,用于形成栅电极的金属膜选择性地嵌入到形成在基板上的透明树脂膜中,并且金属膜通过在栅电极部分处直接溅射在基板上而形成, 在除了栅电极部分之外的部分上的绝缘涂膜。 通过化学剥离除去绝缘涂膜上的金属膜,通过蚀刻除去绝缘涂膜。