摘要:
The proliferation of cardiomyocytes is induced by expressing cyclin and CDK in the cardiomyocytes, and by suppressing the function or action of a Cip/Kip family protein or inhibiting the production of a Cip/Kip family protein. Among the Cip/Kip family proteins, it is preferable to suppress the function of p27KiP1 or inhibiting the production thereof. As a recombinant vector to be used therefor, there is provided a vector comprising: (1) a cyclin gene; (2) a cyclin-dependent kinase gene; and (3) one or a plurality selected from the group consisting of a gene encoding a factor that inhibits the function or action of a Cip/Kip family protein and a nucleic acid sequence that inhibits the production of Cip/Kip family protein.
摘要:
An insulated gate FET such as a power MOS FET is made by forming a rectangular parallelepiped-shaped recess in a direction that the side walls of the recess make 45.degree. angle against the direction of the silicon substrate having (100) plane as principal surface, and the vertical side walls of (010) or (001) planes are used as channel region of the insulated gate FET, thereby assuring a large electron mobility in the channel, hence low channel resistance suitable for high power operation.
摘要:
An epitaxial layer having a specified conductivity type formed on a semiinsulative or high resistivity semiconductor substrate or insulative substrate is anodized (anodically oxidized) by a predetermined D.C. current under an illumination of light of a predetermined intensity, thereby a depletion layer is formed beneath an oxide layer, which is formed by the anodizing, and the anodizing ceases in areas where the bottom face of the depletion layer reaches the semiinsulative or high resistivity semiconductor substrate or insulative substrate thus retaining a layer of highly uniform thickness layer of the epitaxial grown layer on the substrate.
摘要:
Provided is a particulate combustion catalyst including a carrier formed of monoclinic zirconium oxide particles, and metallic Ag or Ag oxide, which serves as a catalyst component and is supported on the carrier, wherein the amount of the catalyst component is 0.5 to 10 mass %, as reduced to metallic Ag, on the basis of the mass of the carrier, and preferably, the catalyst has a BET specific surface area of 8 to 21 m2/g. Also provided are a particulate filter coated with the particulate combustion catalyst; and an exhaust gas cleaning apparatus including a particulate filter coated with the particulate combustion catalyst.
摘要:
In the process of forming a thermal oxide film or heat treatment of an oxide film in making a semiconductor device comprising a compound semiconductor of arsenic, the semiconductor is handled in an atmosphere containing arsenic oxide vapor in order to prevent evaporation of the arsenic tri-oxide in the thermal oxidation film or the oxide film under heat treatment, thereby to form a thermal oxide film having good chemical stability and good electrical characteristics, or to improve the oxide film so as to have good chemical stability and good electrical characteristics.
摘要:
A novel self-align type method of making an FET with a very short gate length and a good high frequency characteristic, and a low noise characteristic, the method comprising the steps of:forming on a silicon epitaxial layer (13) of n-type conductivity a doped oxide film (14) containing boron as an impurity to give p-type conductivity,forming a mask (15a, 16a) containing Si.sub.3 N.sub.4 film and having a width larger than that of a gate region (19) to be formed on said n-type epitaxial layer (13),etching said doped oxide film (14) by utilizing said mask (15a, 16a) as an etching mask to expose surface of said silicon crystal layer (13) in a manner that sides of the part of said doped oxide film (14) covered by said mask (15, 16a) are side-etched by a predetermined width,ion-implanting an impurity of said first conductivity type into said n-type epitaxial layer (13) by utilizing said mask as implanting mask, andcarrying out a heat treating thereby diffusing said second conductivity type impurity from said doped oxide film (14) retained only under said mask into said n-type epitaxial layer (13) to form said gate region (19) and driving said ion-implanted first conductivity type impurity into said silicon crystal layer (13) to form a source region (17) and a drain region (18).
摘要翻译:一种制造具有非常短的栅极长度和良好的高频特性以及低噪声特性的FET的新型自对准型方法,该方法包括以下步骤:在n型硅外延层(13)上形成 电导率为含有硼作为杂质的掺杂氧化物膜(14)以产生p型导电性,形成包含Si 3 N 4膜的掩模(15a,16a),其宽度大于所述栅极区域(19)的宽度 通过利用所述掩模(15a,16a)作为蚀刻掩模蚀刻所述掺杂氧化物膜(14),以使得所述硅晶体层(13)的所述一部分的侧面 将由所述掩模(15,16a)覆盖的所述掺杂氧化物膜(14)以预定宽度进行侧蚀刻,通过利用所述掩模将所述第一导电类型的杂质离子注入所述n型外延层(13) 植入掩模,并进行热处理,从而扩散所述第二导电型不动杆 将所述掺杂氧化物膜(14)保留在所述掩模内的所述n型外延层(13)中以形成所述栅极区域(19)并将所述离子注入的第一导电类型杂质驱动到所述硅晶体层(13)中, 以形成源极区(17)和漏极区(18)。
摘要:
Both source-electrodes (S1 and S2) or both drain-electrodes of a pair of field-effect transistors (FETs) (F1 and F2) of n-channel type and p-channel type, respectively, both to be electrically actuated in a depletion mode are connected to each other, or the source of one FET and the drain of the other FET are connected to each other, through a variable resistance element (F3) inbetween, whereby the pair of FETs (F1 and F3) are series-connected through the variable resistance element (F3) inbetween, the gate-electrode (g1 or g2) of each FET is connected to the drain-electrode (d2 or d1) or the source-electrode of the other FET (F2 or F1) that is not connected to the variable resistance element (F3), and a pair of external terminals (1 and 2) are connected to said gate electrodes (g1, g2) those are connected to said drain electrodes (d2 and d1) or source electrodes.When a voltage of specified range is applied across both non-series-connected electrodes, i.e., the two external terminals, the resulting voltage-current characteristic presents a so-called dynatron-type characteristic, producing a negative-resistance phenomenon, and a curve of voltage-current characteristic changes responding to the value of control signal to the variable resistance element.Since this device is a negative resistance of variable characteristic this device can be utilized for switching, signal relaying, memorization and other various controlling or data processing uses.