Semiconductor device
    3.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US06509579B2

    公开(公告)日:2003-01-21

    申请号:US09760959

    申请日:2001-01-16

    IPC分类号: H01L2906

    摘要: To provide a semiconductor device capable of preventing the bowing of the substrate, and having a semiconductor layer of a III-V group compound of a nitride system with excellent crystallinity. The semiconductor layer of the III-V group compound of the nitride system whose thickness is equal to or less than 8 &mgr;m, is provided onto a substrate made of sapphire. This reduces the bowing of the substrate due to differences in a thermal expansion coefficient and a lattice constant between the substrate and the semiconductor layer of the III-V group compound of the nitride system. An n-side contact layer forming the semiconductor layer of the III-V group of the nitride system has partially a lateral growth region made by growing in a lateral direction from a crystalline part of a seed crystal layer. In the lateral growth region, dislocation density restricts low, therefore, regions corresponding to the lateral growth region of each layer formed onto the n-side contact layer has excellent crystallinity.

    摘要翻译: 提供能够防止基板弯曲的半导体器件,并且具有具有优异结晶度的氮化物系的III-V族化合物的半导体层。氮化物体系的III-V族化合物的半导体层的厚度 等于或小于8μm,设置在由蓝宝石制成的基板上。 由于氮化物系III-V族化合物的基板与半导体层之间的热膨胀系数和晶格常数的差异,这减少了基板的弯曲。 形成氮化物体系的III-V族的半导体层的n侧接触层部分地是由晶种层的结晶部分沿横向生长而形成的横向生长区域。 在横向生长区域中,位错密度低,因此,与形成在n侧接触层上的各层的横向生长区域对应的区域具有优异的结晶性。

    Growth method of a nitride III-V compound semiconductor, manufacturing method of a semiconductor device, and semiconductor device
    6.
    发明授权
    Growth method of a nitride III-V compound semiconductor, manufacturing method of a semiconductor device, and semiconductor device 有权
    氮化物III-V族化合物半导体的生长方法,半导体装置的制造方法以及半导体装置

    公开(公告)号:US06682991B1

    公开(公告)日:2004-01-27

    申请号:US09448584

    申请日:1999-11-24

    IPC分类号: H01L2120

    摘要: When making a growth mask on a substrate and using the growth mask to selectively grow nitride III-V compound semiconductors on the substrate, a multi-layered film including a nitride forming at least its top surface is used as the growth mask. The growth mask may be combination of an oxide film and a nitride film thereon, combination of a metal film and a nitride film thereon, combination of an oxide film, a film thereon made up of a nitride and an oxide, and a nitride film thereon, or combination of a first metal film, a second metal film thereon different from the first metal film and a nitride film thereon, for example. The oxide film may be a Si02, for example, the nitride film may be a TiN film or a SiN film, the film made up of a nitride and an oxide may be a SiNO film, and the metal film may be a Ti film or a Pt film, for example.

    摘要翻译: 当在衬底上制造生长掩模并且使用生长掩模在衬底上选择性地生长氮化物III-V化合物半导体时,使用包括至少形成其顶表面的氮化物的多层膜作为生长掩模。 生长掩模可以是其上的氧化物膜和氮化物膜的组合,其上的金属膜和氮化物膜的组合,氧化物膜,由氮化物和氧化物组成的膜以及氮化物膜上的氮化物膜的组合 ,或第一金属膜,与第一金属膜不同的第二金属膜和其上的氮化物膜的组合。 氧化膜可以是SiO 2,例如,氮化膜可以是TiN膜或SiN膜,由氮化物和氧化物构成的膜可以是SiNO膜,并且金属膜可以是Ti膜或 例如Pt膜。

    Multi-beam semiconductor laser device
    7.
    发明授权
    Multi-beam semiconductor laser device 失效
    多光束半导体激光器件

    公开(公告)号:US07149235B2

    公开(公告)日:2006-12-12

    申请号:US11132981

    申请日:2005-05-19

    IPC分类号: H01S5/00

    摘要: A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 μm. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 μm while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 μm.

    摘要翻译: 提供能够发射具有均匀光输出水平的各激光束并且能够容易对准的多光束半导体激光器装置。 该多光束半导体激光器件(40)是具有能够发射具有相同波长的激光束的四个激光条纹(42A,42B,42C和42D)的GaN基多光束半导体激光器件。 相应的激光振荡区域(42A至42D)在形成在蓝宝石衬底(44)上的台面结构(46)上设置有p型公共电极(48),并具有活性区域(50A, 50B,50C和50D)。 在n型GaN接触层(54)上设置两个n型电极(52A和52B),并且位于与台面结构(46)的两侧的p型公共电极(48)相对的公共电极 )。 激光条纹(42A)与激光条纹(42D)之间的距离A不大于100μm。 激光条纹(42A)和n型电极(52B)之间的距离B 1 <1>不大于150μm,而激光之间的距离B 2 <2> 条纹(42D)和n型电极(52A)不大于150μm。

    Multi-beam semiconductor laser device
    8.
    发明申请
    Multi-beam semiconductor laser device 失效
    多光束半导体激光器件

    公开(公告)号:US20050218422A1

    公开(公告)日:2005-10-06

    申请号:US11132981

    申请日:2005-05-19

    摘要: A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 μm. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 μM while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 μm.

    摘要翻译: 提供能够发射具有均匀光输出水平的各激光束并且能够容易对准的多光束半导体激光器装置。 该多光束半导体激光器件(40)是具有能够发射具有相同波长的激光束的四个激光条纹(42A,42B,42C和42D)的GaN基多光束半导体激光器件。 相应的激光振荡区域(42A至42D)在形成在蓝宝石衬底(44)上的台面结构(46)上设置有p型公共电极(48),并具有活性区域(50A, 50B,50C和50D)。 在n型GaN接触层(54)上设置两个n型电极(52A和52B),并且位于与台面结构(46)的两侧的p型公共电极(48)相对的公共电极 )。 激光条纹(42A)与激光条纹(42D)之间的距离A不大于100μm。 激光条纹(42A)和n型电极(52B)之间的距离B 1 <1>不大于150μm,而激光器之间的距离B <2 <2> 条纹(42D)和n型电极(52A)不大于150μm。

    Multi-beam semiconductor laser element
    9.
    发明授权
    Multi-beam semiconductor laser element 失效
    多光束半导体激光元件

    公开(公告)号:US06950451B2

    公开(公告)日:2005-09-27

    申请号:US10480568

    申请日:2002-06-14

    摘要: A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 μm. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 μm while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 μm.

    摘要翻译: 提供能够发射具有均匀光输出水平的各激光束并且能够容易对准的多光束半导体激光器装置。 该多光束半导体激光器件(40)是具有能够发射具有相同波长的激光束的四个激光条纹(42A,42B,42C和42D)的GaN基多光束半导体激光器件。 相应的激光振荡区域(42A至42D)在形成在蓝宝石衬底(44)上的台面结构(46)上设置有p型公共电极(48),并具有活性区域(50A, 50B,50C和50D)。 在n型GaN接触层(54)上设置两个n型电极(52A和52B),并且位于与台面结构(46)的两侧的p型公共电极(48)相对的公共电极 )。 激光条纹(42A)与激光条纹(42D)之间的距离A不大于100μm。 激光条纹(42A)和n型电极(52B)之间的距离B 1 <1>不大于150μm,而激光之间的距离B 2 <2> 条纹(42D)和n型电极(52A)不大于150μm。