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    Process for forming printed wiring by electroless deposition
    3.
    发明授权
    Process for forming printed wiring by electroless deposition 失效
    通过无电沉积形成印刷线路的工艺

    公开(公告)号：US4239813A

    公开(公告)日：1980-12-16

    申请号：US33218

    申请日：1979-04-25

    申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yoichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita

    发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yoichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita

    IPC分类号： C23C18/16 ,  H05K3/18 ,  C23C3/02 ,  H01B5/14

    CPC分类号： H05K3/185 ,  C23C18/1605

    摘要： Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.

    摘要翻译： 在绝缘基板上形成的高精度布线可以通过无电沉积而不使用印刷工艺获得。 所述方法的特征在于，在基材上形成含有光固化物质的粘合剂层，将粘合剂层成像曝光于光化反射光，以仅照射形成布线的部分以外的部分，以粗糙化溶液处理基材表面 以使不暴露于光化光的部分粗糙化，并进行常规的无电沉积处理，以便在不暴露于光化的光的部分上形成规定的布线。

    Electroless copper solution
    4.
    发明授权
    Electroless copper solution 失效
    无电解铜溶液

    公开(公告)号：US4099974A

    公开(公告)日：1978-07-11

    申请号：US665708

    申请日：1976-03-10

    申请人： Hirosada Morishita ,  Mineo Kawamoto ,  Motoyo Wajima ,  Kanji Murakami

    发明人： Hirosada Morishita ,  Mineo Kawamoto ,  Motoyo Wajima ,  Kanji Murakami

    IPC分类号： H05K3/18 ,  C23C18/40 ,  C23C3/02

    CPC分类号： C23C18/405

    摘要： An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting agent such as alkali hydroxide as main components.The present copper solution can provide not only a higher elongation of deposited film, but also higher depositing rate, about 3 - 4 .mu.m/hr, which is equal or superior to that of the conventional art.

    摘要翻译： 提供能够形成具有比电沉积铜膜高的伸长率的无电沉积铜膜的无电解铜溶液，其特征在于加入2,2'-二吡啶基或2,9-二甲基-1,10- 菲咯啉和聚乙二醇与众所周知的含有铜盐的化学镀铜溶液如硫酸铜，络合剂如乙二胺四乙酸，还原剂如福尔马林以及pH调节剂如碱金属氢氧化物作为主要成分 。

    Thermosetting resin composition comprising dicyanamide and polyvalent imide
    5.
    发明授权
    Thermosetting resin composition comprising dicyanamide and polyvalent imide 失效
    包含二氰胺和多价酰亚胺的热固性树脂组合物

    公开(公告)号：US4482703A

    公开(公告)日：1984-11-13

    申请号：US435766

    申请日：1982-10-20

    申请人： Akio Takahashi ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita

    发明人： Akio Takahashi ,  Takeshi Shimazaki ,  Motoyo Wajima ,  Hirosada Morishita

    IPC分类号： C08G73/00 ,  C08G73/06 ,  C08G73/12 ,  C09D179/08 ,  C08G73/10

    CPC分类号： C08G73/12

    摘要： A thermosetting resin composition comprises (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds. A thermosetting prepolymer can be obtained by subjecting the composition to a preliminary reaction with heating to the B stage and this prepolymer can give a cured product having excellent heat resistance of class C and flexibility. An exemplary composition containing 60 parts by wt. of 4,4'-dicyanomidodiphenylmethane and 40 parts by wt. of N,N'-4,4'-diphenylmethane bismaleimide dissolved in methyl Cellosolve is reacted at 70.degree. to 110.degree. C. for about 40 minutes to obtain a prepolymer soluble in methyl ethyl ketone. This prepolymer when admixed with 2-ethyl-4-methyl-imidazole and after removal of the methyl cellusolve will form an insoluble and infusible cured product upon heating at temperatures on the order of 170.degree. to 200.degree. C. for about 80 minutes. The resin composition when admixed with a solvent, is useful for impregnation and when used as a powder, it is useful as a molding resin.

    摘要翻译： 热固性树脂组合物包含（A）至少一种二氰酰胺化合物和（B）至少一种具有一个或多个不饱和键的多价酰亚胺，并且如果需要（C）至少一种环氧化合物的可聚合化合物，酚类化合物和三烯丙基异氰脲酸酯化合物 。 通过将加热至B阶段的组合物进行预反应，可以获得热固性预聚物，该预聚物可以得到具有优异的C级耐热性和柔软性的固化产物。 含有60重量份的示例性组合物 的4,4'-二氰基二苯基甲烷和40重量份。 溶解在甲基溶纤剂中的N，N'- 4,4'-二苯基甲烷双马来酰亚胺在70〜110℃下反应约40分钟，得到可溶于甲基乙基酮的预聚物。 当与2-乙基-4-甲基 - 咪唑混合并且除去甲基溶液后，该预聚物将在约170℃至200℃的温度下加热约80分钟时形成不溶性和不可渗透的固化产物。 当与溶剂混合时，树脂组合物可用于浸渍，并且当用作粉末时，其可用作模制树脂。

    Bismide-ether compounds, compositions thereof, and method of producing same
    6.
    发明授权
    Bismide-ether compounds, compositions thereof, and method of producing same 失效
    二苯醚类化合物及其组合物及其制备方法

    公开(公告)号：US4296219A

    公开(公告)日：1981-10-20

    申请号：US5233

    申请日：1979-01-22

    申请人： Akio Takahashi ,  Yutaka Itoh ,  Motoyo Wajima ,  Hirosada Morishita ,  Akio Nishikawa

    发明人： Akio Takahashi ,  Yutaka Itoh ,  Motoyo Wajima ,  Hirosada Morishita ,  Akio Nishikawa

    IPC分类号： C07D207/44 ,  C07D207/448 ,  C08G73/12

    CPC分类号： C07D207/448 ,  C08G73/121

    摘要： A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R.sub.3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R.sub.1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R.sub.2 or R'.sub.2, the oxygen atoms between the groups R.sub.2 and R.sub.3 being directly connected to an aromatic nucleus of the group R.sub.3, and n is an integer of zero, one or more than 1.

    摘要翻译： 通过使烯键式不饱和二羧酸酐，二胺化合物和分子中至少两个羟基的酚类化合物反应，或者使酸酐与二胺化合物的预聚物与 酚类化合物：其中R1是含有至少两个碳原子的基团，R2是含有至少两个碳原子的基团，R'2是含有至少两个碳原子的基团和碳 - 碳双键，R3 是芳族基团，酰亚胺环的氮原子直接连接到基团R1的不同碳原子上，酰亚胺环的羰基直接连接到基团R 2或R'2的不同碳原子上，氧原子 在基团R 2和R 3直接连接到基团R 3的芳香环上，且n是0，1或1以上的整数。

    Process for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimide
    9.
    发明授权
    Process for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimide 失效
    由多官能马来酰亚胺和双马来酰亚胺的混合物制备热固性预聚物的方法

    公开(公告)号：US4283522A

    公开(公告)日：1981-08-11

    申请号：US71518

    申请日：1979-08-31

    申请人： Akio Takahashi ,  Yutaka Itoh ,  Motoyo Wajima ,  Hirosada Morishita ,  Kenji Tsukanishi

    发明人： Akio Takahashi ,  Yutaka Itoh ,  Motoyo Wajima ,  Hirosada Morishita ,  Kenji Tsukanishi

    IPC分类号： C08G73/12 ,  C08J5/24 ,  C08G69/26 ,  C08G73/10

    CPC分类号： C08G73/121

    摘要： A process for preparing a thermosetting maleimide type prepolymer which comprises heating (A) a polyfunctional maleimide compound derived from a polyamine prepared from aniline and formalin, (B) a bis-maleimide and (C) a diamine. The thermosetting maleimide type prepolymer prepared according to the process of the present invention is excellent in solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having excellent heat resisting properties.

    摘要翻译： 一种制备热固性马来酰亚胺型预聚物的方法，其包括加热（A）由苯胺和福尔马林制备的多胺衍生的多官能马来酰亚胺化合物，（B）双马来酰亚胺和（C）二胺。 根据本发明的方法制备的热固性马来酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中的溶解性优异，可以低成本获得。 因此，预聚物有利地用于生产具有优异的耐热性能的层压板。