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1.发明申请Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof 有权电路材料，电路，多层电路及其制造方法公开(公告)号：US20050173780A1
公开(公告)日：2005-08-11
申请号：US11039378
申请日：2005-01-19
申请人： Murali Sethumadhavan , Vincent Landi , Luis Borges
发明人： Murali Sethumadhavan , Vincent Landi , Luis Borges
IPC分类号： C08G77/04 , H05K1/03 , H05K3/46 , H01L23/58 , H01L21/4763
CPC分类号： H05K1/032 , H05K1/0366 , H05K3/4626 , H05K2201/0162 , H05K2201/0212 , Y10T428/31663
摘要： An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.
摘要翻译： 一种具有设置在基底上的导电层的电路材料，其中所述基底包含包含共价结合的多面体倍半硅氧烷（POSS）的有机或无机聚合物。 基材还可以包含另外的分散POSS，任何其它填料，包括纤维网。 使用共价结合的POSS可以在具有可接受的介电常数和耗散因子的组合物中具有阻燃性。
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2.发明申请Circuit substrate material, circuits comprising the same, and method of manufacture thereof 审中-公开电路基板材料，包括该电路基板的电路及其制造方法公开(公告)号：US20060141132A1
公开(公告)日：2006-06-29
申请号：US11355715
申请日：2006-02-16
申请人： Murali Sethumadhavan , Vincent Landi , Bruce Kosa
发明人： Murali Sethumadhavan , Vincent Landi , Bruce Kosa
IPC分类号： B05D5/12
CPC分类号： H05K1/032 , B32B27/04 , C08K3/22 , C08K3/36 , C08K5/14 , C08L9/00 , C08L27/12 , H05K1/0373 , H05K2201/015 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24917 , Y10T428/249933 , Y10T428/25 , Y10T428/3154 , Y10T428/31605 , Y10T428/31609 , Y10T428/31707 , C08L2666/04
摘要： An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.
摘要翻译： 一种电路材料，其具有设置在衬底上的导电层，其中所述衬底由包含聚丁二烯或聚异戊二烯树脂的热固性组合物形成; 任选的官能化液体聚丁二烯或聚异戊二烯树脂; 任选的含丁二烯或含异戊二烯的共聚物; 任选的低分子量聚合物; 任选的固化剂; 交联剂; 颗粒状含氟聚合物; 和约20至约50重量％，基于热固性组合物的总重量，具有低离子含量的氢氧化镁。 使用氢氧化镁可使组合物达到高水平的阻燃性，而不使用卤化阻燃剂，同时保持良好的吸湿性和其他物理性能。
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公开(公告)号：US20060258241A1
公开(公告)日：2006-11-16
申请号：US11382513
申请日：2006-05-10
申请人： E. Roseen , Murali Sethumadhavan
发明人： E. Roseen , Murali Sethumadhavan
CPC分类号： H05K1/0366 , B29C70/00 , B29C70/025 , B29K2105/0079 , B32B3/26 , B32B5/02 , B32B5/022 , B32B5/024 , B32B27/12 , B32B27/20 , B32B27/38 , B32B2260/021 , B32B2307/202 , B32B2307/204 , B32B2307/5825 , B32B2307/726 , B32B2307/734 , B32B2457/08 , H05K2201/0141 , H05K2201/0278 , Y10S428/901 , Y10T442/2016 , Y10T442/2041 , Y10T442/2418
摘要： A method of forming a dielectric substrate comprises contacting a liquid crystalline polymer fibrous web having a thickness of 5 mils (127 micrometers) or less with a resin composition to form a dielectric composite. Contacting is carried out under vacuum, followed by pressure. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent dielectric strength.
摘要翻译： 形成电介质基片的方法包括将具有5密耳（127微米）或更小厚度的液晶聚合物纤维网与树脂组合物接触以形成电介质复合材料。 接触在真空下进行，然后进行压力。 电介质基板在电路材料，电路和多层电路中是有用的，经济地制造并且具有优异的介电强度。
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4.发明授权Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom 有权液晶聚合物复合材料，其制造方法和由其形成的制品公开(公告)号：US06994896B2
公开(公告)日：2006-02-07
申请号：US10663375
申请日：2003-09-16
申请人： Murali Sethumadhavan , Richard T. Traskos , Michael E. St. Lawrence , Sankar K. Paul , Luis D. Borges , Allen F. Horn, III
发明人： Murali Sethumadhavan , Richard T. Traskos , Michael E. St. Lawrence , Sankar K. Paul , Luis D. Borges , Allen F. Horn, III
CPC分类号： B32B15/04 , B32B7/12 , B32B15/20 , B32B27/12 , B32B27/20 , B32B27/365 , B32B37/153 , B32B2037/243 , B32B2307/204 , B32B2307/3065 , B32B2307/704 , B32B2311/12 , B32B2369/00 , B32B2457/00 , C08K3/36 , C08L27/18 , C08L67/00 , C09K19/38 , C09K19/54 , C09K2219/03 , H05K1/0366 , H05K1/0373 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0141 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , Y10T428/1086 , Y10T428/1095 , Y10T428/24917 , Y10T428/24994 , Y10T428/252 , Y10T428/254 , C08L2666/04
摘要： A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.
摘要翻译： 包含液晶聚合物，颗粒填料和纤维网的液晶复合材料。 进一步公开了形成液晶聚合物复合材料的方法。 液晶聚合物复合材料在电路材料，电路和多层电路中是有用的，制造经济，并且具有优异的阻燃性能。
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公开(公告)号：US07180172B2
公开(公告)日：2007-02-20
申请号：US10873405
申请日：2004-06-21
IPC分类号： H01L23/14
CPC分类号： H05K1/0373 , H05K2201/0141 , H05K2201/0212
摘要： A dielectric material for use in a circuit material comprises a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (POSS) filler. Such dielectric materials may provide a variety of advantageous properties, especially in high frequency circuits.
摘要翻译： 用于电路材料的介电材料包括液晶聚合物和多面体低聚倍半硅氧烷（POSS）填料。 这种介电材料可以提供各种有利的特性，特别是在高频电路中。
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6.发明授权公开(公告)号：US07931964B2
公开(公告)日：2011-04-26
申请号：US12100802
申请日：2008-04-10
申请人： Murali Sethumadhavan
发明人： Murali Sethumadhavan
CPC分类号： B32B3/26 , H01M2/145 , H01M2/166 , H01M10/052 , Y10T428/249978 , Y10T428/249979 , Y10T428/249991 , Y10T428/249992
摘要： A microporous layer comprising a microporous xerogel comprising pores that are substantially continuously interconnected from a first outermost surface of the microporous xerogel through to a second outermost surface of the microporous xerogel; and a crosslinked polymer binder comprising a polymer having a glass transition temperature of about 50° C. or higher, wherein the polymer binder is water soluble prior to crosslinking.
摘要翻译： 一种微孔层，其包含微孔干凝胶，其包含从微孔干凝胶的第一最外表面到微孔干凝胶的第二最外表面基本上连续互连的孔; 和包含玻璃化转变温度为约50℃或更高的聚合物的交联聚合物粘合剂，其中所述聚合物粘合剂在交联之前是水溶性的。
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7.发明授权Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof 有权电路材料，电路，多层电路及其制造方法公开(公告)号：US07572515B2
公开(公告)日：2009-08-11
申请号：US11039378
申请日：2005-01-19
IPC分类号： B32B25/20
CPC分类号： H05K1/032 , H05K1/0366 , H05K3/4626 , H05K2201/0162 , H05K2201/0212 , Y10T428/31663
摘要： An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.
摘要翻译： 一种具有设置在基底上的导电层的电路材料，其中所述基底包含包含共价结合的多面体倍半硅氧烷（POSS）的有机或无机聚合物。 基材还可以包含另外的分散POSS，任何其它填料，包括纤维网。 使用共价结合的POSS可以在具有可接受的介电常数和耗散因子的组合物中具有阻燃性。
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8.发明授权公开(公告)号：US07524388B2
公开(公告)日：2009-04-28
申请号：US11382513
申请日：2006-05-10
CPC分类号： H05K1/0366 , B29C70/00 , B29C70/025 , B29K2105/0079 , B32B3/26 , B32B5/02 , B32B5/022 , B32B5/024 , B32B27/12 , B32B27/20 , B32B27/38 , B32B2260/021 , B32B2307/202 , B32B2307/204 , B32B2307/5825 , B32B2307/726 , B32B2307/734 , B32B2457/08 , H05K2201/0141 , H05K2201/0278 , Y10S428/901 , Y10T442/2016 , Y10T442/2041 , Y10T442/2418
摘要： A method of forming a dielectric substrate comprises contacting a liquid crystalline polymer fibrous web having a thickness of 5 mils (127 micrometers) or less with a resin composition to form a dielectric composite. Contacting is carried out under vacuum, followed by pressure. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent dielectric strength.
摘要翻译： 形成电介质基片的方法包括将具有5密耳（127微米）或更小厚度的液晶聚合物纤维网与树脂组合物接触以形成电介质复合材料。 接触在真空下进行，然后进行压力。 电介质基板在电路材料，电路和多层电路中是有用的，经济地制造并且具有优异的介电强度。
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9.发明申请公开(公告)号：US20080254278A1
公开(公告)日：2008-10-16
申请号：US12100802
申请日：2008-04-10
申请人： Murali Sethumadhavan
发明人： Murali Sethumadhavan
CPC分类号： B32B3/26 , H01M2/145 , H01M2/166 , H01M10/052 , Y10T428/249978 , Y10T428/249979 , Y10T428/249991 , Y10T428/249992
摘要： A microporous layer comprising a microporous xerogel comprising pores that are substantially continuously interconnected from a first outermost surface of the microporous xerogel through to a second outermost surface of the microporous xerogel; and a crosslinked polymer binder comprising a polymer having a glass transition temperature of about 50° C. or higher, wherein the polymer binder is water soluble prior to crosslinking.
摘要翻译： 一种微孔层，其包含微孔干凝胶，其包含从微孔干凝胶的第一最外表面到微孔干凝胶的第二最外表面基本上连续互连的孔; 和包含玻璃化转变温度为约50℃或更高的聚合物的交联聚合物粘合剂，其中所述聚合物粘合剂在交联之前是水溶性的。
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10.发明申请公开(公告)号：US20080199781A1
公开(公告)日：2008-08-21
申请号：US12030991
申请日：2008-02-14
CPC分类号： H01M2/18 , H01M2/1646 , H01M2/1653 , H01M2/1673 , H01M2/168 , H01M4/525 , H01M4/583 , H01M10/0525 , H01M10/058 , Y10T29/49114 , Y10T29/49115
摘要： A method of producing an electrode assembly comprises positioning a first adhesive between a first surface of a first electrode layer having a width We1, and a first surface of a microporous separator layer having a width Wm at an edge of the first electrode layer and an edge of the microporous separator layer, to form a first separator/electrode pre-assembly, wherein the first adhesive has a width Wa1 less than ½(Weel); and adhering the first surface of the first electrode layer to the first surface of the microporous separator layer via the adhesive to form a first separator/electrode assembly. The adhesive can be a thermoplastic polymer, and can be a film and/or powder.
摘要翻译： 一种电极组件的制造方法，其特征在于，在第一电极层的宽度为W 1的第一面与第一表面之间设置第一粘合剂，所述第一表面具有宽度W < 在第一电极层的边缘和微孔隔板层的边缘之间形成第一隔膜/电极预组件，其中第一粘合剂具有宽度小于等于 比½（我们）; 并且通过粘合剂将第一电极层的第一表面粘附到微孔隔离层的第一表面，以形成第一隔膜/电极组件。 粘合剂可以是热塑性聚合物，并且可以是薄膜和/或粉末。
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