METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE

    公开(公告)号:US20160071828A1

    公开(公告)日:2016-03-10

    申请号:US14943092

    申请日:2015-11-17

    Inventor: Ryo SUZUKI

    Abstract: A method of manufacturing a light emitting device includes: disposing a group of electrically conductive members on a support substrate, the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements; placing the light emitting elements on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members, each of the light emitting elements being shifted from a corresponding one of the mounting portions; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member.

    METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE

    公开(公告)号:US20250107296A1

    公开(公告)日:2025-03-27

    申请号:US18892857

    申请日:2024-09-23

    Abstract: A method for manufacturing a light-emitting device includes: providing a structure including: a substrate including a plurality of positive and negative wiring parts at an upper surface of the substrate, and a light source part disposed on the substrate, the light source part including: an element substrate, and a plurality of light-emitting parts, each of the light-emitting parts including: a semiconductor structure including a first surface facing the element substrate and a second surface positioned at a side opposite to the first surface, and positive and negative electrode parts disposed on the second surface of the semiconductor structure; providing a mold including an upper mold and a lower mold; disposing a first resin part between the upper surface of the substrate and the second surfaces of the semiconductor structures; and removing the element substrate from the light source part.

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20200303604A1

    公开(公告)日:2020-09-24

    申请号:US16863656

    申请日:2020-04-30

    Abstract: A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20160351765A1

    公开(公告)日:2016-12-01

    申请号:US15164360

    申请日:2016-05-25

    Inventor: Ryo SUZUKI

    Abstract: A light emitting device includes a light emitting element having a first face positioned on an emission face side of the light emitting device, a second face opposing the first face, and lateral faces disposed between the first face and the second face, a light transmissive member formed from a resin-containing material, covering at least a portion of the lateral faces of the light emitting element and having a first face positioned on the emission face side, a covering member covering an exterior of the light transmissive member and having a first face positioned on the emission face side, a wavelength converting member covering the first face of the light emitting element, the first face of the light transmissive member, and the first face of the covering member, and a light reflective film including a first reflective film portion made of an inorganic material disposed between the exterior of the light transmissive member and the covering member, and a second reflective film portion made of an inorganic material disposed between the first face of the covering member and the wavelength converting member.

    Abstract translation: 发光装置包括:发光元件,其具有位于发光元件的发射面侧的第一面,与第一面相对的第二面以及设置在第一面与第二面之间的侧面,透光性部件 由含树脂的材料形成,覆盖发光元件的至少一部分侧面并且具有位于发射面侧的第一面;覆盖部件,覆盖透光部件的外部,并具有第一面 位于发光面侧的波长转换构件,覆盖发光元件的第一面,透光性构件的第一面和覆盖构件的第一面的波长转换构件,以及包含第一反射膜部的光反射膜 由设置在透光构件的外部和覆盖构件之间的无机材料制成,以及第二反射膜部分 由设置在覆盖部件的第一面和波长转换部件之间的无机材料制成。

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    发光装置及其制造方法

    公开(公告)号:US20160293810A1

    公开(公告)日:2016-10-06

    申请号:US15087365

    申请日:2016-03-31

    Abstract: A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending between the first face and the second face, a plurality of corners where the second face meets two of the plurality of side faces, and a pair of electrodes on a second face side of the light emitting element; a light transmissive member covering a portion of at least one of the side faces and a portion of an edge where said at least one side face meets the second face such that at least one of the plurality of corners is exposed from the light transmissive member; and a covering member covering the at least one exposed corner of the light emitting element and the exterior of the light transmissive member such that the pair of electrodes are exposed from the covering member.

    Abstract translation: 发光装置包括:发光元件,具有第一面,与第一面相对的第二面,在第一面和第二面之间延伸的多个侧面;多个角部,其中第二面与多个 的侧面,以及在发光元件的第二面侧的一对电极; 透光构件,其覆盖所述侧面中的至少一个侧面的一部分和所述至少一个侧面与所述第二面相遇的边缘的一部分,使得所述多个拐角中的至少一个从所述透光构件露出; 以及覆盖部件,其覆盖所述发光元件的所述至少一个露出角部和所述透光部件的外部,使得所述一对电极从所述覆盖部件露出。

    SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF FABRICATING THE SAME 有权
    半导体发光装置及其制造方法

    公开(公告)号:US20140097462A1

    公开(公告)日:2014-04-10

    申请号:US14083477

    申请日:2013-11-19

    Abstract: A light-emitting apparatus has a light-emitting device and a supporting board. The light-emitting device has a pair of n-electrodes with a p-electrode therebetween, on the same plane. The supporting board includes an insulating substrate on which positive and negative electrodes are formed, opposing to the p- and n-electrodes of the light-emitting device, respectively. Bonding members bond the p- and n-electrodes with the positive and negative electrodes, respectively. The positive electrode on the supporting board is formed within the width region of the p-electrode and narrower in width than the width of the p-electrode, in a cross-section along a line extending through the pair of n-electrodes. The negative electrodes oppose to the n-electrodes, respectively, with the same widths, or with that side face of each of the negative electrodes which faces the positive electrode being retracted outwardly from that side face of each of the n-electrodes which faces the p-electrode.

    Abstract translation: 发光装置具有发光装置和支撑基板。 发光装置在同一平面上具有一对具有p电极的n电极。 支撑板包括分别与发光器件的p电极和n电极相对形成有正极和负极的绝缘基板。 接合部件分别将p电极和n电极与正电极和负电极接合。 沿着延伸穿过该对n电极的线的横截面,支撑板上的正电极形成在p电极的宽度区域内并且宽度比p电极的宽度窄。 负电极分别以相同的宽度与n电极相对,或者与面对正电极的每个负电极的侧面从面向每个电极的每个n电极的侧面向外缩回 p电极。

    LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
    9.
    发明申请
    LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE 有权
    发光元件和发光装置

    公开(公告)号:US20150001574A1

    公开(公告)日:2015-01-01

    申请号:US14313167

    申请日:2014-06-24

    CPC classification number: H01L33/20 H01L33/0079 H01L33/56

    Abstract: A light emitting element has a semiconductor layer, a pair of positive and negative electrodes, and a reinforcing portion. The pair of positive and negative electrodes is disposed on a lower face side of the semiconductor layer. The pair of electrodes is connected to the substrate. The reinforcing portion is disposed on an outer edge part of an upper face of the semiconductor layer. The reinforcing portion is made from a light-transmissive material. The upper face includes an exposed portion exposed from the reinforcing portion.

    Abstract translation: 发光元件具有半导体层,一对正极和负极以及增强部。 一对正极和负极设置在半导体层的下表面侧。 该对电极连接到基板。 加强部设置在半导体层的上表面的外缘部。 加强部由透光材料制成。 上表面包括从加强部分露出的暴露部分。

    SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF FABRICATING THE SAME
    10.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF FABRICATING THE SAME 有权
    半导体发光装置及其制造方法

    公开(公告)号:US20130146646A1

    公开(公告)日:2013-06-13

    申请号:US13687106

    申请日:2012-11-28

    Abstract: A light-emitting apparatus has a light-emitting device and a supporting board. The light-emitting device has a pair of n-electrodes with a p-electrode therebetween, on the same plane. The supporting board includes an insulating substrate on which positive and negative electrodes are formed, opposing to the p- and n-electrodes of the light-emitting device, respectively. Bonding members bond the p- and n-electrodes with the positive and negative electrodes, respectively. The positive electrode on the supporting board is formed within the width region of the p-electrode and narrower in width than the width of the p-electrode, in a cross-section along a line extending through the pair of n-electrodes. The negative electrodes oppose to the n-electrodes, respectively, with the same widths, or with that side face of each of the negative electrodes which faces the positive electrode being retracted outwardly from that side face of each of the n-electrodes which faces the p-electrode.

    Abstract translation: 发光装置具有发光装置和支撑基板。 发光装置在同一平面上具有一对具有p电极的n电极。 支撑板包括分别与发光器件的p电极和n电极相对形成有正极和负极的绝缘基板。 接合部件分别将p电极和n电极与正电极和负电极接合。 沿着延伸穿过该对n电极的线的横截面,支撑板上的正电极形成在p电极的宽度区域内并且宽度比p电极的宽度窄。 负电极分别以相同的宽度与n电极相对,或者与面对正电极的每个负电极的侧面从面向每个n电极的每个n电极的侧面向外缩回 p电极。

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