公开(公告)号：US06400007B1

公开(公告)日：2002-06-04

申请号：US09836107

申请日：2001-04-16

申请人： Jichen Wu ,  Meng Ru Tsai ,  Nai Hua Yeh ,  Chen Pin Peng

发明人： Jichen Wu ,  Meng Ru Tsai ,  Nai Hua Yeh ,  Chen Pin Peng

IPC分类号： H01L2302

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An stacked structure of semiconductor means and method for manufacturing the same, comprises a substrate, a lower semiconductor chip, an adhered glue layer, a plurality of wires and an upper semiconductor chip. The adhered glue layer located between the substrate and the lower semiconductor to adhere the lower semiconductor to the substrate. The overflow glue of the adhered glue layer covered above the periphery of the lower semiconductor chip. The plurality of wires each being electrically connected to the lower semiconductor chip and the substrate, so that each wires are located above the overflow glue. The upper semiconductor chip is located above lower semiconductor chip and electrically connected to the substrate.

摘要翻译： 半导体装置的叠层结构及其制造方法包括基板，下半导体芯片，粘合胶层，多根导线和上半导体芯片。 位于基板和下半导体之间的粘附胶层将下半导体粘附到基板上。 粘合胶层的溢出胶被覆盖在下半导体芯片周围的上方。 多个电线各自电连接到下半导体芯片和基板，使得每个电线位于溢流胶上方。 上半导体芯片位于下半导体芯片的上方并与基板电连接。

公开(公告)号：US06642137B2

公开(公告)日：2003-11-04

申请号：US10147029

申请日：2002-05-15

申请人： Nai Hua Yeh ,  Chen Pin Peng ,  Jichen Wu

发明人： Nai Hua Yeh ,  Chen Pin Peng ,  Jichen Wu

IPC分类号： H01L2144

CPC分类号： H01L24/83 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The second surface is formed with a plurality of signal output terminals for electrically connecting to the circuit board. The integrated circuit has a lower surface and an upper surface. Recesses are formed at two sides of the lower surface, and a plurality of bonding pads are formed on the upper surface. The adhesive layer is used for adhering the lower surface of the integrated circuit to the first surface of the substrate. The wirings are electrically connecting to the bonding pads of the integrated circuit and to the signal input terminals of the substrate. The glue layer is used for sealing the plurality of wirings and the integrated circuits. According to the structure, the problem caused by the overflowed glue in the integrated circuit can be effectively avoided. A method for manufacturing the structure is also disclosed.

公开(公告)号：US06627983B2

公开(公告)日：2003-09-30

申请号：US09770083

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

IPC分类号： H01L2302

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

公开(公告)号：US06559539B2

公开(公告)日：2003-05-06

申请号：US09770084

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/0401

摘要： A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.

摘要翻译： 用于电连接到印刷电路板的图像传感器的堆叠封装结构包括基板，图像感测芯片，集成电路和透明层。 基板具有第一表面和第二表面。 第一表面由信号输入端子形成。 第二表面形成有用于电连接到印刷电路板的信号输入端子和信号输出端子。 图像感测芯片安装在基板的第一表面上并且电连接到基板的信号输入端子。 集成电路布置在基板的第二表面上并且电连接到基板的信号输入端子。 透明层覆盖图像感测芯片，其可以经由透明层接收图像信号，并将图像信号转换成要传输到基板的电信号。 因此，图像感测产品和集成电路的图像感测芯片可以被整体封装。

公开(公告)号：US20050077607A1

公开(公告)日：2005-04-14

申请号：US10683837

申请日：2003-10-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L25/065 ,  H01L23/02 ,  H01L23/34

CPC分类号： H01L23/3107 ,  H01L23/13 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

摘要翻译： 小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有多个通孔，然后将多个存储芯片安装在基板上， 可以显示从通槽的存储芯片的多个边界焊盘，并且使用电连接到基板的多根电线，最后同时使用封装多个存储芯片的胶层。 因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

公开(公告)号：US20050077362A1

公开(公告)日：2005-04-14

申请号：US10683838

申请日：2003-10-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

IPC分类号： G06K19/02 ,  G06K19/077 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

CPC分类号： G06K19/0773 ,  G06K19/02 ,  G06K19/077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/043 ,  H01L2924/00014

摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

摘要翻译： 堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起， 使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。 因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

公开(公告)号：US06870208B1

公开(公告)日：2005-03-22

申请号：US10671038

申请日：2003-09-24

申请人： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

发明人： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

IPC分类号： H01L21/336 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/062

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.

摘要翻译： 图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。 基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。 框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。 感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。 透明层被覆盖在基板的上表面上以覆盖开口。 镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹 被拧在腔室的内螺纹上。

公开(公告)号：US06680525B1

公开(公告)日：2004-01-20

申请号：US10340251

申请日：2003-01-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

IPC分类号： H01L2302

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

摘要翻译： 要安装到印刷电路板的图像传感器。 该模块包括基板，集成电路，框架层，感光芯片，多根导线和透明层。 基板由布置成矩阵状的金属板和位于由金属板包围的中央区域的中间板构成。 每个金属片具有连接到印刷电路板的第一板和第二板。 在基底下方形成槽。 集成电路布置在槽内并与衬底电连接。 芯片放在中间板上。 电线将第一板电连接到芯片。 透明层被放置在框架层上以覆盖芯片。

公开(公告)号：US06646316B2

公开(公告)日：2003-11-11

申请号：US09770049

申请日：2001-01-24

申请人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

发明人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.

摘要翻译： 图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。 图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。 在图像感测芯片上形成多个电路。 每个电路由接合焊盘形成。 柔性电路板具有上表面和下表面。 信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。 信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。 透明层用于覆盖柔性电路板的上表面。 图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

公开(公告)号：US06906397B2

公开(公告)日：2005-06-14

申请号：US10621992

申请日：2003-07-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

发明人： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC分类号： H01L31/0203 ,  H01L31/0232

CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut—corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

摘要翻译： 具有改进的透明层的图像传感器包括基板，框架层，感光芯片，多根导线和透明层。 基板具有形成有多个第一连接点的上表面。 框架层布置在基板的上表面上，以与基板一起形成空腔。 感光芯片安装在基板的上表面和腔内。 多根导线将感光芯片电连接到基板的第一连接点。 透明层被覆盖在框架层上，用于覆盖感光芯片，使得感光芯片可以分别在透明层的周边处接收通过透明层的光信号，并且形成有切角。 因此，透明层可以减少碰撞，并且可以提高透明层的清洁度，因此简化制造工艺并降低制造成本。