公开(公告)号：US4492730A

公开(公告)日：1985-01-08

申请号：US479236

申请日：1983-03-28

申请人： Naoaki Oishi ,  Noriyuki Shimizu ,  Takashi Shoji ,  Shoji Harada

发明人： Naoaki Oishi ,  Noriyuki Shimizu ,  Takashi Shoji ,  Shoji Harada

IPC分类号： B32B15/08 ,  H05K1/00 ,  H05K1/03 ,  H05K1/05 ,  B32B27/28 ,  B32B27/36

CPC分类号： B32B15/08 ,  H05K1/056 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/256 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31721

摘要： The present invention relates to a substrate for a printed circuit exhibiting particularly an excellent electrical insulating property, as well as an excellent heat dissipating property and heat resistance.In accordance with the present invention, a substrate of a printed circuit comprises a metallic plate, and further comprising on at least one surface of said metallic plate, a synthetic resin layer containing an inorganic filler, a heat-resistant resin film, and a synthetic resin layer, which are successively laminated on said metallic plate.A substrate of the present invention also comprises a metallic plate, at least two synthetic resin layers containing an inorganic filler, a heat-resistant resin film which is laminated between said at least two synthetic resin layers.

摘要翻译： 本发明涉及一种特别具有优异的电绝缘性能以及优异的散热性和耐热性的印刷电路用基板。 根据本发明，印刷电路基板包括金属板，并且还包括在所述金属板的至少一个表面上的含有无机填料，耐热树脂膜和合成树脂膜的合成树脂层 树脂层，其依次层压在所述金属板上。 本发明的基板还包括金属板，至少两层含有无机填料的合成树脂层，层压在所述至少两层合成树脂层之间的耐热树脂膜。

公开(公告)号：US09078382B2

公开(公告)日：2015-07-07

申请号：US13266310

申请日：2010-04-27

申请人： Takashi Shoji ,  Takekazu Sakai

发明人： Takashi Shoji ,  Takekazu Sakai

IPC分类号： H05K3/00 ,  H01R9/00 ,  H05K3/34 ,  H05K3/28

CPC分类号： H05K3/3436 ,  H05K3/282 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10234 ,  H05K2201/10674 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/124 ,  Y02P70/613 ,  Y10T29/49146

摘要： The present invention has been made in consideration of the above-described situation, and provides a method of producing a circuit board that can bond a component to be mounted without slanting the component, and simplify the steps. The method of producing a circuit board includes forming a first adhesive layer by applying a first adhesiveness-imparting compound on the surface of terminal portions of a circuit board; attaching a core body on the first adhesive layer of the terminal portions; forming a second adhesive layer by applying a second adhesiveness-imparting compound on the surface of the core body; attaching first solder particles on the second adhesive layer of the surface of the core body; and forming a solder layer on the surface of the core body by melting the first solder particles.

摘要翻译： 本发明是考虑到上述情况而做出的，并且提供了一种制造电路板的方法，该电路板可以在不倾斜部件的情况下将待安装的部件结合，并且简化步骤。 制造电路板的方法包括通过在电路板的端子部分的表面上施加第一粘附性化合物来形成第一粘合剂层; 将芯体附接在端子部分的第一粘合剂层上; 通过在芯体的表面上施加第二粘合性化合物来形成第二粘合剂层; 将第一焊料颗粒附着在芯体的表面的第二粘合剂层上; 以及通过熔化所述第一焊料颗粒在所述芯体的表面上形成焊料层。

公开(公告)号：US08362437B2

公开(公告)日：2013-01-29

申请号：US12626694

申请日：2009-11-27

申请人： Keiji Tsubota ,  Takashi Shoji ,  Yutaka Yoshida ,  Naoyuki Nishino ,  Kiyoshi Kondou ,  Yuji Kurachi ,  Yasunori Ohta

发明人： Keiji Tsubota ,  Takashi Shoji ,  Yutaka Yoshida ,  Naoyuki Nishino ,  Kiyoshi Kondou ,  Yuji Kurachi ,  Yasunori Ohta

IPC分类号： G01T1/24

CPC分类号： G01T1/2928 ,  G01T1/17 ,  G01T1/247

摘要： There is provided a radiographic imaging device including: a radiation detector; a switching power supply; a storage section; a reading section; and a control section that controls the switching power supply so as to implement switching control and cause electricity to be accumulated in the storage section at a time when charge is not being read by the reading section, and stop switching control at a time when charge is being read by the reading section.

摘要翻译： 提供了一种放射线照相成像装置，包括：放射线检测器; 开关电源; 存储部分; 阅读部分 以及控制部分，其控制开关电源以便在读取部分未读取电荷的时刻实现切换控制并且在存储部分中积累电力，并且在充电为止时停止切换控制 由阅读部分阅读。

公开(公告)号：US20120292377A1

公开(公告)日：2012-11-22

申请号：US13522547

申请日：2011-01-18

申请人： Takashi Shoji ,  Takekazu Sakai

发明人： Takashi Shoji ,  Takekazu Sakai

IPC分类号： B23K3/06 ,  B23K1/20

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K1/203 ,  B23K3/06 ,  B23K2101/42 ,  H05K2203/0292 ,  H05K2203/0425 ,  H05K2203/1527 ,  H05K2203/1554

摘要： Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.

摘要翻译： 公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。 用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部，使得其表面大致面向上下方向; 倾斜装置，其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置，并且使容器沿与第一方向相反的第二方向从初始位置倾斜，并使容器倾斜 回到第一个方向; 以及设置有偏心马达的振动装置，所述偏心马达设置在容器的底部的中心，通过旋转轴的旋转而向容器的底部提供振动;以及控制装置，用于将偏心马达的旋转轴设置在 与容器的倾斜方向相同的方向。

公开(公告)号：US20120042511A1

公开(公告)日：2012-02-23

申请号：US13266379

申请日：2010-04-12

申请人： Takashi Shoji ,  Takekazu Sakai

发明人： Takashi Shoji ,  Takekazu Sakai

IPC分类号： H05K3/00

CPC分类号： H05K3/3478 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

摘要翻译： 提供一种制造电路板的方法，其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。 制造电路板的方法包括以下步骤：通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上，并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。

公开(公告)号：US20110242112A1

公开(公告)日：2011-10-06

申请号：US12750794

申请日：2010-03-31

申请人： Yukari KATAYAMA ,  Akihito Akai ,  Yoshiki Kurokawa ,  Takashi Shoji

发明人： Yukari KATAYAMA ,  Akihito Akai ,  Yoshiki Kurokawa ,  Takashi Shoji

IPC分类号： G06T1/00 ,  G06T9/00

CPC分类号： G09G5/36 ,  G09G2340/02 ,  G09G2360/18 ,  H04N19/115 ,  H04N19/154 ,  H04N19/17 ,  H04N19/196 ,  H04N19/198

摘要： The display driver includes: a display data compression circuit; a recording circuit; a display data decompression circuit; and an output circuit. Further, the display driver is provided with a compressibility setting circuit. The display data compression circuit has the function of compressing the display data according to a compressibility set by the compressibility setting circuit. With the display driver arranged like this, the power consumption can be reduced by increasing the compressibility for a displayed image such that the image quality is not noticeably deteriorated even with the compressibility increased. Further, for the displayed image such that the image quality is noticeably deteriorated with the compressibility increased, a sufficient image quality after data decompression can be secured by lowering the compressibility.

摘要翻译： 显示驱动器包括：显示数据压缩电路; 记录电路; 显示数据解压缩电路; 和输出电路。 此外，显示驱动器设置有压缩性设定电路。 显示数据压缩电路具有根据由压缩性设定电路设定的压缩率压缩显示数据的功能。 通过这样布置的显示驱动器，可以通过增加显示图像的压缩率来降低功耗，使得即使压缩率增加，图像质量也不会显着劣化。 此外，对于所显示的图像，使得图像质量在可压缩性增加时显着劣化，可以通过降低压缩性来确保数据解压缩之后的足够的图像质量。

公开(公告)号：US20100085477A1

公开(公告)日：2010-04-08

申请号：US12572383

申请日：2009-10-02

申请人： Yoshihisa OOISHI ,  Junichi Maruyama ,  Takashi Shoji ,  Kikuo Ono ,  Masahiro Fukata

发明人： Yoshihisa OOISHI ,  Junichi Maruyama ,  Takashi Shoji ,  Kikuo Ono ,  Masahiro Fukata

IPC分类号： H04N7/01 ,  H04N3/14 ,  G09G3/36 ,  H04N5/14

CPC分类号： G09G3/3611 ,  G09G3/2011 ,  G09G3/2025 ,  G09G3/2081 ,  G09G3/3406 ,  G09G2320/0261 ,  G09G2320/0271 ,  G09G2320/0646 ,  G09G2340/0435 ,  G09G2360/16 ,  H04N7/0132

摘要： The display device including: a display panel; a backlight; a memory for converting frame rate of an input video signal and outputting a video signal; an interpolation frame generation unit for generating an interpolation frame based on the video signal output from the memory; a histogram generator for generating a histogram based on the input video signal; and a backlight brightness calculation unit for calculating a backlight control signal, the display device further comprising: wherein image data for display, which is obtained by an N-th frame of the input video signal, and image data of the interpolation frame generated based on the N-th frame and an (N+1)-th frame of the input video signal, is input to the display panel; and wherein the backlight control signal calculated based on the histogram generated based on the image data of the N-th frame is used for displaying the image data for display.

摘要翻译： 该显示装置包括：显示面板; 背光; 用于转换输入视频信号的帧速率并输出视频信号的存储器; 内插帧生成单元，用于基于从存储器输出的视频信号来生成内插帧; 直方图生成器，用于基于输入视频信号生成直方图; 以及用于计算背光控制信号的背光亮度计算单元，所述显示装置还包括：其中通过所述输入视频信号的第N帧获得的用于显示的图像数据和基于所述输入视频信号生成的内插帧的图像数据 输入视频信号的第N帧和第（N + 1）帧被输入到显示面板; 并且其中基于基于第N帧的图像数据生成的直方图计算的背光控制信号用于显示用于显示的图像数据。

公开(公告)号：US20100065615A1

公开(公告)日：2010-03-18

申请号：US12517320

申请日：2007-12-17

申请人： Takashi Shoji ,  Takekazu Sakai

发明人： Takashi Shoji ,  Takekazu Sakai

IPC分类号： B23K1/20

CPC分类号： H05K3/3484 ,  H05K3/282 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/124

摘要： A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.

摘要翻译： 一种制造导电电路板的方法，包括通过使用赋予粘着性的化合物在印刷电路板上的导电电路的表面赋予粘性，将焊料粉末附着在粘性区域上，然后加热印刷线路板以熔化 焊料形成焊锡电路。 该方法的特征在于，在附着焊料粉末之前，将粘性赋予印刷线路板保持在不超过10℃的液体等中。

公开(公告)号：US07498583B2

公开(公告)日：2009-03-03

申请号：US11393838

申请日：2006-03-31

申请人： Takashi Shoji ,  Masakazu Nakajo

发明人： Takashi Shoji ,  Masakazu Nakajo

IPC分类号： G01T1/24

CPC分类号： A61B6/4266 ,  A61B6/4291 ,  A61B6/4452 ,  A61B6/5235 ,  H04N5/32 ,  H04N5/3415

摘要： Radiation detector units provided with solid-state radiation detectors are supported on a supporting section, such that the radiation detector units are located at different distances from a radiation source and arrayed in a one-dimensional direction or two-dimensional directions. One of the radiation detector units is taken as a reference unit. Image size enlargement or reduction processing is performed on each of image signals outputted from the radiation detector units other than the reference unit and in accordance with a ratio between a distance from the radiation source to the reference unit and a distance from the radiation source to each of the radiation detector units other than the reference unit. Image composing processing is performed on the image signal outputted from the reference unit and processed image signals obtained from the image size enlargement or reduction processing.

摘要翻译： 设置有固态放射线检测器的辐射检测器单元被支撑在支撑部分上，使得辐射检测器单元位于与辐射源不同的距离处并排列成一维方向或二维方向。 将其中一个辐射检测器单元作为参考单元。 对从除了参考单元之外的辐射检测器单元输出的每个图像信号以及从辐射源到参考单元的距离与从辐射源到每个基准单元的距离之间的比率执行图像尺寸放大或缩小处理 的除了参考单元之外的辐射探测器单元。 对从参考单元输出的图像信号和从图像尺寸放大或缩小处理获得的经处理的图像信号执行图像合成处理。

公开(公告)号：US20080303758A1

公开(公告)日：2008-12-11

申请号：US12131202

申请日：2008-06-02

申请人： Yoshihisa Ooishi ,  Junichi Maruyama ,  Takashi Shoji ,  Kikuo Ono

发明人： Yoshihisa Ooishi ,  Junichi Maruyama ,  Takashi Shoji ,  Kikuo Ono

IPC分类号： G09G3/34

CPC分类号： G09G3/2033 ,  G09G3/2037 ,  G09G3/36 ,  G09G3/3611 ,  G09G5/399 ,  G09G2340/02 ,  G09G2360/18

摘要： High-order bits to be utilized for current-frame display data and previous-frame display data, and low-order bits to be utilized for the current-frame display data alone are stored in independently controllable memory areas. For reading the current-frame display data from a frame memory, data of the high-order bits and data of the low-order bits are read. For reading the previous-frame data, the high-order bits alone are read. Thus, since a period during which the data of the low-order bits that is not utilized for the previous-frame display data is stored in the memory is shortened, a required memory capacity can be reduced. The data transfer time can be reduced by the time required for memory read for the data of the low-order bits that is not utilized for the previous-frame display data.

摘要翻译： 用于当前帧显示数据和前一帧显示数据的高位数，以及仅用于当前帧显示数据的低位比特存储在独立可控存储区域中。 为了从帧存储器读取当前帧显示数据，读取高位数据和低位数据的数据。 为了读取前一帧数据，只读取高位。 因此，由于缩短了对前一帧显示数据未被利用的低位数据的数据存储在存储器中的时段，所以可以减少所需的存储器容量。 数据传输时间可以减少对于未用于前一帧显示数据的低位的数据的存储器读取所需的时间。