公开(公告)号：US07834438B2

公开(公告)日：2010-11-16

申请号：US11624440

申请日：2007-01-18

申请人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H01L23/06

CPC分类号： B81B7/0067 ,  H01L24/97 ,  H01L2224/16225

摘要： According to a sealed structure 60 constituted by anodically bonding a silicon board 20 and a glass plate 40, an upper opening of a recessed portion 22 is sealed in an airtight state by the glass plate 40 by bonding an upper face of a wall portion 26 to the glass plate 40. A voltage applying pattern 70 is formed to surround a light transmitting region to which an optical conversion element 24 is opposed. Further, the voltage applying pattern 70 functions as a cathode pattern applied with a voltage by being brought into contact with a lower face of the cathode plate 50.

摘要翻译： 根据通过阳极结合硅板20和玻璃板40构成的密封结构60，通过将壁部26的上表面粘接到玻璃板40的密封状态，将凹部22的上部开口密封在气密状态 玻璃板40.形成电压施加图案70以包围光转换元件24相对的光透射区域。 此外，电压施加图案70通过与阴极板50的下表面接触而用作施加电压的阴极图案。

公开(公告)号：US07825423B2

公开(公告)日：2010-11-02

申请号：US11700761

申请日：2007-02-01

申请人： Akinori Shiraishi ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/58 ,  H01L24/97 ,  H01L33/44 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.

摘要翻译： 在半导体装置100中，将发光装置102安装在基板101上。在发光装置102的上表面上形成有用于防止光反射的防反射膜130.另外，板状 在发光装置102的上方配置有由透光性的玻璃构成的盖103，并且在盖103的上表面上也形成防止光的反射的防反射膜140。

公开(公告)号：US07622747B2

公开(公告)日：2009-11-24

申请号：US11645876

申请日：2006-12-27

申请人： Yuichi Taguchi ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama

发明人： Yuichi Taguchi ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light emitting device is disclosed. The light emitting device includes a light emitting element (15), and a light emitting element container (11) having a concave section (20) for containing the light emitting element (15). The concave section (20) includes a side surface (20A) and a bottom surface (20B) almost orthogonal to the side surface (20A). The light emitting device further includes a conductive paste layer (17) formed of a conductive paste in which metal particles are dispersed in a solution, and the conductive paste layer (17) includes a slanting surface (17A) on the side surface (20A) and the bottom surface (20B).

摘要翻译： 公开了一种发光器件。 发光器件包括发光元件（15）和具有用于容纳发光元件（15）的凹部（20）的发光元件容器（11）。 凹部（20）具有与侧面（20A）大致正交的侧面（20A）和底面（20B）。 发光装置还包括由金属颗粒分散在溶液中的导电浆料形成的导电浆料层（17），导电浆料层（17）在侧表面（20A）上包括倾斜表面（17A） 和底面（20B）。

公开(公告)号：US07470891B2

公开(公告)日：2008-12-30

申请号：US11671167

申请日：2007-02-05

申请人： Naoyuki Koizumi ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Yuichi Taguchi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Naoyuki Koizumi ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Yuichi Taguchi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： G03B21/00 ,  G02B27/18 ,  G02B26/00

CPC分类号： G03B21/208 ,  G03B21/008 ,  G03B21/145 ,  H04N9/315

摘要： The optical device 10 includes a light source 13, a mirror element 12 including a mirror 36 for reflecting light emitted from the light source 13 in a predetermined direction, and a mirror element housing body 11 that accommodates the mirror element 12 as well as seals a space D where the mirror element 12 is accommodated, characterized in that the light source 13 is provided inside the mirror element housing body 11.

摘要翻译： 光学装置10包括光源13，反射镜元件12，其包括反射镜36，反射镜36用于反射从光源13沿预定方向发射的光;以及镜元件壳体11，其容纳镜元件12以及密封 其中容纳镜子元件12的空间D，其特征在于，光源13设置在镜元件壳体11的内部。

公开(公告)号：US20070187706A1

公开(公告)日：2007-08-16

申请号：US11673818

申请日：2007-02-12

申请人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

发明人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

IPC分类号： H01L33/00 ,  H01L31/12

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  Y10T29/49002 ,  Y10T83/04 ,  H01L2224/05599

摘要： The invention provides a light-emitting device 10 including an light-emitting element 12 and a substrate 11 where the light-emitting element 12 is arranged, characterized in that a housing part 28 housing the light-emitting element 12 and having a shape that is tapered upward from the substrate 11 and a metal frame 15 surrounding the light-emitting element 12 and including the side face 28A of the housing part 28 made into an almost mirror-polished surface are provided on the substrate 11.

摘要翻译： 本发明提供一种发光装置10，其包括发光元件12和布置有发光元件12的基板11，其特征在于，容纳发光元件12的壳体部28，其形状为 在基板11上设置有从基板11向上方锥形的金属框架15和包围发光元件12的金属框架15，并且将金属框架15包括在壳体部件28的形成为近似镜面抛光的表面的侧面28A。

公开(公告)号：US20070182307A1

公开(公告)日：2007-08-09

申请号：US11645581

申请日：2006-12-27

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01L33/00 ,  H01J63/04 ,  H01J1/62

CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/501 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A light emitting apparatus, includes: a light emitting device accommodating body, which has a recessed portion wherein a light emitting device is accommodated; a wiring pattern, which is provided for the light emitting device accommodating body 11 and is electrically connected to the light emitting device; a light transmitting substrate, which is mounted on the light emitting device accommodating body and completely closes the recessed portion; and a phosphor-containing, ultraviolet curing resin, which is so deposited that, opposite to the light emitting device accommodating body, the face of the light transmitting member is covered.

摘要翻译： 发光装置包括：发光装置容纳主体，其具有容纳发光装置的凹部; 布线图案，其被设置用于发光装置容纳主体11并且电连接到发光装置; 透光基板，其安装在发光装置容纳体上并完全封闭凹部; 和含有荧光体的紫外线固化树脂，其被沉积成与发光装置容纳体相对的透光部件的表面被覆盖。

公开(公告)号：US08481863B2

公开(公告)日：2013-07-09

申请号：US12061203

申请日：2008-04-02

申请人： Akinori Shiraishi ,  Kei Murayama ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

IPC分类号： H05K1/16 ,  H05K1/11 ,  H01K3/10

CPC分类号： H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion.

摘要翻译： 基板包括由用于安装发光元件的基座和竖立在基座上的壁部分限定的存储部分。 包装被构造成使得形成为围绕存储部分的周边的壁部分的上端连接到盖子上，从而密封发光元件。 密封结构由形成在基底的下表面侧的不平坦部分，形成在不平坦部分的表面上的紧密接触层，形成在紧密接触层上的电源层和形成在电极层上的电极层 电源层的表面。 不平坦部分包括形成在与通孔的外周沿径向间隔开的位置或从通孔的内壁隔开的位置处的第一凹部，以及形成在与第一凹部进一步向外间隔开的位置的第二凹部 凹陷部分。

公开(公告)号：US07708613B2

公开(公告)日：2010-05-04

申请号：US11656580

申请日：2007-01-23

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01J1/62

CPC分类号： H01L33/507 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A method of producing a light emitting apparatus including a light emitting element, a light emitting element housing having a recess for housing the light emitting element, and a translucent substrate placed on the light emitting element housing is disclosed. The disclosed method includes a fluorescent-substance-containing resin forming step of forming a fluorescent-substance-containing resin on a first side of the translucent substrate which first side is opposite to a second side of the translucent substrate which second side faces the recess. In the fluorescent-substance-containing resin forming step, luminance and chromaticity of light that is emitted from the light emitting element and then transmitted by the fluorescent-substance-containing resin are measured and a thickness of the fluorescent-substance-containing resin is adjusted based on the measured luminance and chromaticity so that light emitted from the light emitting apparatus attains the specified luminance and chromaticity.

摘要翻译： 公开了一种制造包括发光元件的发光装置的方法，具有用于容纳发光元件的凹部的发光元件壳体和放置在发光元件壳体上的透光性基板。 所公开的方法包括在透光性基板的第一面上形成含有荧光物质的树脂的荧光物质的树脂形成工序，第一面与透光性基板的第二面相对，第二面与凹部相对。 在含荧光物质的树脂形成步骤中，测量从发光元件发射并随后由含荧光物质的树脂透射的光的亮度和色度，并调节含荧光物质的树脂的厚度 基于测量的亮度和色度，使得从发光装置发射的光达到规定的亮度和色度。

公开(公告)号：US07705451B2

公开(公告)日：2010-04-27

申请号：US11882568

申请日：2007-08-02

申请人： Kei Murayama ,  Yuichi Taguchi ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Mitsutoshi Higashi

发明人： Kei Murayama ,  Yuichi Taguchi ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Mitsutoshi Higashi

IPC分类号： H01L23/06

CPC分类号： H01L23/055 ,  B81B2207/012 ,  B81C1/0023 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a laminated substrate formed by laminating a plurality of semiconductor substrates, a concave part formed in the laminated substrate, and a semiconductor element mounted in the concave part. A method of manufacturing a semiconductor device includes a first step of forming a laminated substrate by laminating a plurality of semiconductor substrates, a second step of forming a concave part by etching the laminated substrate, and a third step of mounting a semiconductor element in the concave part.

摘要翻译： 半导体器件包括通过层叠多个半导体衬底，形成在层叠衬底中的凹部和安装在凹部中的半导体元件而形成的层叠衬底。 一种制造半导体器件的方法包括：通过层叠多个半导体衬底形成层叠衬底的第一步骤，通过蚀刻层叠衬底形成凹部的第二步骤，以及将半导体元件安装在凹部中的第三步骤 部分。

公开(公告)号：US07494898B2

公开(公告)日：2009-02-24

申请号：US11641336

申请日：2006-12-19

申请人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  B81B7/0067 ,  H01L2224/16225

摘要： A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material different from a material of the first substrate so as to encapsulate the semiconductor element; forming a first groove in the first substrate and a second groove in the second substrate; and cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device.

摘要翻译： 公开的制造半导体器件的半导体器件的方法，其中半导体元件安装在第一衬底上，包括以下步骤：将其上安装有半导体元件的第一衬底和由不同于 第一衬底以封装半导体元件; 在所述第一基板中形成第一凹槽，在所述第二基板中形成第二凹槽; 并且在第一凹槽和第二凹槽之间切割一部分，以使半导体器件单独化。