公开(公告)号：US11006530B2

公开(公告)日：2021-05-11

申请号：US15741940

申请日：2016-06-01

Applicant: NITTO DENKO CORPORATION

Inventor： Keisuke Okumura ,  Eiji Toyoda ,  Shotaro Masuda

IPC: H05K3/20 ,  H05K3/22 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10

Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

公开(公告)号：US10297470B2

公开(公告)日：2019-05-21

申请号：US15032105

申请日：2014-10-03

Applicant: NITTO DENKO CORPORATION

Inventor： Yusaku Shimizu ,  Eiji Toyoda ,  Goji Shiga

IPC: H01L21/56 ,  H03H9/64 ,  H03H9/10 ,  H01L23/00 ,  H01L21/78 ,  H01L23/29 ,  H03H3/08 ,  H01L23/31

Abstract: Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.

公开(公告)号：US09659883B2

公开(公告)日：2017-05-23

申请号：US15023501

申请日：2014-09-09

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC: H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/29 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/544

CPC classification number: H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

Abstract: The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

公开(公告)号：US20160211228A1

公开(公告)日：2016-07-21

申请号：US15023501

申请日：2014-09-09

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC: H01L23/00 ,  H01L25/00 ,  H01L21/78 ,  H01L25/065

CPC classification number: H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

Abstract: The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

Abstract translation: 本发明提供一种用于密封具有优异的可靠性和可储存性的半导体芯片的热固化树脂片，同时由于热固性树脂片的体积收缩而减少翘曲变形，以及半导体封装的制造方法。 本发明涉及用于密封半导体芯片的热固性树脂片，其中活化能（Ea）满足下式（1），在150℃下热固化1小时的产品的玻璃化转变温度为125 ℃以上，热固化物的玻璃化转变温度以下的热膨胀系数α[ppm / K]和热固化物的25℃下的储能模量E'[GPa]满足 下式（2）：30＆nlE; Ea＆nlE; 120 [kJ / mol]（1）; 和10,000＆nlE;α×E'＆nlE; 300,000 [Pa / K]（2）。

公开(公告)号：US20160060450A1

公开(公告)日：2016-03-03

申请号：US14779859

申请日：2014-03-17

Applicant: NITTO DENKO CORPORATION

Inventor： Eiji Toyoda ,  Yusaku SHIMIZU ,  Jun ISHII

IPC: C08L65/02 ,  H03H9/64

Abstract: Provided are a sealing sheet having excellent flexibility and capable of producing an electronic component package which is highly reliable even if an object to be sealed has a hollow structure, a method for manufacturing the sealing sheet, and a method for manufacturing the electronic component package. The present invention is a sealing sheet containing dispersed domains of an elastomer, the domains having a maximum diameter of 20 μm or less.

Abstract translation: 提供一种具有优异的柔性并能够制造即使被密封物体具有中空结构也是高可靠性的电子部件封装的密封片，密封片的制造方法和电子部件封装的制造方法。 本发明是一种包含弹性体的分散畴的密封片，该畴的最大直径为20μm以下。

公开(公告)号：US20130078770A1

公开(公告)日：2013-03-28

申请号：US13631286

申请日：2012-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Takashi Oda ,  Kosuke Morita ,  Eiji Toyoda

IPC: H01L21/56

CPC classification number: H01L21/50 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2221/68336 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A method for producing a semiconductor device, including a semiconductor chip, for improving production efficiency and the flexibility of production design is provided. The method comprises: preparing a semiconductor chip having a first main surface on which an electroconductive member is formed; preparing a supporting structure in which, over a support configured to transmit radiation, a radiation curable pressure-sensitive adhesive layer and a first thermosetting resin layer are laminated in this order; arranging the semiconductor chips on the first thermosetting resin layer to face the first thermosetting resin layer to a second main surface of the semiconductor chips opposite to the first main surface; laminating a second thermosetting resin layer over the first thermosetting resin layer to cover the semiconductor chips; and curing the radiation curable pressure-sensitive adhesive layer by irradiating from the support side to peel the radiation curable pressure-sensitive adhesive layer from the first thermosetting resin layer.

公开(公告)号：US20130078769A1

公开(公告)日：2013-03-28

申请号：US13631268

申请日：2012-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Takashi Oda ,  Kosuke Morita ,  Eiji Toyoda

IPC: H01L21/56

CPC classification number: H01L24/20 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/19 ,  H01L2221/68336 ,  H01L2224/12105 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method for producing a semiconductor device for improving production efficiency and the flexibility of production design thereof is provided. The method includes preparing semiconductor chips having a first main surface on which an electroconductive member is formed, preparing a supporting structure in which over a support configured to transmit radiation, a radiation curable pressure-sensitive adhesive layer and a first thermosetting resin layer are laminated in this order, arranging the semiconductor chips on the first thermosetting resin layer to face the first thermosetting resin layer to the first main surfaces of the semiconductor chips, laminating a second thermosetting resin layer over the first thermosetting resin layer to cover the semiconductor chips, and curing the radiation curable pressure-sensitive adhesive layer by irradiating from the support side to peel the radiation curable pressure-sensitive adhesive layer and the first thermosetting resin layer from each other.

Abstract translation: 提供一种制造用于提高生产效率的半导体器件的方法及其制造设计的灵活性。 该方法包括制备具有第一主表面的半导体芯片，其上形成有导电构件，制备支撑结构，其中在被配置为透射辐射的支撑件上，层叠可辐射固化压敏粘合剂层和第一热固性树脂层 将半导体芯片布置在第一热固性树脂层上以将第一热固性树脂层面向半导体芯片的第一主表面，在第一热固性树脂层上层叠第二热固性树脂层以覆盖半导体芯片，并固化 可辐射固化型粘合剂层通过从支撑侧照射而将可辐射固化压敏粘合剂层和第一热固性树脂层彼此剥离。

公开(公告)号：US11090405B2

公开(公告)日：2021-08-17

申请号：US16333432

申请日：2017-08-10

Applicant: NITTO DENKO CORPORATION

Inventor： Eiji Toyoda ,  Ryoma Yoshioka ,  Naoya Sugimoto ,  Yu Tachikawa

IPC: A61L15/20 ,  A61K47/14 ,  A61K47/32 ,  A61K9/70 ,  A61L15/24 ,  A61L15/26 ,  C09J11/06 ,  C09J201/00 ,  C09J7/20

Abstract: A laminate patchable to a living body and that includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.

公开(公告)号：US10194861B2

公开(公告)日：2019-02-05

申请号：US15741942

申请日：2016-06-01

Applicant: NITTO DENKO CORPORATION

Inventor： Keisuke Okumura ,  Eiji Toyoda ,  Shotaro Masuda

IPC: H05K1/00 ,  A61B5/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/22 ,  H05K1/18

Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

公开(公告)号：US20130175984A1

公开(公告)日：2013-07-11

申请号：US13715084

申请日：2012-12-14

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroshi Yamazaki ,  Kojiro Kameyama ,  Eiji Toyoda ,  Hajime Sunahara

IPC: H02J7/00 ,  H01F38/14

CPC classification number: H02J7/0042 ,  H01F27/255 ,  H01F27/327 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J50/12 ,  H02J50/70 ,  H04B5/0037 ,  H04B5/0075

Abstract: A mobile terminal power receiving module 1 which is housed together with a rechargeable battery 3 in a rechargeable battery pack 2 in a mobile terminal such as a smart phone 5, includes a sheet coil 13 in which a coil 12 constituted by conductors is formed on a flexible circuit board 11 as a circuit pattern and a magnetic sheet 14 made of resin in which magnetic powder is dispersed.

Abstract translation: 与诸如智能电话5的移动终端中的可充电电池组2中的可再充电电池3一起容纳的移动终端电力接收模块1包括片状线圈13，其中由导体构成的线圈12形成在 作为电路图案的柔性电路板11和分散有磁性粉末的由树脂制成的磁性片14。