公开(公告)号：US20170032979A1

公开(公告)日：2017-02-02

申请号：US15105909

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16146 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83005

摘要： Provided is a production method for a semiconductor package which can yield a sealed resin body excellent in surface smoothness, and which makes it possible to omit any step of grinding a resin region of the sealed resin body. This method is a production method, for a semiconductor package, including the step of pressurizing a stacked body which includes: a chip-temporarily-fixed body comprising a supporting plate, a temporarily-fixing material stacked over the supporting plate, and a semiconductor chip fixed temporarily over the temporarily-fixing material; a thermosetting resin sheet arranged over the chip-temporarily-fixed body; and a separator having a tensile storage elastic modulus of 200 MPa or more at 90° C. and arranged over the thermosetting resin sheet. In this way, a sealed body is formed which includes the semiconductor chip and the thermosetting resin sheet covering the semiconductor chip.

摘要翻译： 提供一种半导体封装的制造方法，其能够得到表面平滑性优异的密封树脂体，并且能够省略对密封的树脂体的树脂区域的研磨的任何步骤。 该方法是一种用于半导体封装的制造方法，包括对堆叠体进行加压的步骤，该堆叠体包括：芯片临时固定体，包括支撑板，堆叠在支撑板上的临时固定材料，以及半导体芯片 临时固定在临时固定材料上; 布置在所述芯片临时固定体上的热固性树脂片; 以及在90℃下的拉伸储存弹性模量为200MPa以上并且配置在热固性树脂片上的隔膜。 以这种方式，形成包括半导体芯片和覆盖半导体芯片的热固性树脂片的密封体。

公开(公告)号：US09451704B2

公开(公告)日：2016-09-20

申请号：US14062264

申请日：2013-10-24

申请人： Nitto Denko Corporation

发明人： Terukazu Ihara ,  Jun Ishii ,  Naohiro Terada

IPC分类号： H05K1/00 ,  H05K3/10 ,  G11B5/48 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/05 ,  H05K3/06

CPC分类号： H05K3/10 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/4685 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2203/0323 ,  Y10T29/49155

摘要： A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.

摘要翻译： 多个悬挂板和检查基板由支撑框架一体地支撑。 在每个悬挂板中，经由第一绝缘层在导电的第一支撑基板上形成线。 第一支撑基板和线通过第一绝缘层中的第一通孔电连接。 在检查基板中，导电层形成在导电性的第二支撑基板上，其间夹着第二绝缘层。 第二支撑基板和导体层通过第二绝缘层中的第二通孔电连接。 第一通孔和第二通孔具有相同的配置。

公开(公告)号：US09183879B2

公开(公告)日：2015-11-10

申请号：US13771636

申请日：2013-02-20

申请人： NITTO DENKO CORPORATION

发明人： Yoshito Fujimura ,  Tetsuya Ohsawa ,  Jun Ishii

IPC分类号： G11B21/16 ,  G11B5/48

CPC分类号： G11B21/16 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/4853

摘要： A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.

摘要翻译： 一种悬挂板，具有用于安装包括电子器件的滑块单元的电路，当相对于设置有磁头的滑块在厚度方向上突出时，安装电子装置形成与滑块重叠的重叠部分 ，以及从滑块突出的突出部。 具有电路的悬挂板形成有沿厚度方向贯穿的第一开口并容纳重叠部分，以及与第一开口连通并容纳突出部分的第二开口。

公开(公告)号：US20170278716A1

公开(公告)日：2017-09-28

申请号：US15506884

申请日：2015-08-06

申请人： NITTO DENKO CORPORATION

发明人： Chie Iino ,  Goji Shiga ,  Jun Ishii

IPC分类号： H01L21/31 ,  H01L23/00 ,  B32B7/12 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56

CPC分类号： H01L21/31 ,  B32B7/12 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L23/12 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/3511

摘要： In order to provide a sealing sheet capable of preventing same from falling off a suction collet during conveyancing, etc., and whereby semiconductor chips can be suitably buried, the sum α of a thickness t [mm] and a storage elastic modulus G′ [Pa] at 50° C., for this sealing sheet, fulfils 300≦α≦1.5×105.

公开(公告)号：US09295156B2

公开(公告)日：2016-03-22

申请号：US14283612

申请日：2014-05-21

申请人： NITTO DENKO CORPORATION

发明人： Kouji Ichinose ,  Jun Ishii ,  Yoshito Fujimura

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/05 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32

CPC分类号： H05K1/118 ,  H05K1/0271 ,  H05K1/05 ,  H05K3/0082 ,  H05K3/32 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K2203/0285 ,  H05K2203/308

摘要： A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.

摘要翻译： 布线电路板包括金属支撑层，第一绝缘层，导电图案和第二绝缘层。 第一和第二绝缘层包括露出导电图案的两个表面的第一和第二开口。 导电图案的另一侧的表面在厚度方向上通过第一开口露出并被构造为第一端子部分，并且其厚度方向的一侧的表面通过第二开口露出， 作为第二终端部分。 金属支撑层包括：第三开口，其暴露第一绝缘层的第一端子部分和覆盖导电图案的覆盖部分，该第一绝缘层覆盖导电图案，并连接到第一端子部分;以及加强部分，位于覆盖物的另一侧的表面上 部分厚度方向。

公开(公告)号：US09253879B2

公开(公告)日：2016-02-02

申请号：US13875896

申请日：2013-05-02

申请人： NITTO DENKO CORPORATION

发明人： Jun Ishii ,  Saori Kanazaki

IPC分类号： H05K1/09 ,  H05K1/02 ,  H05K3/06 ,  G11B5/48 ,  H05K3/40 ,  H05K1/18 ,  H05K3/32

CPC分类号： H05K1/0296 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/189 ,  H05K3/06 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

摘要： A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

摘要翻译： 布线电路板包括线，以及在布线电路板的厚度方向上在其一个表面上电连接到电线以电连接到电子元件的端子。 端子在其厚度方向的一个表面上包括在厚度方向上朝向其一侧突出的突出部分和覆盖突出部分在厚度方向上的一个端部的覆盖层。

公开(公告)号：US20170287800A1

公开(公告)日：2017-10-05

申请号：US15507923

申请日：2015-08-21

申请人： NITTO DENKO CORPORATION

发明人： Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L23/31 ,  C09J7/02 ,  H01L23/10

CPC分类号： H01L23/3142 ,  C09J7/22 ,  C09J7/30 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/0002 ,  H01L2924/18162

摘要： Provided is a sealing sheet capable of preventing void and filler segregation from occurring when forming a sealing body in which semiconductor chips are buried in the sealing sheet. The sealing sheet has a viscosity within the range of 1 Pa·s to 50000 Pa·s at 90° C.

公开(公告)号：US09659883B2

公开(公告)日：2017-05-23

申请号：US15023501

申请日：2014-09-09

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC分类号： H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/29 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/544

CPC分类号： H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

摘要： The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

公开(公告)号：US20160211228A1

公开(公告)日：2016-07-21

申请号：US15023501

申请日：2014-09-09

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L21/78 ,  H01L25/065

CPC分类号： H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

摘要： The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

摘要翻译： 本发明提供一种用于密封具有优异的可靠性和可储存性的半导体芯片的热固化树脂片，同时由于热固性树脂片的体积收缩而减少翘曲变形，以及半导体封装的制造方法。 本发明涉及用于密封半导体芯片的热固性树脂片，其中活化能（Ea）满足下式（1），在150℃下热固化1小时的产品的玻璃化转变温度为125 ℃以上，热固化物的玻璃化转变温度以下的热膨胀系数α[ppm / K]和热固化物的25℃下的储能模量E'[GPa]满足 下式（2）：30＆nlE; Ea＆nlE; 120 [kJ / mol]（1）; 和10,000＆nlE;α×E'＆nlE; 300,000 [Pa / K]（2）。

公开(公告)号：US08858810B2

公开(公告)日：2014-10-14

申请号：US13948488

申请日：2013-07-23

申请人： Nitto Denko Corporation

发明人： Jun Ishii

IPC分类号： G11B5/48 ,  G11B5/84

CPC分类号： G11B5/8404 ,  G11B5/48 ,  G11B5/484 ,  G11B5/486

摘要： A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region.

摘要翻译： 具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘层和形成在绝缘层上的导电图案，并且具有连接到安装在滑块上的磁头的连接端子的端子部分。 限定了滑块设置的滑块安装区域，并且多个端子部分在滑块安装区域中彼此间隔开，并且在金属支撑板中，开口以露出绝缘层， 端子部分设置在滑块安装区域。