公开(公告)号：US10998484B2

公开(公告)日：2021-05-04

申请号：US15777134

申请日：2016-10-04

申请人： NITTO DENKO CORPORATION

发明人： Keisuke Okumura ,  Satoshi Honda

IPC分类号： H01L35/34 ,  H01L35/08 ,  B22F3/10 ,  H01L27/16 ,  H01L35/28 ,  H01L35/16

摘要： Provided is a semiconductor device manufacturing method which can suppress the occurrence of positional deviation or inclination of a semiconductor element when the semiconductor element is fixed so as to be sandwiched-between two insulating substrates. The semiconductor device manufacturing method includes: obtaining a laminated body in which a semiconductor element is temporarily adhered on a first electrode formed on a first insulating substrate with a first pre-sintering layer sandwiched therebetween; temporarily adhering the semiconductor element on a second electrode formed on a second insulating substrate with a second pre-sintering layer sandwiched therebetween, the second pre-sintering layer being provided on a side opposite to the first pre-sintering layer, to obtain a semiconductor device precursor; and simultaneously heating the first pre-sintering layer and the second pre-sintering layer, to bond the semiconductor element to the first electrode and the second electrode.

公开(公告)号：US20190043824A1

公开(公告)日：2019-02-07

申请号：US16074839

申请日：2016-12-13

申请人： NITTO DENKO CORPORATION

发明人： Yuki Sugo ,  Nao Kamakura ,  Satoshi Honda

IPC分类号： H01L23/00 ,  H01L21/683

摘要： A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

公开(公告)号：US11817415B2

公开(公告)日：2023-11-14

申请号：US16308931

申请日：2017-05-23

申请人： NITTO DENKO CORPORATION

发明人： Satoshi Honda ,  Yuki Sugo ,  Nao Kamakura

IPC分类号： C09J1/00 ,  H01L23/00 ,  C09J7/10 ,  C09J7/38 ,  C09J9/02 ,  C09J11/04 ,  H01J37/28 ,  H01L21/52 ,  H01L21/683 ,  H01L21/78 ,  C08K3/08 ,  C08K3/10 ,  C09J9/00

CPC分类号： H01L24/32 ,  C09J1/00 ,  C09J7/10 ,  C09J7/385 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  H01J37/28 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/83 ,  C08K3/08 ,  C08K3/10 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2400/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

公开(公告)号：US11795350B2

公开(公告)日：2023-10-24

申请号：US17262584

申请日：2019-07-29

申请人： NITTO DENKO CORPORATION

发明人： Masayuki Okamoto ,  Naofumi Kosaka ,  Satoshi Honda ,  Yosuke Shimizu ,  Ryoko Asai

IPC分类号： C09J7/38 ,  C09J7/10

CPC分类号： C09J7/385 ,  C09J7/10 ,  C09J2301/302 ,  C09J2301/408 ,  C09J2433/00

摘要： Provided is an optical PSA composition that can be easily peeled using an aqueous liquid such as water and has sufficient adhesive strength. An optical PSA composition comprising an acrylic polymer is provided. The PSA composition comprises at least one species of compound A selected among surfactants and compounds having polyoxyalkylene backbones. The monomers forming the acrylic polymer comprises less than 20 wt % alkoxyalkyl (meth)acrylate and less than 20 wt % alkoxypolyalkylene glycol (meth)acrylate. Alternatively, the compound A content is less than 1 part by weight to 100 parts by weight of the acrylic polymer.

公开(公告)号：US20190047081A1

公开(公告)日：2019-02-14

申请号：US16075260

申请日：2016-12-13

申请人： NITTO DENKO CORPORATION

发明人： Nao Kamakura ,  Yuki Sugo ,  Satoshi Honda

IPC分类号： B23K20/16 ,  B22F7/08

CPC分类号： B23K20/16 ,  B22F3/14 ,  B22F7/08 ,  B22F2201/01 ,  B22F2201/02 ,  B22F2201/20 ,  B22F2999/00 ,  B23K20/026 ,  B23K35/0222 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/38 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2103/56 ,  B32B5/16 ,  B32B15/00 ,  B32B37/04 ,  B32B37/06 ,  B32B37/1009 ,  B32B37/24 ,  B32B2305/342 ,  B32B2305/80 ,  B32B2309/022 ,  B32B2309/125 ,  B32B2309/68 ,  B32B2311/04 ,  B32B2311/08 ,  B32B2311/12 ,  B32B2311/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27436 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/27

摘要： Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

公开(公告)号：US20210198526A1

公开(公告)日：2021-07-01

申请号：US16326427

申请日：2017-05-18

申请人： NITTO DENKO CORPORATION

发明人： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC分类号： C09J7/22 ,  H01L21/683 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  C09J9/02 ,  C09J11/04 ,  C09J7/38

摘要： A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.

公开(公告)号：US10748866B2

公开(公告)日：2020-08-18

申请号：US16074839

申请日：2016-12-13

申请人： NITTO DENKO CORPORATION

发明人： Yuki Sugo ,  Nao Kamakura ,  Satoshi Honda

IPC分类号： H01L21/60 ,  H01L23/00 ,  B23K20/00 ,  H01L21/52 ,  B22F7/08 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B22F1/00 ,  H01L21/683 ,  B23K101/40 ,  B23K35/38 ,  B22F7/00

摘要： A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

公开(公告)号：US11786966B2

公开(公告)日：2023-10-17

申请号：US16322086

申请日：2017-05-18

申请人： NITTO DENKO CORPORATION

发明人： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC分类号： B32B27/36 ,  B32B27/08 ,  C09J7/22 ,  B32B7/12 ,  C09J133/06 ,  C09J7/30 ,  B22F3/02 ,  H01L21/52 ,  C23C28/04 ,  C23C28/00 ,  C09J11/04 ,  C09J9/02 ,  C08F220/18 ,  C09J7/10 ,  H01L21/304 ,  H01L21/683

CPC分类号： B22F3/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/365 ,  C08F220/1808 ,  C09J7/10 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J133/066 ,  C23C28/00 ,  C23C28/04 ,  C23C28/30 ,  C23C28/34 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  C08K2201/001 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2301/41 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  C08F220/1808 ,  C08F220/20

摘要： A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

公开(公告)号：US10821543B2

公开(公告)日：2020-11-03

申请号：US16075260

申请日：2016-12-13

申请人： NITTO DENKO CORPORATION

发明人： Nao Kamakura ,  Yuki Sugo ,  Satoshi Honda

IPC分类号： B23K20/00 ,  B23K20/16 ,  B22F7/08 ,  B23K35/36 ,  B23K35/02 ,  B22F3/14 ,  B32B15/00 ,  H01L23/00 ,  B23K20/02 ,  B23K103/00 ,  B23K35/38 ,  B23K101/40 ,  B23K101/36 ,  B32B5/16 ,  B32B37/04 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24

摘要： Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

公开(公告)号：US20190184460A1

公开(公告)日：2019-06-20

申请号：US16322086

申请日：2017-05-18

申请人： NITTO DENKO CORPORATION

发明人： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC分类号： B22F3/02 ,  H01L21/52 ,  H01L21/683 ,  H01L21/304 ,  C09J7/10

CPC分类号： B22F3/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/365 ,  C08F220/18 ,  C08K2201/001 ,  C09J7/10 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J133/066 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C23C28/00 ,  C23C28/04 ,  C23C28/30 ,  C23C28/34 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08F2220/1858 ,  C08F220/20

摘要： A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.