公开(公告)号：US20050040342A1

公开(公告)日：2005-02-24

申请号：US10919443

申请日：2004-08-17

申请人： Noboru Kimura ,  Joji Kuniya ,  Masataka Arai

发明人： Noboru Kimura ,  Joji Kuniya ,  Masataka Arai

IPC分类号： G01N21/73 ,  B01L3/00 ,  B01L3/04 ,  C23C16/34 ,  C23C16/38 ,  C23C16/42 ,  G01N1/10 ,  G01N1/28 ,  G01N1/38 ,  G01N21/31 ,  H01J49/10 ,  H05H1/30 ,  H01J49/00

CPC分类号： G01N1/38 ,  B01L3/04 ,  B01L2200/12 ,  B01L2300/12 ,  H01J49/105 ,  H05H1/30

摘要： There is disclosed a vessel for pretreatment of elementary analysis wherein the vessel is a ceramic vessel produced by chemical vapor deposition (CVD) method. And there is disclosed an inductively coupled plasma torch that has at least an induction coil and a nozzle and is used in an apparatus for elementary analysis by ICP method, wherein the nozzle is a ceramic nozzle produced by CVD method. Thus, there can be provided a vessel for pretreatment of elementary analysis that excels in heat resistance and chemical resistance such as acid resistance, and has high purity. There can be also provided an inductively coupled plasma torch used in an apparatus for analysis by ICP method that enables accurate elementary analysis and excels in durability, and an apparatus for elementary analysis by ICP method having this.

摘要翻译： 公开了用于预处理元素分析的容器，其中容器是通过化学气相沉积（CVD）法制造的陶瓷容器。 并且公开了至少具有感应线圈和喷嘴的电感耦合等离子体焰炬，并且用于通过ICP方法进行元素分析的装置，其中喷嘴是通过CVD法制造的陶瓷喷嘴。 因此，可以提供一种用于预热处理的容器，其耐热性和耐化学性如耐酸性优异且纯度高。 还可以提供一种电感耦合等离子体焰炬，用于通过ICP方法分析的装置，其能够进行精确的元素分析和耐久性优异，以及用于通过ICP方法进行元素分析的装置。

公开(公告)号：US20080193886A1

公开(公告)日：2008-08-14

申请号：US10588212

申请日：2005-02-09

申请人： Shunsuke Amano ,  Masataka Arai

发明人： Shunsuke Amano ,  Masataka Arai

IPC分类号： F23M3/02

CPC分类号： F23C3/006 ,  F23C7/02 ,  F23C9/006 ,  F23R3/06 ,  F23R3/46 ,  F23R3/50

摘要： A combustion apparatus according to the present invention can positively control and generate burnt gas recirculation with a simple structure. The combustion apparatus has an annular container (12) having an inner cylindrical portion (15) forming an inner circumferential side surface, an outer cylindrical portion (13) forming an outer circumferential side surface, an open end (26), and a close end (10). A flow (28) of air is formed so as to have a velocity component in the direction of a central axis (J) from the open end (26) to the close end (10) and a velocity component to swirl in a circumferential direction of the annular container (12). Fuel (23) is injected so as to have a velocity component in the direction of the central axis (J) from the close end (10) to the open end (26) and a velocity component directed radially outward.

摘要翻译： 根据本发明的燃烧装置可以以简单的结构积极地控制和产生燃烧气体再循环。 燃烧装置具有环形容器（12），其具有形成内周侧面的内圆筒部（15），形成外周侧面的外筒部（13），开口端（26）和封闭端 （10）。 空气流（28）形成为具有从开口端（26）到近端（10）的中心轴线（J）方向的速度分量，并且沿周向旋转的速度分量 的环形容器（12）。 燃料（23）被注入以具有从近端（10）到开放端（26）的中心轴线（J）方向的速度分量和径向向外的速度分量。

公开(公告)号：US20090321919A1

公开(公告)日：2009-12-31

申请号：US11885404

申请日：2007-04-20

申请人： Mitsuo Sugino ,  Takeshi Hosomi ,  Masahiro Wada ,  Masataka Arai

发明人： Mitsuo Sugino ,  Takeshi Hosomi ,  Masahiro Wada ,  Masataka Arai

IPC分类号： H01L23/488 ,  H01L23/48

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/0401

摘要： The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.

摘要翻译： 半导体器件1包括基板3，安装在基板3上的半导体芯片4，基板3，连接基板3和半导体芯片4的凸块5以及填充在凸块5周围的底部填充6。 由熔点为230℃以上的高熔点焊料构成的凸块5由底部填充材料6构成，其弹性模量为30MPa〜3000MPa的范围。 在由无铅焊料构成的突起5的情况下，底部填充物6由弹性模量在150MPa〜800MPa的范围内的树脂材料构成。 基板3的堆积层31的绝缘层311在25℃的温度范围内的基板的面内方向的线膨胀系数为35ppm /℃以下，玻璃化转变温度 。

公开(公告)号：US20070272201A1

公开(公告)日：2007-11-29

申请号：US10588004

申请日：2005-02-09

申请人： Shunsuke Amano ,  Masataka Arai

发明人： Shunsuke Amano ,  Masataka Arai

IPC分类号： F02B17/00 ,  F23C7/00

CPC分类号： F23D17/002 ,  F23C6/045 ,  F23C7/002 ,  F23C2900/06041 ,  F23D11/404

摘要： A combustion apparatus according to the present invention can positively control and generate burnt gas recirculation with a simple structure. The combustion apparatus has a cylindrical container (12) having a combustion chamber, a close end (10), and an open end (26), an inflow passages (20) for supplying combustion air into the combustion chamber in the cylindrical container (12), and a fuel nozzle (18) for supplying fuel into the combustion chamber in the cylindrical container (12). A flow (28) of air is formed so as to have a velocity component in a direction of a central axis (J) from the open end (26) to the close end (10) and a velocity component to swirl in a circumferential direction of said annular container (12). Fuel is injected so as to have a velocity component in the direction of the central axis (J) from the close end (10) to the open end (26) and a velocity component directed radially outward.

摘要翻译： 根据本发明的燃烧装置可以以简单的结构积极地控制和产生燃烧气体再循环。 该燃烧装置具有一个具有燃烧室，一个近端（10）和一个开放端（26）的圆柱形容器（12），一个用于将燃烧空气供入圆筒形容器（12）中的燃烧室的流入通道 ）和用于将燃料供给到圆筒形容器（12）中的燃烧室的燃料喷嘴（18）。 空气流（28）形成为具有从开口端（26）到近端（10）的中心轴线（J）的方向的速度分量，并且沿圆周方向旋转的速度分量 的所述环形容器（12）。 喷射燃料以使得在从中心轴线（J）的方向到从近端（10）到开口端（26）的速度分量和径向向外的速度分量。

公开(公告)号：US08629556B2

公开(公告)日：2014-01-14

申请号：US11885404

申请日：2007-04-20

申请人： Mitsuo Sugino ,  Takeshi Hosomi ,  Masahiro Wada ,  Masataka Arai

发明人： Mitsuo Sugino ,  Takeshi Hosomi ,  Masahiro Wada ,  Masataka Arai

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/0401

摘要： The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.

摘要翻译： 半导体器件1包括基板3，安装在基板3上的半导体芯片4，基板3，连接基板3和半导体芯片4的凸块5以及填充在凸块5周围的底部填充6。 由熔点为230℃以上的高熔点焊料构成的凸块5由底部填充材料6构成，其弹性模量为30MPa〜3000MPa的范围。 在由无铅焊料构成的突起5的情况下，底部填充物6由弹性模量在150MPa〜800MPa的范围内的树脂材料构成。 基板3的堆积层31的绝缘层311在25℃的温度范围内的基板的面内方向的线膨胀系数为35ppm /℃以下，玻璃化转变温度 。

公开(公告)号：US20090166060A1

公开(公告)日：2009-07-02

申请号：US12225106

申请日：2006-03-20

申请人： Iji Onozuka ,  Masataka Arai ,  Takeshi Hosomi

发明人： Iji Onozuka ,  Masataka Arai ,  Takeshi Hosomi

IPC分类号： H05K1/00 ,  B32B27/06

CPC分类号： H05K3/4626 ,  H05K1/024 ,  H05K1/036 ,  H05K2201/0195 ,  H05K2201/068 ,  Y10T428/31504 ,  Y10T428/31587 ,  Y10T428/31855

摘要： An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.

摘要翻译： 一种绝缘树脂层，其能够用于通过热压缩成形工艺形成多层印刷线路板，包括：至少一个第一层和至少一层第二层，其中所述绝缘树脂层的比介电常数 热压成形后1MHz频率的第一层不大于3.2，其中第二层的线膨胀系数在不低于35度至不高于85度的温度范围内 热压缩成形后的温度不超过40ppm /℃。一种多层印刷线路板，其通过在内层电路板的至少一侧上设置上述绝缘树脂层，然后进行热处理 压缩成型工艺。

公开(公告)号：US4143110A

公开(公告)日：1979-03-06

申请号：US813867

申请日：1977-07-08

申请人： Mituharu Morozumi ,  Masataka Arai ,  Shigeru Iseki

发明人： Mituharu Morozumi ,  Masataka Arai ,  Shigeru Iseki

IPC分类号： C08J3/12 ,  B01J2/14

CPC分类号： C08J3/12 ,  C08J2327/18

摘要： Finely ground polytetrafluoroethylene molding powder with or without a filler is subjected to high speed agitation in the presence of a medium consisting essentially of water and a hydrophobic organic liquid at a ratio of 0.5 to 1 liter per 1 Kg of the resin to agglomerate it. Hydrophobic organic liquids mean organic liquid which dissolve less than 15 wt. % in water at the temperature of agglomeration.The volumetric ratio of the organic liquid to water is in a range of 2 to 1/2.The agglomerated product having narrow particle size distribution and high bulk density and free flowing property can be obtained by the agitation for short time.

公开(公告)号：US20110120630A1

公开(公告)日：2011-05-26

申请号：US13014072

申请日：2011-01-26

申请人： Maroshi YUASA ,  Takeshi Hosomi ,  Masataka Arai

发明人： Maroshi YUASA ,  Takeshi Hosomi ,  Masataka Arai

IPC分类号： B32B37/10

CPC分类号： H05K3/4673 ,  B29C70/506 ,  B29C70/885 ,  B29K2105/0872 ,  B32B3/04 ,  B32B5/022 ,  B32B5/024 ,  B32B15/08 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/44 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0366 ,  H05K2203/0264 ,  H05K2203/066 ,  Y10T442/20

摘要： A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.

摘要翻译： 提供了特别适用于制备积层型多层印刷电路板的具有优异的浸渍性和厚度精度的载体的预浸料的制造方法。 另外，提供了具有通过制造方法制备的载体的预浸料坯和利用载体的预浸料坯制造多层印刷电路板的方法。 提供了一种用于连续制造具有载体的预浸料坯的方法，所述载体包括具有织物的主链材料的绝缘树脂层，（a）将包含绝缘树脂层的第一和第二载体的绝缘树脂层侧层叠在一个上 在织物的两侧分别形成层叠体并在减压下粘合，（b）粘结后，在绝缘树脂的熔点以上的温度下加热层叠体 。

公开(公告)号：US07655871B2

公开(公告)日：2010-02-02

申请号：US10594206

申请日：2005-03-23

申请人： Masataka Arai ,  Takeshi Hosomi ,  Hiroaki Wakabayashi

发明人： Masataka Arai ,  Takeshi Hosomi ,  Hiroaki Wakabayashi

IPC分类号： H05K1/00 ,  B32B15/00

CPC分类号： B32B27/20 ,  B32B15/08 ,  B32B27/28 ,  B32B27/38 ,  C08G59/08 ,  C08G59/4014 ,  C08G59/56 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0358 ,  Y10T428/254 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31547

摘要： A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The resin composition is capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and includes: a cyanate resin and/or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof.

摘要翻译： 制造了多层印刷电路板，其表现出较高的热阻和较低的热膨胀，使得在诸如冷却加热循环试验等的热冲击试验中不会发生剥落和/或不发生裂纹，另外 以展示阻燃性。 树脂组合物能够用于形成附着有树脂的金属箔的树脂层或基材附着绝缘片的绝缘片，并且包括：氰酸酯树脂和/或其预聚物; 基本上不含卤素原子的环氧树脂; 基本上不含卤素原子的苯氧基树脂; 咪唑化合物; 和无机填料，还涉及通过用这种树脂组合物包覆金属箔形成的树脂附着金属箔，通过包覆绝缘基材而形成的基材附着绝缘片和多层印刷线路板 通过在内层电路板的一侧或两侧铺设这种具有树脂的金属箔或这种基底材料附着的绝缘片而形成，并对其进行热压成形。

公开(公告)号：US20080254300A1

公开(公告)日：2008-10-16

申请号：US10594206

申请日：2005-03-23

申请人： Masataka Arai ,  Takeshi Hosomi ,  Hiroaki Wakabayashi

发明人： Masataka Arai ,  Takeshi Hosomi ,  Hiroaki Wakabayashi

IPC分类号： B32B15/08 ,  C08G59/56

CPC分类号： B32B27/20 ,  B32B15/08 ,  B32B27/28 ,  B32B27/38 ,  C08G59/08 ,  C08G59/4014 ,  C08G59/56 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0358 ,  Y10T428/254 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31547

摘要： A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy. The present invention is directed to a resin composition, capable of being employed for forming a resin layer of a resin-attached metal foil or an insulating sheet of a base material-attached insulating sheet, and comprises: a cyanate resin and/or a prepolymer thereof; an epoxy resin substantially containing no halogen atom; a phenoxy resin substantially containing no halogen atom; an imidazole compound; and an inorganic filler, and also directed to a resin-attached metal foil formed by cladding a metal foil with such resin composition, a base material-attached insulating sheet formed by cladding an insulating base material therewith, and a multiple-layered printed wiring board, formed by laying such resin-attached metal foil(s) or such base material-attached insulating sheet(s) on a single side or both sides of an internal layer circuit board, and hot pressure forming thereof.

摘要翻译： 制造了多层印刷电路板，其表现出较高的热阻和较低的热膨胀，使得在诸如冷却加热循环试验等的热冲击试验中不会发生剥落和/或不发生裂纹，另外 以展示阻燃性。 本发明涉及一种树脂组合物，其可用于形成附着有树脂的金属箔的树脂层或基材附着绝缘片的绝缘片，并且包括：氰酸酯树脂和/或预聚物 的; 基本上不含卤素原子的环氧树脂; 基本上不含卤素原子的苯氧基树脂; 咪唑化合物; 和无机填料，还涉及通过用这种树脂组合物包覆金属箔形成的树脂附着金属箔，通过包覆绝缘基材而形成的基材附着绝缘片和多层印刷线路板 通过在内层电路板的一侧或两侧铺设这种具有树脂的金属箔或这种基底材料附着的绝缘片而形成，并对其进行热压成形。