Semiconductor laser device and method of fabricating the same
    3.
    发明授权
    Semiconductor laser device and method of fabricating the same 失效
    半导体激光器件及其制造方法

    公开(公告)号:US07120181B1

    公开(公告)日:2006-10-10

    申请号:US09532786

    申请日:2000-03-22

    IPC分类号: H01S5/00

    摘要: In a semiconductor laser device, an AlGaN buffer layer, a GaN layer, an n-GaN layer, an n-AlGaN cladding layer, an MQW light emitting layer, a p-AlGaN cladding layer, a p-first GaN cap layer, a current blocking layer composed of n-AlGaN, and a p-second GaN cap layer are stacked in this order on a sapphire substrate, and a ridge portion having an upper surface having a width W1 is formed by etching. The current blocking layer has an opening having a width W2 on the upper surface of the ridge portion. The width W2 of the opening is smaller than the width W1 of the upper surface of the ridge portion. Accordingly, in a light emitting region of the MQW light emitting layer, a saturable light absorbing region is formed on both sides of a current injection region.

    摘要翻译: 在半导体激光器件中,AlGaN缓冲层,GaN层,n-GaN层,n-AlGaN包覆层,MQW发光层,p-AlGaN包覆层,p第一GaN覆盖层, 由n-AlGaN构成的电流阻挡层和p-second GaN覆盖层依次层叠在蓝宝石基板上,具有宽度W 1 1的上表面的脊部由 蚀刻。 电流阻挡层在脊部的上表面上具有宽度W 2 2的开口。 开口的宽度W 2 2小于脊部的上表面的宽度W 1 1 <1>。 因此,在MQW发光层的发光区域中,在电流注入区域的两侧形成有可饱和的光吸收区域。

    Semiconductor laser device and method of fabricating the same
    8.
    发明授权
    Semiconductor laser device and method of fabricating the same 失效
    半导体激光器件及其制造方法

    公开(公告)号:US06904071B1

    公开(公告)日:2005-06-07

    申请号:US09532791

    申请日:2000-03-22

    摘要: An n-contact layer, an n-cladding layer, an MQW active layer, and a p-first cladding layer are formed in this order on a sapphire substrate. An n-current blocking layer having a striped opening is formed on the p-first cladding layer. The width of the striped opening gradually increases from W2 to W1 as the depth thereof decreases from a lower layer to an upper layer in the current blocking layer. A p-second cladding layer is formed on the n-current blocking layer and on the p-first cladding layer inside the striped opening. The p-second cladding layer comprises a lower layer having the width W2 at its lower end and an upper layer having a width W1 lager than the width W2.

    摘要翻译: 在蓝宝石衬底上依次形成n接触层,n包覆层,MQW有源层和p第一覆盖层。 在p第一覆层上形成具有条纹开口的n电流阻挡层。 由于当前阻挡层的深度从下层向上层减小,条纹开口的宽度从W 2逐渐增加到W1。 在n电流阻挡层和条形开口内的p第一包层上形成p第二覆层。 p第二包覆层包括其下端具有宽度W 2的下层和具有比宽度W 2更大的宽度W1的上层。

    Semiconductor light emitting device
    9.
    发明授权
    Semiconductor light emitting device 有权
    半导体发光器件

    公开(公告)号:US06580736B1

    公开(公告)日:2003-06-17

    申请号:US09533970

    申请日:2000-03-23

    IPC分类号: H01S500

    摘要: In a semiconductor laser device, a buffer layer, an n-contact layer, an n-light cladding layer, an n-light guide layer, an emission layer, a p-cap layer, a p-light guide layer and an n-current blocking layer having a striped opening are successively formed on a sapphire substrate, and a p-light cladding layer is formed in the opening. A p-contact layer is formed on the p-light cladding layer and on the n-current blocking layer. The n-current blocking layer is made of n-Al0.3Ga0.7N and has an electron concentration of 1×1017 cm−3 and an Al composition greater than 0.1, and the surface thereof is terminated with N.

    摘要翻译: 在半导体激光装置中,缓冲层,n接触层,n光包覆层,n光导层,发光层,p帽层,p导光层和n- 在蓝宝石基板上依次形成具有条纹开口的电流阻挡层,在开口部形成有p光包覆层。 p-接触层形成在p光覆层和n电流阻挡层上。 n电流阻挡层由n-Al 0.3 Ga 0.7 N制成,电子浓度为1×10 17 cm -3,Al组成大于0.1,其表面用N端接。

    Nitride semiconductor laser device
    10.
    发明授权
    Nitride semiconductor laser device 失效
    氮化物半导体激光器件

    公开(公告)号:US06522676B1

    公开(公告)日:2003-02-18

    申请号:US09492008

    申请日:2000-01-27

    IPC分类号: H01S500

    摘要: A nitride semiconductor device of the self-pulsation type comprises as superposed on a substrate 1 an n-type cladding layer 3, active layer 4 and p-type cladding layer including an upwardly projecting stripe portion 53, an n-type current blocking layer 6 being formed at each of opposite sides of the stripe portion 53. The stripe portion 53 of the p-type cladding layer 5 comprises an upper stripe portion 51 and a lower stripe portion 52. The upper stripe portion 51 has a minimum width W1 at the position of the boundary between the upper and lower stripe portions 51, 52, and the lower stripe portion 52 has at the position of its lower end a width W2 greater than the minimum width W1 of the upper stripe portion 51. This construction realizes a higher yield than in the prior art.

    摘要翻译: 自脉动型氮化物半导体器件包括在基板1上叠加n型包覆层3,有源层4和包括向上突出的条形部分53,n型电流阻挡层6的p型覆层 形成在条形部分53的相对两侧.p型包覆层5的条形部分53包括上条纹部分51和下条纹部分52.上条纹部分51具有最小宽度W1 上条带部分51和下条带部分52和下条部分52之间的边界的位置在其下端的宽度W2大于上条部分51的最小宽度W1的位置。这种结构实现了更高的 产率高于现有技术。