公开(公告)号：US06476750B1

公开(公告)日：2002-11-05

申请号：US09485349

申请日：2000-02-09

申请人： Nobuyasu Kanekawa ,  Yasuyuki Kojima ,  Seigou Yukutake ,  Minehiro Nemoto ,  Kazuhisa Takami ,  Takayuki Iwasaki ,  Yusuke Takeuchi ,  Katsuhiro Furukawa

发明人： Nobuyasu Kanekawa ,  Yasuyuki Kojima ,  Seigou Yukutake ,  Minehiro Nemoto ,  Kazuhisa Takami ,  Takayuki Iwasaki ,  Yusuke Takeuchi ,  Katsuhiro Furukawa

IPC分类号： H03M112

CPC分类号： H03M3/392 ,  H03M3/498

摘要： The hardware of an over-sampling A/D and D/A converter is provided, which hardware is capable of being operated with either kind of software: one corresponding to a first method in which the over-sampling ratio is fixed and the other corresponding to a second method in which the over-sampling ratio is variable. The value N3 written on the pseudo-frequency-dividing-ratio-register 11 and the value N4 written on the pseudo-over-sampling-ratio-register 21 are converted through a user interface into the frequency dividing ratio N1 by the conversion circuit 12 and the converted result is written in the frequency-dividing-ratio-register 10.

摘要翻译： 提供过采样A / D和D / A转换器的硬件，哪个硬件能够使用任何一种软件进行操作：一种对应于过采样率固定的第一种方法，另一种对应 到过采样比是可变的第二种方法。 写入伪分频比寄存器11的值N3和写在伪过采样比寄存器21上的值N4由转换电路12通过用户接口转换成分频比N1 转换后的结果写入分频比寄存器10。

公开(公告)号：US06344809B1

公开(公告)日：2002-02-05

申请号：US09704687

申请日：2000-11-03

申请人： Nobuyasu Kanekawa ,  Yasuyuki Kojima ,  Seigou Yukutake ,  Minehiro Nemoto ,  Kazuhisa Takami ,  Takayuki Iwasaki ,  Yusuke Takeuchi ,  Yasuo Shima

发明人： Nobuyasu Kanekawa ,  Yasuyuki Kojima ,  Seigou Yukutake ,  Minehiro Nemoto ,  Kazuhisa Takami ,  Takayuki Iwasaki ,  Yusuke Takeuchi ,  Yasuo Shima

IPC分类号： H03M900

CPC分类号： H04L12/10 ,  H04M1/573 ,  H04M3/005

摘要： In order to reduce the consumption of power of an isolator interface and an ADC, it is proposed to operate a calling signal reception or Caller ID signal reception function only with power supplied from the system switch while maintaining the on-hook condition of a telephone. At the time of normal operation, the output of the analogue digital converter is input to an isolator through the isolator interface, and at the time of the calling signal reception or the caller identification information reception, the output of the analogue digital converter is input directly to the isolator.

摘要翻译： 为了减少隔离器接口和ADC的功率消耗，建议仅在保持电话机的挂机状态的同时从系统交换机提供的电源来操作呼叫信号接收或来电显示信号接收功能。 在正常运行时，模拟数字转换器的输出通过隔离器接口输入到隔离器，在呼叫信号接收或来电识别信息接收时，模拟数字转换器的输出直接输入 到隔离器。

公开(公告)号：US06407432B1

公开(公告)日：2002-06-18

申请号：US09446846

申请日：1999-12-29

申请人： Minehiro Nemoto ,  Yasuyuki Kojima ,  Nobuyasu Kanekawa ,  Seigou Yukutake ,  Katsuhiro Furukawa

发明人： Minehiro Nemoto ,  Yasuyuki Kojima ,  Nobuyasu Kanekawa ,  Seigou Yukutake ,  Katsuhiro Furukawa

IPC分类号： H01L2701

CPC分类号： H01L21/76264 ,  H01L21/7624 ,  H01L21/76283 ,  H01L21/76291 ,  H01L23/49541 ,  H01L23/642 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A small sized semiconductor device having a high insulating performance between a primary side circuit and a secondary side circuit is realized. A circuit region 2, plural first and second terminal electrodes 5 connected to the circuit region 3, and an insulation-separation region 4 for separating electrically the first terminal electrodes from the second terminal electrodes, and for transmitting signals between the first and the second terminal electrodes are formed onto a semiconductor chip 1, and the insulation-separation region 4 is provided between the first and second terminal electrodes. The interval between the first and the second terminal electrodes on the same semiconductor chip can be separated with high insulating performance.

摘要翻译： 实现了在初级侧电路和次级侧电路之间具有高绝缘性能的小尺寸半导体器件。 电路区域2，连接到电路区域3的多个第一和第二端子电极5以及用于将第一端子电极与第二端子电极分离并用于在第一和第二端子之间传输信号的绝缘分离区域4 电极形成在半导体芯片1上，并且绝缘分离区域4设置在第一和第二端子电极之间。 相同半导体芯片上的第一和第二端子电极之间的间隔可以以高绝缘性能分离。

公开(公告)号：US06603807B1

公开(公告)日：2003-08-05

申请号：US09259058

申请日：1999-02-26

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H01L2900

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： An isolator is made monolithic by forming a capacitive insulating barrier using an interlayer insulation film on the semiconductor substrate to miniaturize the modem device by the monolithic isolator.

摘要翻译： 隔离器通过在半导体衬底上形成使用层间绝缘膜的电容绝缘屏障来制成单片，以通过单片隔离器使调制解调器装置小型化。

公开(公告)号：US20070153886A1

公开(公告)日：2007-07-05

申请号：US11714856

申请日：2007-03-07

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04L5/16

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

摘要翻译： 提供一种通信系统，包括收发机和应用控制器，用于通过收发信机发送和接收信号。 绝缘和分离收发器和应用控制器的隔离器包括在基板上彼此绝缘的初级和次级侧电路和用于在初级侧和第二侧之间传递信号的电容绝缘装置，同时将初级侧电路与次级侧隔离 电路。

公开(公告)号：US07289553B2

公开(公告)日：2007-10-30

申请号：US10377670

申请日：2003-03-04

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04B1/38 ,  H01L29/00

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

公开(公告)号：US07522692B2

公开(公告)日：2009-04-21

申请号：US11714856

申请日：2007-03-07

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04L23/00 ,  H04B1/38 ,  H01L29/00

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

摘要翻译： 提供一种通信系统，包括收发机和应用控制器，用于通过收发信机发送和接收信号。 绝缘和分离收发器和应用控制器的隔离器包括在基板上彼此绝缘的初级和次级侧电路和用于在初级侧和第二侧之间传递信号的电容绝缘装置，同时将初级侧电路与次级侧隔离 电路。

公开(公告)号：US06853063B2

公开(公告)日：2005-02-08

申请号：US10443039

申请日：2003-05-22

申请人： Noboru Akiyama ,  Minehiro Nemoto ,  Seigou Yukutake ,  Yasuyuki Kojima ,  Kazuyuki Kamegaki

发明人： Noboru Akiyama ,  Minehiro Nemoto ,  Seigou Yukutake ,  Yasuyuki Kojima ,  Kazuyuki Kamegaki

IPC分类号： H01L25/18 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L25/04 ,  H01L25/16 ,  H01L23/02 ,  H01L23/34 ,  H01L22/16 ,  H01L23/28 ,  H05K7/02

CPC分类号： H01L23/3107 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on a plurality of semiconductor chips. A driver circuit for signal transmission or receiver circuit for signal receipt formed on the semiconductor chips are electrically connected with substrate-side electrodes of said high withstand voltage capacitors, causing the plurality of semiconductor chips to be received within either a single package or a single module. Using this arrangement, a semiconductor device is capable of achieving both dielectricity and size reduction.

摘要翻译： 引线接合或印刷电路板引线或引线框架或其等同物用于电连接形成在多个半导体芯片上的高耐压电容器的外部电极。 在半导体芯片上形成的用于信号传输的信号传输或接收电路的驱动电路与所述高耐压电容器的衬底侧电极电连接，导致多个半导体芯片被接收在单个封装或单个模块内 。 使用这种布置，半导体器件能够实现电介质和尺寸减小。

公开(公告)号：US07598605B2

公开(公告)日：2009-10-06

申请号：US11495585

申请日：2006-07-31

申请人： Noboru Akiyama ,  Minehiro Nemoto ,  Seigou Yukutake ,  Yasuyuki Kojima ,  Kazuyuki Kamegaki

发明人： Noboru Akiyama ,  Minehiro Nemoto ,  Seigou Yukutake ,  Yasuyuki Kojima ,  Kazuyuki Kamegaki

IPC分类号： H01L23/24 ,  H01L23/02 ,  H01L23/28 ,  H05K7/02

CPC分类号： H01L23/3107 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while permitting signal transmission between these circuits. A second capacitive insulator on the second semiconductor substrate electrically isolates the primary and secondary side circuit while permitting signal transmission therebetween. First and second frames are provided for input and output of signals to and from the primary and secondary side circuits. External electrodes of the first and second capacitive insulators are connected together by a third lead frame via a conductive adhesive body including more than one solder ball. The first and second substrates and the lead frames are sealed by a dielectric resin.

摘要翻译： 初级侧电路和次级侧电路分别设置在第一和第二半导体衬底上。 第一基板上的第一电容绝缘体在允许这些电路之间的信号传输的同时在一次侧电路和次侧电路之间电绝缘和隔离。 第二半导体衬底上的第二电容绝缘体电隔离初级和次级侧电路，同时允许它们之间的信号传输。 第一和第二帧被提供用于输入和输出到主电路和次级侧电路的信号。 第一和第二电容性绝缘体的外部电极通过包括多于一个焊球的导电粘合体由第三引线框架连接在一起。 第一和第二基板和引线框由绝缘树脂密封。

公开(公告)号：US07091588B2

公开(公告)日：2006-08-15

申请号：US11024680

申请日：2004-12-30

申请人： Noboru Akiyama ,  Minehiro Nemoto ,  Seigou Yukutake ,  Yasuyuki Kojima ,  Kazuyuki Kamegaki

发明人： Noboru Akiyama ,  Minehiro Nemoto ,  Seigou Yukutake ,  Yasuyuki Kojima ,  Kazuyuki Kamegaki

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/28 ,  H01L22/16 ,  H05K7/02

CPC分类号： H01L23/3107 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while permitting signal transmission between these circuits. A second capacitive insulator on the second semiconductor substrate electrically isolates the primary and secondary side circuit while permitting signal transmission therebetween. First and second frames are provided for input and output of signals to and from the primary and secondary side circuits. External electrodes of the first and second capacitive insulators are connected together by a third lead frame via a conductive adhesive body including more than one solder ball. The first and second substrates and the lead frames are sealed by a dielectric resin.

摘要翻译： 初级侧电路和次级侧电路分别设置在第一和第二半导体衬底上。 第一基板上的第一电容绝缘体在允许这些电路之间的信号传输的同时在一次侧电路和次侧电路之间电绝缘和隔离。 第二半导体衬底上的第二电容绝缘体电隔离初级和次级侧电路，同时允许它们之间的信号传输。 第一和第二帧被提供用于输入和输出到主电路和次级侧电路的信号。 第一和第二电容性绝缘体的外部电极通过包括多于一个焊球的导电粘合体由第三引线框架连接在一起。 第一和第二基板和引线框由绝缘树脂密封。