公开(公告)号：US20180047879A1

公开(公告)日：2018-02-15

申请号：US15555483

申请日：2016-03-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David RACZ ,  Matthias SPERL ,  Luca HAIBERGER

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a method for producing a plurality of conversion elements (6) comprising the following steps: providing a substrate (1); applying a first mask layer (4) to the substrate (1), the first mask layer (4) being structured with through-holes (3) which completely penetrate the first mask layer (4); applying a conversion material (5) at least into the through-holes (3); and singulating the conversion elements (6) so as to produce a plurality of individual conversion elements (6). The invention also relates to two other methods, to a conversion element (6), and to an optoelectronic component.

公开(公告)号：US20170047486A1

公开(公告)日：2017-02-16

申请号：US15306441

申请日：2015-04-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried HERRMANN ,  Matthias SPERL

IPC: H01L33/48 ,  H01L33/62 ,  H01L31/02 ,  H01L33/60 ,  H01L31/0232 ,  H01L33/50 ,  H01L33/00 ,  H01L31/18 ,  H01L33/58 ,  H01L27/02 ,  H01L33/32 ,  H01L31/0304 ,  H01L33/30 ,  H01L33/06 ,  H01L31/0352 ,  F21V8/00 ,  H01L31/0203

CPC classification number: H01L33/486 ,  G02B6/0073 ,  H01L27/0248 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/03046 ,  H01L31/03048 ,  H01L31/035236 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: An optoelectronic component (100) comprises an optoelectronic semiconductor chip (10), a first contact area (31) and a second contact area (32), which is laterally offset with respect to the first contact area and is electrically insulated therefrom, and a housing element (40). The first contact area (31) is electrically conductively connected to the first semiconductor layer (21) and the second contact area (32) is electrically conductively connected to the second semiconductor layer (22) of the optoelectronic semiconductor chip. The first contact area (31) and the second contact area (32) project beyond the optoelectronic semiconductor chip laterally in each case. The housing element (40) is fixed to the first contact area (31) and the second contact area (32) in regions in which the first contact area (31) and the second contact area (32) project beyond the optoelectronic semiconductor chip laterally in each case. The housing element surrounds the optoelectronic semiconductor chip at least partly. A surface of the housing element that faces the optoelectronic semiconductor chip is embodied as reflective at least in partial regions. A wall of the housing element has a cutout (61).

Abstract translation: 光电子部件（100）包括光电半导体芯片（10），第一接触区域（31）和第二接触区域（32），所述第一接触区域和第二接触区域相对于第一接触区域横向偏移并与之电绝缘， 壳体元件（40）。 第一接触区域（31）导电地连接到第一半导体层（21），并且第二接触区域（32）导电地连接到光电半导体芯片的第二半导体层（22）。 在每种情况下，第一接触区域（31）和第二接触区域（32）横向突出超过光电半导体芯片。 在第一接触区域（31）和第二接触区域（32）横向突出超过光电半导体芯片的区域中，壳体元件（40）固定到第一接触区域（31）和第二接触区域（32） 在每种情况下 壳体元件至少部分地围绕光电半导体芯片。 面向光电子半导体芯片的外壳元件的表面至少在部分区域中被体现为反射。 壳体元件的壁具有切口（61）。

公开(公告)号：US20220021189A1

公开(公告)日：2022-01-20

申请号：US17414671

申请日：2019-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias SPERL ,  Hubert HALBRITTER ,  Peter BRICK ,  Philipp McCAW ,  Dennis SPRENGER

IPC: H01S5/42 ,  H01S5/02345 ,  H01S5/183 ,  G02B1/00 ,  G02B27/09

Abstract: A laser device comprises a carrier, an optoelectronic component provided on the carrier, said component being designed to emit laser radiation, and an optical element designed to form the laser radiation emitted by the optoelectronic component, wherein: the optical element has a first layer that is at least partially transparent to the laser radiation, with a first refractive index, and a second layer that is at least partially transparent to the laser radiation, with a second refractive index; the first layer being applied to the optoelectronic component and having a surface with an imprinted structure; and the second layer is applied to the first layer, on the surface (24) having the imprinted structure.

公开(公告)号：US20190051802A1

公开(公告)日：2019-02-14

申请号：US16078561

申请日：2017-02-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Korbinian PERZLMAIER ,  Christian LEIRER ,  Matthias SPERL

IPC: H01L33/62 ,  H01L25/13 ,  H01L33/00 ,  H01L33/52 ,  H01L33/50 ,  H01L33/48

Abstract: The invention relates to a semiconductor component comprising at least one semiconductor chip (10) having a semiconductor body (1) with an active region (12), a conversion element (6) and a carrier (3), the carrier (3) comprising a first moulded body (33), a first conductor body (31) and a second conductor body (32), the conductor body (31, 32) being connected to the active region (12) in an electrically conducting manner. A side of the conversion element (6) facing away from the active region (12) forms a front side (101) of the semiconductor chip (10) and a side of the carrier (3) facing away from the active region (12) forms a rear side (102) of the semiconductor chip (10), and lateral surfaces (103) of the semiconductor chip connect the front side (101) and the rear side (102) together. The semiconductor component also comprises a second moulded body (5), the semiconductor chip (10) fully penetrating the second moulded body (5) in such a way that the second moulded body (5) forms a frame around the semiconductor chip (10), and the front side (101) and the rear side (102) of the semiconductor chip (10) are free from the second moulded body (5) at least in places, and the second moulded body (5) at least partially covers free surfaces of the conversion element (6) on the lateral surfaces of the semiconductor chip (10).