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公开(公告)号：US11985452B2
公开(公告)日：2024-05-14
申请号：US17270622
申请日：2019-07-23
Inventor： Takanori Aketa , Yosuke Honda , Takashi Kishida , Toru Hirano
CPC classification number: H04N9/3158 , G02B5/206 , G02B5/285 , H04N9/3152 , H04N9/3161
Abstract: A color conversion element includes: a substrate; a phosphor portion that is disposed above the substrate, receives laser light transmitted from an outside, and emits light in a color different from a color of the laser light; a reflective layer that includes a dielectric multilayer film and is disposed on a principal surface of the phosphor portion facing the substrate; and a joining portion interposed between the reflective layer and the substrate to join the reflective layer and the substrate. The joining portion includes an air layer that exposes the reflective layer in a position where the air layer at least partially overlaps an irradiation region in a plan view, the irradiation region being a region irradiated with the laser light on the phosphor portion.
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Patent Agency Ranking
公开(公告)号：US10535807B2
公开(公告)日：2020-01-14
申请号：US15974316
申请日：2018-05-08
Inventor： Takanori Aketa , Mitsuhiko Ueda , Toru Hirano
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
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公开(公告)号：US10062820B2
公开(公告)日：2018-08-28
申请号：US15573088
申请日：2016-04-26
Inventor： Mituhiko Ueda , Makoto Saito , Takanori Aketa , Toru Hirano
CPC classification number: H01L33/62 , H01L23/147 , H01L23/32 , H01L23/49838 , H01L24/42 , H01L24/45 , H01L33/44 , H01L33/60 , H01L2224/14 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.
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公开(公告)号：US20150108510A1
公开(公告)日：2015-04-23
申请号：US14404092
申请日：2013-05-24
Inventor： Yoji Urano , Akifumi Nakamura , Hayato Ioka , Ryoji Imai , Jun Goda , Toru Hirano , Masanori Suzuki , Hideaki Hyuga
CPC classification number: H01L25/0753 , F21K9/27 , F21S8/02 , F21Y2101/00 , F21Y2115/10 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
Abstract translation: LED模块包括：具有透光性的光漫射基板; LED芯片，其在所述光漫射基板的第一表面上以透明的第一键接合; 面向第一表面的颜色转换器覆盖LED芯片; 和安装基板。 该颜色转换器由含有荧光体的透明材料制成，当从LED芯片发射的光激发时，其发射具有与LED芯片不同颜色的光。 安装基板包括漫射反射层，漫反射从LED芯片发射的光和从荧光体发射的光。 漫反射层面向光扩散基板的第二表面放置。
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公开(公告)号：US09997685B2
公开(公告)日：2018-06-12
申请号：US14916308
申请日：2014-09-03
Inventor： Takanori Aketa , Mitsuhiko Ueda , Toru Hirano
CPC classification number: H01L33/62 , H01L24/14 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/641 , H01L2924/01322 , H01L2933/0066 , H01L2924/00
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
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公开(公告)号：US09437581B2
公开(公告)日：2016-09-06
申请号：US14404092
申请日：2013-05-24
Inventor： Yoji Urano , Akifumi Nakamura , Hayato Ioka , Ryoji Imai , Jun Goda , Toru Hirano , Masanori Suzuki , Hideaki Hyuga
IPC: H01L33/00 , H01L25/075 , H01L33/48 , H01L33/50 , H01L33/60 , H01L33/54 , H01L33/62 , F21K99/00 , F21S8/02 , F21Y101/02
CPC classification number: H01L25/0753 , F21K9/27 , F21S8/02 , F21Y2101/00 , F21Y2115/10 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
Abstract translation: LED模块包括：具有透光性的光漫射基板; LED芯片，其在所述光漫射基板的第一表面上以透明的第一键接合; 面向第一表面的颜色转换器覆盖LED芯片; 和安装基板。 该颜色转换器由含有荧光体的透明材料制成，当从LED芯片发射的光激发时，其发射具有与LED芯片不同颜色的光。 安装基板包括漫射反射层，漫反射从LED芯片发射的光和从荧光体发射的光。 漫反射层面向光扩散基板的第二表面放置。
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