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1.发明授权Continuous web apparatus and method using an air to vacuum seal and accumulator 有权使用空气至真空密封和蓄能器的连续纸幅设备和方法公开(公告)号：US09303316B1
公开(公告)日：2016-04-05
申请号：US13006098
申请日：2011-01-13
CPC分类号： H01L31/1876 , B05C15/00 , C23C14/562 , C23C14/566 , C23C14/568 , F26B5/04 , F26B25/008 , H01L21/67742 , H01L21/67754 , H01L31/0322 , H01L31/0445 , H01L31/1884 , Y10S438/907
摘要： A deposition apparatus includes an input spool located in non-vacuum input module, at least one vacuum process module, an accumulator, and an air to vacuum sealing mechanism. The accumulator and the sealing mechanism are configured to continuously provide a web substrate from the input spool at atmosphere into the at least one process module at vacuum without stopping the web substrate.
摘要翻译： 沉积设备包括位于非真空输入模块中的输入卷轴，至少一个真空处理模块，蓄能器和空气至真空密封机构。 蓄能器和密封机构被构造成在大气压下连续地将输送卷筒从真空输送到至少一个处理模块中而不停止卷材基材。
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公开(公告)号：US09512516B1
公开(公告)日：2016-12-06
申请号：US12888963
申请日：2010-09-23
申请人： Robert Martinson , Paul Shufflebotham , Kevin Lynch , Heinrich von Bunau , Deborah Sloan , Daniel R. Juliano
发明人： Robert Martinson , Paul Shufflebotham , Kevin Lynch , Heinrich von Bunau , Deborah Sloan , Daniel R. Juliano
CPC分类号： H01J37/3417 , C23C14/0057 , C23C14/3407 , C23C14/35 , H01J37/3405 , H01J37/3429 , H01J37/3435 , H01J37/345 , H01J37/3497 , H01J2237/002 , H01J2237/332
摘要： A sputtering target assembly, including a cylindrical backing tube, a magnet assembly disposed within the backing tube, and a conduit disposed within the backing tube and adapted for transporting coolant. The conduit includes at least one first opening positioned for providing the coolant in a substantially circumferential direction from the conduit toward an inner surface of the backing tube into a gap volume between a front side of the magnet assembly and the inner surface of the backing tube.
摘要翻译： 包括圆柱形背衬管，设置在背衬管内的磁体组件和设置在背衬管内并适于运输冷却剂的导管的溅射靶组件。 导管包括至少一个第一开口，其定位成将冷却剂沿着从管道朝向背衬管的内表面的大致圆周方向提供到磁体组件的前侧和背衬管的内表面之间的间隙体积中。
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公开(公告)号：US20180194028A1
公开(公告)日：2018-07-12
申请号：US15400135
申请日：2017-01-06
CPC分类号： B26D1/225 , B26D1/0006 , B26D7/015 , B26D2001/0046 , B26D2001/0053 , B65H35/02
摘要： Disclosed are apparatuses and methods for cutting thin film solar cells. The apparatus may include circular knife cutter rollers, each having a knife edge and coupled with a cutter arbor, support rollers, each coupled to a support arbor and having first and second outer surfaces and a circumferential gap between the first and second outer surfaces partially defined by a first side, a second side facing and offset from the first side, a first rounded edge where the first side intersects with the first outer surface, and a second sharp edge where the second side intersects with the second outer surface. The cutter arbor and support arbor are offset, and the knife cutter rollers and support rollers are axially spaced, such that one knife edge is positioned in the gap of each support roller and the web may be fed between the cutter arbor and the support arbor.
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公开(公告)号：US20180219509A1
公开(公告)日：2018-08-02
申请号：US15422355
申请日：2017-02-01
申请人： Robert Martinson , Cormac Wicklow , Jason Cheng , Arthur Cheung , Heinrich von Bunau , Darin S. Birtwhistle , Hyung Paek , Robert McClymond
发明人： Robert Martinson , Cormac Wicklow , Jason Cheng , Arthur Cheung , Heinrich von Bunau , Darin S. Birtwhistle , Hyung Paek , Robert McClymond
CPC分类号： H02S30/20 , H02S20/23 , H02S30/10 , H02S40/32 , H02S40/34 , H02S40/36 , Y02B10/12 , Y02B10/14
摘要： Disclosed are apparatuses and methods for an apparatus that has a flexible mounting substrate, one or more flexible photovoltaic modules attached to the flexible mounting substrate, one or more inverters attached to the flexible mounting substrate and electrically connected to the one or more flexible photovoltaic modules, a flexible electrical conduit electrically connected to the one or more inverters and to the one or more flexible photovoltaic modules, a plurality of mounting features, and a plurality of flexible connectors that extend between the flexible mounting substrate and one corresponding mounting feature, that is configured to be positioned above a structure and secured to the structure without penetrating roofing of the structure.
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5.发明授权Sputtering target including a feature to reduce chalcogen build up and arcing on a backing tube 有权溅射目标包括减少硫属元素在背衬管上积聚和起弧的特征公开(公告)号：US09255323B2
公开(公告)日：2016-02-09
申请号：US13525593
申请日：2012-06-18
申请人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
发明人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
IPC分类号： C23C14/34 , H01J37/34 , H01L31/18 , H01L31/032 , C23C14/06
CPC分类号： C23C14/3407 , C23C14/0623 , H01J37/3414 , H01J37/3423 , H01L31/0322 , H01L31/18 , Y02E10/541 , Y02P70/521
摘要： A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.
摘要翻译： 溅射靶具有具有两个边缘的圆柱形背衬管和包括位于两个端部之间的中间部分的侧壁。 溅射材料在背衬管上。 溅射材料不覆盖背衬管的至少一个端部。 溅射靶还具有防止或减少未被溅射材料覆盖的背衬管的至少一个端部处的硫属元素累积和电弧中的至少一种的特征。
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6.发明申请Sputtering Target Including a Feature to Reduce Chalcogen Build Up and Arcing on a Backing Tube 有权包含特征的溅射目标，以减少硫属元素在支撑管上的积聚和电弧公开(公告)号：US20130337602A1
公开(公告)日：2013-12-19
申请号：US13525593
申请日：2012-06-18
申请人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
发明人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
CPC分类号： C23C14/3407 , C23C14/0623 , H01J37/3414 , H01J37/3423 , H01L31/0322 , H01L31/18 , Y02E10/541 , Y02P70/521
摘要： A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.
摘要翻译： 溅射靶具有具有两个边缘的圆柱形背衬管和包括位于两个端部之间的中间部分的侧壁。 溅射材料在背衬管上。 溅射材料不覆盖背衬管的至少一个端部。 溅射靶还具有防止或减少未被溅射材料覆盖的背衬管的至少一个端部处的硫属元素累积和电弧中的至少一种的特征。
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公开(公告)号：US20100258173A1
公开(公告)日：2010-10-14
申请号：US12422620
申请日：2009-04-13
IPC分类号： H01L31/00 , B24B1/00 , H01L21/304
CPC分类号： H01L31/0392 , B24B7/13 , B24B37/042 , B24B37/105 , H01L31/0296 , H01L31/0322 , H01L31/03925 , H01L31/03928 , H01L31/206 , Y02E10/541 , Y02P70/521
摘要： A method for fabricating a solar cell. The method includes providing a thin metallic substrate in roll form. The method also includes applying an abrasive grit to a surface of the thin metallic substrate. The method includes mechanical-polishing the surface with the abrasive grit such that the surface is polished to remove at least one defect from the surface. Mechanical-polishing the surface of the thin metallic substrate is by a roll-to-roll polishing process of the surface of the thin metallic substrate. Moreover, the method includes depositing an absorber layer of the solar cell on the thin metallic substrate.
摘要翻译： 一种制造太阳能电池的方法。 该方法包括以卷形式提供薄金属基底。 该方法还包括将磨料砂粒施加到薄金属基底的表面上。 该方法包括用磨料砂砾机械抛光表面，使得表面被抛光以从表面去除至少一个缺陷。 对薄金属基板的表面进行机械抛光是通过薄金属基板的表面的辊对辊抛光工艺。 此外，该方法包括在薄金属基板上沉积太阳能电池的吸收层。
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公开(公告)号：US20080264340A1
公开(公告)日：2008-10-30
申请号：US12169238
申请日：2008-07-08
IPC分类号： C23C16/00
CPC分类号： C23C14/564 , H01J37/32504 , H01J37/34 , H01J2237/026
摘要： A shielding system for a physical vapor deposition chamber having a sputter target above the pedestal. The shielding system comprises a pedestal shield attachable to the pedestal and movable therewith. The pedestal shield surrounds and extends outward from the pedestal toward the chamber side or lower walls. The system also comprises a sidewall shield adapted to extend substantially around and within the chamber sidewalls, and downward from an upper portion thereof. The sidewall shield has a lower end extending inward and disposed adjacent the pedestal shield upper portion when the pedestal is in the raised position. The pedestal shield and sidewall shield cooperate, when the pedestal is in the raised position, to prevent line-of-sight deposition transmission from the sputter target to the side and lower walls of the deposition chamber.
摘要翻译： 一种用于物理气相沉积室的屏蔽系统，其具有在基座上方的溅射靶。 屏蔽系统包括可附接到基座并与其移动的基座屏蔽。 基座护罩围绕并从基座朝向室侧或下壁向外延伸。 该系统还包括侧壁屏蔽件，其适于在腔室侧壁内部和内部延伸，并且从其上部向下延伸。 侧壁屏蔽件具有向内延伸的下端，并且当基座处于升高位置时邻近基座屏蔽件上部设置。 当基座处于升高位置时，基座屏蔽和侧壁屏蔽配合以防止从溅射靶到沉积室的侧壁和下壁的视线沉积传输。
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公开(公告)号：US06760976B1
公开(公告)日：2004-07-13
申请号：US10342550
申请日：2003-01-15
IPC分类号： G01D2100
CPC分类号： H01L21/67265 , Y10S414/136
摘要： A method for a robotic semiconductor wafer processing system to correct for wafers that have become offset or off-center during wafer processing. This is accomplished by determining the amount of offset and re-centering the wafer during wafer transport to the next process station using a single station sensor to locate the wafer center point. Each single sensor located at each station activates when the wafer's edge traverses through the sensor's path. Directional coordinates for the measured designated points on the wafer's edge are calculated, and the intersection points of two circles, analytically derived from using the measured designated points as their centers, are determined. The intersection point closest to the true wafer center position represents the measured wafer's center point. This point is compared to the true wafer center position, and the wafer is then adjusted for this difference.
摘要翻译： 一种用于在晶片处理期间校正已经变得偏移或偏心的晶片的机器人半导体晶片处理系统的方法。 这是通过使用单个站传感器来确定晶片传送到下一个处理站的晶片的偏移量并使其重新对中来实现的，以定位晶片中心点。 当晶片的边缘穿过传感器的路径时，位于每个站处的每个单个传感器激活。 计算晶圆边缘上测量的指定点的定向坐标，并且确定从使用测量的指定点作为其中心分析导出的两个圆的交点。 最接近真晶片中心位置的交点表示测得的晶片的中心点。 将该点与真实的晶片中心位置进行比较，然后调整晶片以实现该差异。
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公开(公告)号：US07497696B2
公开(公告)日：2009-03-03
申请号：US11729581
申请日：2007-03-29
申请人： Robert Martinson , Tieyu Zheng
发明人： Robert Martinson , Tieyu Zheng
IPC分类号： H01R12/00
CPC分类号： H01R13/2442 , H01R43/0249 , H01R43/0256
摘要： A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.
摘要翻译： 一种地面栅格阵列插座和一个包括插座的微电子组件。 插座包括：壳体; 壳体上的一组通孔; 在壳体的PCB侧上的焊球支架元件; 以及在所述壳体的封装侧上的就座平面间隔元件，所述就座平面支座元件与所述焊球支座元件对齐以与其形成加载力支撑元件。
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