公开(公告)号：US06635640B2

公开(公告)日：2003-10-21

申请号：US09894902

申请日：2001-06-29

申请人： Peng Cho Tang ,  Chung Chen Wei ,  Ping Huang ,  Jingrong Cui

发明人： Peng Cho Tang ,  Chung Chen Wei ,  Ping Huang ,  Jingrong Cui

IPC分类号： C07D40314

CPC分类号： C07D401/04 ,  C07D401/14 ,  C07D403/06 ,  C07D403/14 ,  C07D409/14 ,  C07D417/14 ,  C07D491/04

摘要： The present invention relates to certain 4-heteroaryl-3-heteroarylidenyl-2-indolinones compounds and their physiologically acceptable salts which modulate the activity of protein kinases (“PKs”), in particular CDK2. The compounds of the present invention are therefore useful in treating disorders related to abnormal PK activity. Pharmaceutical composition containing these compounds and methods of preparing these compounds are also described.

摘要翻译： 本发明涉及某些4-杂芳基-3-杂芳基-2-二氢吲哚酮化合物及其生理上可接受的盐，其调节蛋白激酶（“PK”）的活性，特别是CDK2。 因此，本发明的化合物可用于治疗与异常PK活性相关的疾病。 还描述了含有这些化合物的药物组合物和制备这些化合物的方法。

公开(公告)号：US07053086B2

公开(公告)日：2006-05-30

申请号：US10648810

申请日：2003-08-27

申请人： Peng Cho Tang ,  Chung Chen Wei ,  Ping Huang ,  Jingrong Cui

发明人： Peng Cho Tang ,  Chung Chen Wei ,  Ping Huang ,  Jingrong Cui

IPC分类号： C07D403/14 ,  A61K31/14

CPC分类号： C07D401/04 ,  C07D401/14 ,  C07D403/06 ,  C07D403/14 ,  C07D409/14 ,  C07D417/14 ,  C07D491/04

摘要： The present invention relates to certain 4-heteroaryl-3-heteroarylidenyl-2-indolinones compounds and their physiologically acceptable salts which modulate the activity of protein kinases (“PKs”), in particular CDK2. The compounds of the present invention are therefore useful in treating disorders related to abnormal PK activity. Pharmaceutical composition containing these compounds and methods of preparing these compounds are also described.

公开(公告)号：US06596772B1

公开(公告)日：2003-07-22

申请号：US09645879

申请日：2000-08-25

申请人： Ping Huang ,  Chung Chen Wei ,  Peng Cho Tang ,  Chris Liang ,  John Ramphal ,  Bahija Jallal ,  John Biltz ,  Sharon Li ,  Matt Mattson ,  Gerald McMahon ,  Marcel Koenig

发明人： Ping Huang ,  Chung Chen Wei ,  Peng Cho Tang ,  Chris Liang ,  John Ramphal ,  Bahija Jallal ,  John Biltz ,  Sharon Li ,  Matt Mattson ,  Gerald McMahon ,  Marcel Koenig

IPC分类号： A61K3105

CPC分类号： C07C311/09 ,  C07C317/14 ,  C07C317/22 ,  C07C317/32 ,  C07C317/40 ,  C07C317/44 ,  C07C317/50 ,  C07C323/65 ,  C07C2601/02 ,  C07C2601/08 ,  C07C2601/14 ,  C07D209/42 ,  C07D231/24 ,  C07D235/16 ,  C07D235/18 ,  C07D295/096

摘要： The invention relates to trifluoromethyl sulfonyl and trifluoromethyl sulfonamido compounds and the physiologically acceptable salts and the prodrugs thereof. These compounds are expected to modulate the activity of protein tyrosine enzymes which are related to cellular signal transduction, in particular, protein tyrosine phosphatase, and therefore are expected to be useful in the prevention and treatment of disorders associated with abnormal protein tyrosine enzyme related cellular signal transduction such as cancer, diabetes, immuno-modulation, neurologic degenerative diseases, osteoporosis and infectious diseases. The invention also relates to the use of compounds containing fluoromethyl sulfonyl groups as phosphate mimics. These mimics may be used to inhibit, regulate or modulate the activity of a phosphate binding protein in a cell.

摘要翻译： 本发明涉及三氟甲磺酰基和三氟甲磺酰氨基化合物及其生理上可接受的盐及其前药。 预期这些化合物可调节与细胞信号转导相关的蛋白质酪氨酸酶的活性，特别是蛋白酪氨酸磷酸酶，因此预期可用于预防和治疗与异常蛋白酪氨酸酶相关的细胞信号相关的病症 转导，如癌症，糖尿病，免疫调节，神经退行性疾病，骨质疏松症和感染性疾病。 本发明还涉及含有氟甲基磺酰基的化合物作为磷酸酯模拟物的用途。 这些模拟物可用于抑制，调节或调节细胞中磷酸结合蛋白的活性。

公开(公告)号：US07122548B2

公开(公告)日：2006-10-17

申请号：US10874743

申请日：2004-06-24

申请人： Fang-Jie Zhang ,  Tomas Vojkovsky ,  Ping Huang ,  Congxin Liang ,  Steven Huy Do ,  Marcel Koenig ,  Jingrong Cui

发明人： Fang-Jie Zhang ,  Tomas Vojkovsky ,  Ping Huang ,  Congxin Liang ,  Steven Huy Do ,  Marcel Koenig ,  Jingrong Cui

IPC分类号： C07D487/04 ,  A61K31/53 ,  A61P35/00

CPC分类号： C07D487/04

摘要： The present invention relates to compounds of the Formula (I), and their pharmaceutically acceptable salts. These compounds modulate the activity of c-Met and are therefore expected to be useful in the prevention and treatment of c-Met related disorders such as cancer

摘要翻译： 本发明涉及式（I）化合物及其药学上可接受的盐。 这些化合物调节c-Met的活性，因此预期可用于预防和治疗c-Met相关疾病如癌症

公开(公告)号：US20050075340A1

公开(公告)日：2005-04-07

申请号：US10874743

申请日：2004-06-24

申请人： Fang-Jie Zhang ,  Tomas Vojkovsky ,  Ping Huang ,  Congxin Liang ,  Steven Do ,  Marcel Koenig ,  Jingrong Cui

发明人： Fang-Jie Zhang ,  Tomas Vojkovsky ,  Ping Huang ,  Congxin Liang ,  Steven Do ,  Marcel Koenig ,  Jingrong Cui

IPC分类号： A61P35/00 ,  C07D487/04 ,  A61K31/53

CPC分类号： C07D487/04

摘要： The present invention relates to compounds of the Formula (I), and their pharmaceutically acceptable salts. These compounds modulate the activity of c-Met and are therefore expected to be useful in the prevention and treatment of c-Met related disorders such as cancer.

摘要翻译： 本发明涉及式（I）化合物及其药学上可接受的盐。 这些化合物调节c-Met的活性，因此预期可用于预防和治疗c-Met相关疾病如癌症。

公开(公告)号：US06465507B2

公开(公告)日：2002-10-15

申请号：US09794957

申请日：2001-02-28

申请人： Peng Cho Tang ,  Todd A. Miller ,  Xiaoyuan Li ,  Ruofei Zhang ,  Jinrong Cui ,  Ping Huang ,  Chung Chun Wei

发明人： Peng Cho Tang ,  Todd A. Miller ,  Xiaoyuan Li ,  Ruofei Zhang ,  Jinrong Cui ,  Ping Huang ,  Chung Chun Wei

IPC分类号： A61K3144

CPC分类号： C07D471/04 ,  C07D491/04

摘要： The invention relates to certain indolinone compounds, their method of synthesis, and a combinatorial library consisting of the indolinone compounds of the invention. The invention also relates to methods of modulating the function of protein kinases using indolinone compounds of the invention and methods of treating diseases by modulating the function of protein kinases and related signal transduction pathways.

摘要翻译： 本发明涉及某些吲哚啉酮化合物，其合成方法和由本发明的吲哚啉酮化合物组成的组合文库。 本发明还涉及使用本发明的吲哚啉酮化合物调节蛋白激酶的功能的方法以及通过调节蛋白激酶和相关信号转导途径的功能来治疗疾病的方法。

公开(公告)号：US07186716B2

公开(公告)日：2007-03-06

申请号：US10638468

申请日：2003-08-12

申请人： Chung Chen Wei ,  Ping Huang ,  Yi Xia

发明人： Chung Chen Wei ,  Ping Huang ,  Yi Xia

IPC分类号： A61K31/535

CPC分类号： C07D401/14 ,  A61K31/416 ,  A61K31/437 ,  A61K31/5377 ,  C07D403/04 ,  C07D471/04

摘要： Compounds of Formula I are useful as mediators of protein kinases and have activity as cell proliferation inhibitors: where X, R1–R7 and R9 are as defined herein.

摘要翻译： 式I的化合物可用作蛋白激酶的介质并且具有作为细胞增殖抑制剂的活性：其中X，R 1〜R 7和R 9 如本文所定义。

公开(公告)号：US09597769B2

公开(公告)日：2017-03-21

申请号：US13488149

申请日：2012-06-04

申请人： Paul Andre Lefevre ,  William C. Allison ,  James P. LaCasse ,  Diane Scott ,  Alexander William Simpson ,  Ping Huang ,  Leslie M. Charns

发明人： Paul Andre Lefevre ,  William C. Allison ,  James P. LaCasse ,  Diane Scott ,  Alexander William Simpson ,  Ping Huang ,  Leslie M. Charns

IPC分类号： B24B37/20 ,  B24B37/22 ,  B24B37/26 ,  B24B37/16 ,  B24D11/00 ,  B24D18/00

CPC分类号： B24B37/205 ,  B24B37/16 ,  B24B37/22 ,  B24B37/26 ,  B24D11/003 ,  B24D18/0009

摘要： Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

公开(公告)号：US20160155688A9

公开(公告)日：2016-06-02

申请号：US14033140

申请日：2013-09-20

申请人： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

发明人： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

IPC分类号： H01L23/495

CPC分类号： H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/16245 ,  H01L2924/13091 ,  H01L2924/00

摘要： A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.

公开(公告)号：US20150021780A1

公开(公告)日：2015-01-22

申请号：US13946949

申请日：2013-07-19

申请人： Yuping Gong ,  Yan Xun Xue ,  Ming-Chen Lu ,  Ping Huang ,  Jun Lu ,  Hamza Yilmaz

发明人： Yuping Gong ,  Yan Xun Xue ,  Ming-Chen Lu ,  Ping Huang ,  Jun Lu ,  Hamza Yilmaz

IPC分类号： H01L23/13 ,  H01L23/00

CPC分类号： H05K3/306 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/24101 ,  H01L2224/24147 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/92224 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/15153 ,  H05K3/32 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/8384 ,  H01L2224/8485 ,  H01L2224/8385

摘要： A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads.

摘要翻译： 薄功率器件包括衬底，衬底在衬底的前表面处具有第一组第一接触焊盘，电连接到衬底的背面处的第二组第二接触焊盘，从前表面开口并穿过 所述基板在所述基板的背面暴露第三接触焊盘，在所述第三接触焊盘的所述半导体芯片的后表面处嵌入所述通孔中的背面金属层的半导体芯片，以及多个导电结构， 将所述半导体芯片的前表面处的电极与所述第一组第一接触焊盘中的对应的第一接触焊盘连接。