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    ELECTRO-OPTICAL ASSEMBLY INCLUDING A GLASS BRIDGE
    1.
    发明申请
    ELECTRO-OPTICAL ASSEMBLY INCLUDING A GLASS BRIDGE 有权
    电光装置包括玻璃桥

    公开(公告)号：US20140177625A1

    公开(公告)日：2014-06-26

    申请号：US13722951

    申请日：2012-12-20

    申请人： Peter L.D. Chang ,  Edris M. Mohammed ,  Henning Braunisch ,  Hengju Cheng

    发明人： Peter L.D. Chang ,  Edris M. Mohammed ,  Henning Braunisch ,  Hengju Cheng

    IPC分类号： H04Q11/00 ,  H05K13/04 ,  H05K13/00

    CPC分类号： G02B6/43 ,  H01L2224/73204 ,  Y10T29/49117 ,  Y10T29/4913

    摘要： Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.

    摘要翻译： 本公开的实施例提供了使用玻璃桥路由电光学组件路由信号的技术和配置。 在一个实施例中，电光学组件包括具有激光器件的激光器管芯和通过一个或多个互连结构与激光管芯电耦合的玻璃桥，所述玻璃桥接器包括被配置为将电信号路由到激光器管芯 从发射机设备。 可以描述和/或要求保护其他实施例。

    Passively aligned optical-electrical interface
    2.
    发明授权
    Passively aligned optical-electrical interface 有权
    被动对准的光电接口

    公开(公告)号：US07068892B1

    公开(公告)日：2006-06-27

    申请号：US11096504

    申请日：2005-03-29

    申请人： Daoqiang Lu ,  Henning Braunisch ,  Edris M. Mohammed ,  Ian Young

    发明人： Daoqiang Lu ,  Henning Braunisch ,  Edris M. Mohammed ,  Ian Young

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4292 ,  G02B6/423 ,  G02B6/4232 ,  G02B6/4249

    摘要： An optical-electrical interface includes an alignment interface and an optoelectronic die. The alignment interface is mounted to a substrate and includes a waveguide port to receive an external waveguide from a first side. The alignment interface includes a conductor disposed on a second side of the alignment interface to couple to a conductor on the substrate. The optoelectronic die is mounted to the second side of the alignment interface. The optoelectronic die includes an electrical port coupled to the conductor disposed on the alignment interface, an optoelectronic device coupled to the electrical port and an optical port aligned to optically couple the optoelectronic device to the external waveguide through the alignment interface.

    摘要翻译： 光电接口包括对准接口和光电管芯。 对准接口安装到基板并且包括用于从第一侧接收外部波导的波导端口。 对准接口包括设置在对准接口的第二侧上的导体，以耦合到衬底上的导体。 光电管芯安装在对准接口的第二侧。 光电管芯包括耦合到布置在对准接口上的导体的电端口，耦合到电端口的光电子器件和对准以通过对准接口将光电子器件光耦合到外部波导的光端口。

    APPARATUS AND METHOD OF MANUFACTURING A VERTICALLY DISAGGREGATED PHOTONIC DEVICE
    3.
    发明申请
    APPARATUS AND METHOD OF MANUFACTURING A VERTICALLY DISAGGREGATED PHOTONIC DEVICE 有权

    公开(公告)号：US20220413237A1

    公开(公告)日：2022-12-29

    申请号：US17359447

    申请日：2021-06-25

    申请人： Henning Braunisch ,  Adel Elsherbini

    发明人： Henning Braunisch ,  Adel Elsherbini

    IPC分类号： G02B6/42

    摘要： Apparatus and methods of manufacture are disclosed. In one example the apparatus includes a first substrate that has a first surface, a first optical waveguide that is at or near the first surface of the first substrate, a second substrate that has a second surface. The second substrate is coupled to the first substrate at an interface. The apparatus also has a photonic integrated circuit (PIC) with a portion at or near the second surface. The PIC is in alignment with and optically coupled to the first optical waveguide across the interface.

    Wafer based optical interconnect
    6.
    发明授权
    Wafer based optical interconnect 有权
    基于晶圆的光互连

    公开(公告)号：US07720337B2

    公开(公告)日：2010-05-18

    申请号：US12004541

    申请日：2007-12-20

    申请人： Daoqiang Lu ,  Henning Braunisch

    发明人： Daoqiang Lu ,  Henning Braunisch

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4231

    摘要： In general, in one aspect, a method includes forming conductive layers on a wafer. A through cavity is formed in alignment with the conductive layers. The through cavity is to permit an optical signal from an optical waveguide within an optical connector to pass therethrough. Alignment holes are formed on each side of the through cavity to receive alignment pins. The wafer having the conductive layers, the through cavity in alignment with the conductive layers, and the alignment holes on each side of the through cavity forms an optical-electrical (O/E) interface. An O/E converter is mounted to the metal layers in alignment with the through cavity. The alignment pins and the alignment holes are used to passively align the optical waveguide and the O/E converter.

    摘要翻译： 通常，一方面，一种方法包括在晶片上形成导电层。 形成与导电层对准的通孔。 通孔是允许光连接器内的光波导的光信号通过。 对准孔形成在通孔的每一侧以接收对准销。 具有导电层的晶片，与导电层对准的通孔和通孔的每一侧上的对准孔形成光电（O / E）界面。 O / E转换器安装到与通孔对准的金属层上。 对准引脚和对准孔用于被动对准光波导和O / E转换器。

    Hybrid flex-and-board memory interconnect system
    7.
    发明申请
    Hybrid flex-and-board memory interconnect system 审中-公开
    混合式柔性和板上存储器互连系统

    公开(公告)号：US20080228964A1

    公开(公告)日：2008-09-18

    申请号：US11717568

    申请日：2007-03-13

    申请人： Henning Braunisch

    发明人： Henning Braunisch

    IPC分类号： G06F3/00

    CPC分类号： G06F1/18 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10734

    摘要： A hybrid memory interconnect system involving flexible cable and board interconnects is provided for improved memory bandwidth and power efficiency performance. To this purpose, signals between a microprocessor chip and one or more memory chips are routed via separate conductive paths, e.g. flexible cable for high-speed signals and conventional board interconnects for low-speed signals. The memory chips may be connected to a flexible cable and a supporting printed circuit board in various ways.

    摘要翻译： 提供了涉及柔性电缆和电路板互连的混合存储器互连系统，用于改善存储器带宽和功率效率性能。 为此，微处理器芯片和一个或多个存储器芯片之间的信号经由分离的导电路径路由，例如， 用于高速信号的柔性电缆和用于低速​​信号的常规电路板互连。 存储器芯片可以以各种方式连接到柔性电缆和支撑印刷电路板。