公开(公告)号：US10293551B2

公开(公告)日：2019-05-21

申请号：US15275187

申请日：2016-09-23

Applicant: PICOSYS INCORPORATED

Inventor： Raymond Miller Karam ,  Georges Roussos ,  Mark Finkle ,  Daniella M. Harvey ,  Pascal R. Ackermann-Karam

IPC: B29C65/16 ,  B29C65/78 ,  B23K37/04 ,  B23K26/324 ,  B23K26/08 ,  B32B37/06 ,  B23K26/03 ,  B23K26/046 ,  B29C65/00 ,  B01L3/00 ,  C03B23/203 ,  C03C27/00 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/32 ,  B23K26/211 ,  B23K26/244 ,  B23K101/18 ,  B23K101/40 ,  B23K103/18 ,  B23K103/00

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

公开(公告)号：US09795963B2

公开(公告)日：2017-10-24

申请号：US14498003

申请日：2014-09-26

Applicant: Picosys Incorporated

Inventor： Raymond M. Karam ,  Georges Roussos ,  Anthony T. Chobot

IPC: B01L3/00 ,  C23F1/00 ,  B32B37/12 ,  B32B7/06 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/40 ,  B32B3/04 ,  B32B3/26 ,  B32B37/00 ,  H01L21/02

CPC classification number: B01L3/502707 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0887 ,  B01L2400/0415 ,  B32B3/04 ,  B32B3/263 ,  B32B3/266 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B9/045 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/304 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/00 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/58 ,  B32B2307/748 ,  C23F1/00

Abstract: A flow cell incorporates a first substrate with a metal layer on one surface. A tape layer having flow channels is adhered to the first substrate. A second substrate having a second metal layer on one surface is adhered to the tape layer opposite the first substrate. At least one of the first and second metal layers includes mating cutouts to at least partially expose the flow channels.

公开(公告)号：US20190039347A1

公开(公告)日：2019-02-07

申请号：US16156760

申请日：2018-10-10

Applicant: Medtronic, Inc. ,  PicoSys Incorporated d/b/a Invenios

Inventor： Michael S. Sandlin ,  David A. Ruben ,  Raymond M. Karam ,  Georges Roussos ,  Thomas M. Wynne

IPC: B32B7/04 ,  B23K20/02 ,  B23K20/22 ,  B32B15/04 ,  B32B17/06 ,  B32B37/14 ,  B23K103/18 ,  B23K103/00 ,  B23K103/14 ,  B23K103/16

Abstract: Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

公开(公告)号：US11571860B2

公开(公告)日：2023-02-07

申请号：US16378440

申请日：2019-04-08

Applicant: Picosys Incorporated

Inventor： Raymond Miller Karam ,  Georges Roussos ,  Mark Finkle ,  Danielle M. Harvey ,  Pascal R. Ackermann-Karam

IPC: B29C65/16 ,  B23K26/324 ,  B23K37/04 ,  B29C65/00 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/32 ,  B23K26/211 ,  B23K26/244 ,  B23K26/03 ,  B23K26/046 ,  B23K26/08 ,  B29C65/78 ,  B01L3/00 ,  C03B23/203 ,  C03C27/00 ,  B32B37/06 ,  B23K101/18 ,  B23K101/40 ,  B23K103/18 ,  B23K103/00

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

公开(公告)号：US20160089671A1

公开(公告)日：2016-03-31

申请号：US14498003

申请日：2014-09-26

Applicant: Picosys Incorporated, a corporation of the State of California DBA Invenios

Inventor： Raymond M. Karam ,  Georges Roussos ,  Anthony T. Chobot

IPC: B01L3/00 ,  C23F1/00

CPC classification number: B01L3/502707 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0887 ,  B01L2400/0415 ,  B32B3/04 ,  B32B3/263 ,  B32B3/266 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B9/045 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/304 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/00 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/58 ,  B32B2307/748 ,  C23F1/00

Abstract: A flow cell incorporates a first substrate with a metal layer on one surface. A tape layer having flow channels is adhered to the first substrate. A second substrate having a second metal layer on one surface is adhered to the tape layer opposite the first substrate. At least one of the first and second metal layers includes mating cutouts to at least partially expose the flow channels.

Abstract translation: 流动池在一个表面上结合有金属层的第一基底。 具有流动通道的带层粘附到第一基底。 在一个表面上具有第二金属层的第二基板被粘附到与第一基板相对的带层。 第一和第二金属层中的至少一个包括配合切口以至少部分地暴露流动通道。

公开(公告)号：US20190232569A1

公开(公告)日：2019-08-01

申请号：US16378440

申请日：2019-04-08

Applicant: Picosys Incorporated

Inventor： Raymond Miller Karam ,  Georges Roussos ,  Mark Finkle ,  Daniella M. Harvey ,  Pascal R. Ackermann-Karam

IPC: B29C65/16 ,  B23K26/244 ,  B29C65/00 ,  B23K37/04 ,  C03B23/203 ,  B29C65/78 ,  B23K26/211 ,  B23K26/32 ,  B23K26/0622 ,  B23K26/082 ,  C03C27/00 ,  B23K26/324 ,  B01L3/00 ,  B23K26/08 ,  B23K26/046 ,  B23K26/03 ,  B32B37/06

CPC classification number: B29C65/1612 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0887 ,  B23K26/032 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/211 ,  B23K26/244 ,  B23K26/32 ,  B23K26/324 ,  B23K37/0435 ,  B23K2101/18 ,  B23K2101/40 ,  B23K2103/18 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/1683 ,  B29C65/7841 ,  B29C65/7847 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/73161 ,  B29C66/7392 ,  B29C66/7465 ,  B32B37/06 ,  B32B2307/412 ,  B32B2310/0843 ,  B32B2315/08 ,  C03B23/203 ,  C03C27/00

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

公开(公告)号：US20170008223A1

公开(公告)日：2017-01-12

申请号：US15275187

申请日：2016-09-23

Applicant: PICOSYS INCORPORATED

Inventor： Raymond Miller Karam ,  Georges Roussos ,  Mark Finkle ,  Daniella M. Harvey ,  Pascal R. Ackermann-Karam

IPC: B29C65/16 ,  B29C65/00 ,  C03B23/203 ,  B01L3/00 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/211 ,  B23K26/324 ,  B29C65/78 ,  B23K26/046

CPC classification number: B29C65/1612 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0887 ,  B23K26/032 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/211 ,  B23K26/244 ,  B23K26/32 ,  B23K26/324 ,  B23K37/0435 ,  B23K2101/18 ,  B23K2101/40 ,  B23K2103/18 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/1683 ,  B29C65/7841 ,  B29C65/7847 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/73161 ,  B29C66/7392 ,  B29C66/7465 ,  B32B37/06 ,  B32B2307/412 ,  B32B2310/0843 ,  B32B2315/08 ,  C03B23/203 ,  C03C27/00

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract translation: 选择室温基板接合方法，对激光波长基本上透明的第一基板。 然后选择在与第一衬底的界面处配合的第二衬底。 在界面处产生透射率变化，并且在界面处配合第一和第二基板。 然后用基本上聚焦在界面处的透明度波长的激光照射第一衬底，并且产生在由激光器提供的能量的界面处的局部高温。 紧邻界面的第一和第二衬底通过界面以扩散软化，以熔合基片。