公开(公告)号：US20120097330A1

公开(公告)日：2012-04-26

申请号：US12908617

申请日：2010-10-20

申请人： Prahallad Iyengar ,  Sanjeev Baluja ,  Dale R. DuBois ,  Juan Carlos Rocha-Alverez ,  Thomas Nowak ,  Scott A. Hendrickson ,  Yong-Won Lee ,  Mei-Yee Shek ,  Li-Qun Xia ,  Derek R. Witty

发明人： Prahallad Iyengar ,  Sanjeev Baluja ,  Dale R. DuBois ,  Juan Carlos Rocha-Alverez ,  Thomas Nowak ,  Scott A. Hendrickson ,  Yong-Won Lee ,  Mei-Yee Shek ,  Li-Qun Xia ,  Derek R. Witty

IPC分类号： H01L21/465 ,  H01L21/46

CPC分类号： H01L21/02164 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/45574 ,  C23C16/463 ,  C23C16/5096 ,  H01L21/02274

摘要： A substrate processing system includes a thermal processor or a plasma generator adjacent to a processing chamber. A first processing gas enters the thermal processor or plasma generator. The first processing gas then flows directly through a showerhead into the processing chamber. A second processing gas flows through a second flow path through the showerhead. The first and second processing gases are mixed below the showerhead and a layer of material is deposited on a substrate under the showerhead.

摘要翻译： 衬底处理系统包括与处理室相邻的热处理器或等离子体发生器。 第一处理气体进入热处理器或等离子体发生器。 然后，第一处理气体直接通过喷头流入处理室。 第二处理气体流过穿过喷头的第二流路。 第一和第二处理气体混合在喷淋头下面，并且一层材料沉积在喷头下方的基底上。

公开(公告)号：US08343881B2

公开(公告)日：2013-01-01

申请号：US12794713

申请日：2010-06-04

申请人： Yong-Won Lee ,  Vladimir Zubkov ,  Mei-Yee Shek ,  Li-Qun Xia ,  Prahallad Iyengar ,  Sanjeev Baluja ,  Scott A Hendrickson ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Derek R Witty

发明人： Yong-Won Lee ,  Vladimir Zubkov ,  Mei-Yee Shek ,  Li-Qun Xia ,  Prahallad Iyengar ,  Sanjeev Baluja ,  Scott A Hendrickson ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Derek R Witty

IPC分类号： H01L29/06 ,  H01L21/31 ,  C23C16/448

CPC分类号： H01L21/02271 ,  C23C16/402 ,  H01L21/02164 ,  H01L21/0332 ,  H01L21/76898

摘要： A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.

摘要翻译： 使用包含BDEAS和含氧气体如臭氧的工艺气体将二氧化硅层沉积到衬底上。 二氧化硅层可以是包括抗蚀剂层的抗蚀刻堆叠的一部分。 在另一个版本中，二氧化硅层被沉积到通孔中以形成用于通硅通孔的氧化物衬垫。

公开(公告)号：US08679987B2

公开(公告)日：2014-03-25

申请号：US13468776

申请日：2012-05-10

申请人： Patrick Reilly ,  Shahid Shaikh ,  Tersem Summan ,  Deenesh Padhi ,  Sanjeev Baluja ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Bok Hoen Kim ,  Derek R. Witty

发明人： Patrick Reilly ,  Shahid Shaikh ,  Tersem Summan ,  Deenesh Padhi ,  Sanjeev Baluja ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Bok Hoen Kim ,  Derek R. Witty

IPC分类号： H01L21/47 ,  H01L21/312

CPC分类号： H01L21/02527 ,  C23C16/26 ,  C23C16/56 ,  H01L21/02115 ,  H01L21/02274 ,  H01L21/02348 ,  H01L21/02592 ,  H01L21/0262 ,  H01L21/31144

摘要： Embodiments described herein relate to a method for processing a substrate. In one embodiment, the method includes introducing a gas mixture comprising a hydrocarbon source and a diluent gas into a deposition chamber located within a processing system, generating a plasma from the gas mixture in the deposition chamber at a temperature between about 200° C. and about 700° C. to form a low-hydrogen content amorphous carbon layer on the substrate, transferring the substrate into a curing chamber located within the processing system without breaking vacuum, and exposing the substrate to UV radiation within the curing chamber at a curing temperature above about 200° C.

摘要翻译： 本文所述的实施例涉及一种用于处理衬底的方法。 在一个实施方案中，该方法包括将包含烃源和稀释气体的气体混合物引入位于处理系统内的沉积室中，在沉积室中从约200℃至约200℃的温度和 约700℃以在基底上形成低氢含量的无定形碳层，将基底转移到位于处理系统内的固化室中，而不破坏真空，并在固化温度下将基底暴露于固化室内的UV辐射 高于约200℃

公开(公告)号：US20120258259A1

公开(公告)日：2012-10-11

申请号：US13440720

申请日：2012-04-05

申请人： Amit Bansal ,  Dale R. Du Bois ,  Juan Carlos Rocha-Alvarez ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Thomas Nowak

发明人： Amit Bansal ,  Dale R. Du Bois ,  Juan Carlos Rocha-Alvarez ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Thomas Nowak

IPC分类号： C23C16/455 ,  C23C16/46 ,  C23C16/458

CPC分类号： C23C16/56 ,  C23C16/0272 ,  C23C16/4401 ,  C23C16/4404 ,  C23C16/45565 ,  C23C16/54

摘要： Embodiments of the present invention provide apparatus and methods for performing UV treatment and chemical treatment and/or deposition in the same chamber. One embodiment of the present invention provides a processing chamber including a UV transparent gas distribution showerhead disposed above a substrate support located in an inner volume of the processing chamber, a UV transparent window disposed above the UV transparent gas distribution showerhead, and a UV unit disposed outside the inner volume. The UV unit is configured to direct UV lights towards the substrate support through the UV transparent window and the UV transparent gas distribution showerhead.

摘要翻译： 本发明的实施例提供了用于在相同的室中进行UV处理和化学处理和/或沉积的装置和方法。 本发明的一个实施例提供了一种处理室，其包括设置在位于处理室的内部体积中的基板支撑件上方的UV透明气体分配喷头，设置在UV透明气体分配喷头上方的UV透明窗口和设置在UV透明气体分配喷头上的UV单元 在内容之外。 UV单元被配置为通过UV透明窗口和UV透明气体分配喷头将UV光引向基板支撑。

公开(公告)号：US07692171B2

公开(公告)日：2010-04-06

申请号：US11686900

申请日：2007-03-15

申请人： Andrzei Kaszuba ,  Juan Carlos Rocha-Alvarez ,  Sanjeev Baluja ,  Tom K. Cho ,  Hichem M'Saad ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Thomas Nowak

发明人： Andrzei Kaszuba ,  Juan Carlos Rocha-Alvarez ,  Sanjeev Baluja ,  Tom K. Cho ,  Hichem M'Saad ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Thomas Nowak

IPC分类号： H01J49/00 ,  H01J49/44

CPC分类号： G21K1/062 ,  B82Y10/00 ,  G21K2201/061 ,  G21K2201/064 ,  G21K2201/067 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US07663121B2

公开(公告)日：2010-02-16

申请号：US11424368

申请日：2006-06-15

申请人： Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Andrzej Kaszuba ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Sanjeev Baluja ,  Tom Cho ,  Josephine Chang ,  Hichem M'Saad

发明人： Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Andrzej Kaszuba ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Sanjeev Baluja ,  Tom Cho ,  Josephine Chang ,  Hichem M'Saad

IPC分类号： G01N23/00

CPC分类号： B05D3/067 ,  B05D3/0209 ,  B05D3/0493 ,  H01L21/31058

摘要： An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV bulbs per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV bulbs can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.

摘要翻译： 紫外线（UV）固化室可固化设置在基底上的电介质材料并进行原位清洁。 串联处理室提供由覆盖有盖的主体限定的两个单独的和相邻的过程区域，所述盖子具有分别位于每个处理区域上方的窗口。 每个处理区域的一个或多个UV灯泡被耦合到盖的壳体覆盖，将通过窗口的UV光发射到位于处理区域内的衬底上。 UV灯泡可以是利用诸如微波或射频的源的发光二极管或灯泡阵列。 紫外光可以在固化过程中被脉冲。 使用远程生成的氧自由基/臭氧和/或原位实现清洁室。 灯阵列的使用，基板和灯头的相对运动以及灯反射器形状和/或位置的实时修改可以增强基板照明的均匀性。

公开(公告)号：US20130122611A1

公开(公告)日：2013-05-16

申请号：US13669113

申请日：2012-11-05

申请人： YAO-HUNG YANG ,  Abhijit Kangude ,  Sanjeev Baluja ,  Michael Martinelli ,  Liliya Krivulina ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Scott A. Hendrickson

发明人： YAO-HUNG YANG ,  Abhijit Kangude ,  Sanjeev Baluja ,  Michael Martinelli ,  Liliya Krivulina ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Scott A. Hendrickson

IPC分类号： H05B37/02 ,  H01L21/26 ,  H01L21/66

CPC分类号： H05B41/3921 ,  H01L21/67115 ,  H05B41/3922

摘要： The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a chamber, determining the relative irradiance on a substrate corresponding to a first lamp and a second lamp, and determining correction or compensation factors based on the relative irradiances and the baseline irradiance. The lamps are then adjusted via closed loop control using the correction or compensation factors to individually adjust the lamps to the desired output. The lamps may optionally be adjusted to equal irradiances prior to adjusting the lamps to the desired output. The closed loop control ensures process uniformity from substrate to substrate. The irradiance measurement and the correction or compensation factors allow for adjustment of lamp set points due to chamber component degradation, chamber component replacement, or chamber cleaning.

摘要翻译： 本发明一般涉及控制UV灯输出以增加辐照度均匀性的方法。 方法通常包括确定室内的基线辐照度，确定对应于第一灯和第二灯的衬底上的相对辐照度，以及基于相对辐照度和基线辐照度确定校正或补偿因子。 然后通过使用校正或补偿因子的闭环控制来调节灯，以将灯单独调节到期望的输出。 在将灯调节到期望的输出之前，灯可以可选地被调整为相等的辐照度。 闭环控制确保从基板到基板的工艺均匀性。 辐照度测量和校正或补偿因素允许由于室部件劣化，腔室部件更换或腔室清洁而调节灯具设定点。

公开(公告)号：US08203126B2

公开(公告)日：2012-06-19

申请号：US12841935

申请日：2010-07-22

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： G01N21/00 ,  G01N21/33 ,  B01J19/08 ,  B29C35/08

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US20100285240A1

公开(公告)日：2010-11-11

申请号：US12841935

申请日：2010-07-22

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： B05D3/06

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US07777198B2

公开(公告)日：2010-08-17

申请号：US11686881

申请日：2007-03-15

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： H01J37/20

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。