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公开(公告)号：US08963310B2
公开(公告)日：2015-02-24
申请号：US13216918
申请日：2011-08-24
申请人： Kishor Desai , Qwai H. Low , Chok J. Chia , Charles G. Woychik , Huailiang Wei
发明人： Kishor Desai , Qwai H. Low , Chok J. Chia , Charles G. Woychik , Huailiang Wei
IPC分类号： H01L23/495 , H01L23/02 , H01L23/48 , H01L23/498 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： H01L23/49575 , H01L21/568 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/4951 , H01L23/4952 , H01L23/49531 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49811 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/48247 , H01L2224/48464 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06558 , H01L2225/06562 , H01L2225/06568 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.
摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。
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公开(公告)号：US20130049179A1
公开(公告)日：2013-02-28
申请号：US13216918
申请日：2011-08-24
申请人： Kishor Desai , Qwai H. Low , Chok J. Chia , Charles G. Woychik , Huailiang Wei
发明人： Kishor Desai , Qwai H. Low , Chok J. Chia , Charles G. Woychik , Huailiang Wei
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49575 , H01L21/568 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/4951 , H01L23/4952 , H01L23/49531 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49811 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/48247 , H01L2224/48464 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06558 , H01L2225/06562 , H01L2225/06568 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.
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公开(公告)号：US08525312B2
公开(公告)日：2013-09-03
申请号：US13208822
申请日：2011-08-12
申请人： Qwai H. Low , Chok J. Chia , Kishor Desai , Charles G. Woychik , Huailiang Wei
发明人： Qwai H. Low , Chok J. Chia , Kishor Desai , Charles G. Woychik , Huailiang Wei
IPC分类号： H01L23/495 , H01L21/50 , H01L21/60
CPC分类号： H01L23/49537 , H01L21/4821 , H01L23/3121 , H01L23/49575 , H01L23/49861 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/04042 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , H01L2924/12042 , H01L2924/1434 , H01L2924/1436 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85 , H01L2224/81 , H01L2224/83
摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.
摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。
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公开(公告)号：US20130037925A1
公开(公告)日：2013-02-14
申请号：US13208822
申请日：2011-08-12
申请人： Qwai H. Low , Chok J. Chia , Kishor Desai , Charles G. Woychik , Huailiang Wei
发明人： Qwai H. Low , Chok J. Chia , Kishor Desai , Charles G. Woychik , Huailiang Wei
IPC分类号： H01L23/495 , H01L21/50 , H01L21/60
CPC分类号： H01L23/49537 , H01L21/4821 , H01L23/3121 , H01L23/49575 , H01L23/49861 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/04042 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , H01L2924/12042 , H01L2924/1434 , H01L2924/1436 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85 , H01L2224/81 , H01L2224/83
摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.
摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。
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公开(公告)号：US08772946B2
公开(公告)日：2014-07-08
申请号：US13492064
申请日：2012-06-08
申请人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
发明人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
CPC分类号： H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。
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公开(公告)号：US20130328186A1
公开(公告)日：2013-12-12
申请号：US13492064
申请日：2012-06-08
申请人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
发明人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
IPC分类号： H01L23/48 , H01L21/28 , H01L23/498
CPC分类号： H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。
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公开(公告)号：US20130001757A1
公开(公告)日：2013-01-03
申请号：US13173883
申请日：2011-06-30
申请人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
发明人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
IPC分类号： H01L23/495 , H01R43/16 , H01L21/50 , H01L23/34 , H01L21/60
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49541 , H01L23/49548 , H01L24/13 , H01L24/16 , H01L24/32 , H01L25/105 , H01L2224/11332 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13147 , H01L2224/1329 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13347 , H01L2224/1339 , H01L2224/13401 , H01L2224/16245 , H01L2224/291 , H01L2224/32245 , H01L2224/73253 , H01L2224/81192 , H01L2224/8184 , H01L2225/1029 , H01L2225/1058 , H01L2225/1094 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , Y10T29/49204 , H01L2924/00014 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.
摘要翻译： 微电子单元可以包括引线框架和器件芯片。 引线框架可以具有在引线框架的平面中延伸的多个单片引线指。 每个引线指可以具有在引线框架平面中延伸的扇出部分和芯片连接部分。 扇出部分可以在相对的表面之间具有第一和第二相对表面以及在第一方向上的第一厚度。 芯片连接部分可以具有小于第一厚度的第二厚度。 芯片连接部分可以限定第一表面下方的凹陷。 器件芯片可以具有多个无源器件或有源器件中的至少一个。 器件芯片可以具有面向芯片连接部分并且与其电耦合的触点。 装置芯片的厚度的至少一部分可以在凹部内延伸。
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公开(公告)号：US20120314384A1
公开(公告)日：2012-12-13
申请号：US13156609
申请日：2011-06-09
CPC分类号： H05K3/0094 , B23K1/0016 , B23K35/24 , B23K35/36 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49883 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13023 , H01L2224/131 , H01L2924/00014 , H01L2924/07811 , H01L2924/09701 , Y10T29/49165 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。
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公开(公告)号：US08723049B2
公开(公告)日：2014-05-13
申请号：US13156609
申请日：2011-06-09
IPC分类号： H05K1/11
CPC分类号： H05K3/0094 , B23K1/0016 , B23K35/24 , B23K35/36 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49883 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13023 , H01L2224/131 , H01L2924/00014 , H01L2924/07811 , H01L2924/09701 , Y10T29/49165 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。
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公开(公告)号：US08525309B2
公开(公告)日：2013-09-03
申请号：US13173883
申请日：2011-06-30
申请人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
发明人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
IPC分类号： H01L23/495 , H01L21/50 , H01L23/34 , H01L21/60 , H01R43/16
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49541 , H01L23/49548 , H01L24/13 , H01L24/16 , H01L24/32 , H01L25/105 , H01L2224/11332 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13147 , H01L2224/1329 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13347 , H01L2224/1339 , H01L2224/13401 , H01L2224/16245 , H01L2224/291 , H01L2224/32245 , H01L2224/73253 , H01L2224/81192 , H01L2224/8184 , H01L2225/1029 , H01L2225/1058 , H01L2225/1094 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , Y10T29/49204 , H01L2924/00014 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.
摘要翻译： 微电子单元可以包括引线框架和器件芯片。 引线框架可以具有在引线框架的平面中延伸的多个单片引线指。 每个引线指可以具有在引线框架平面中延伸的扇出部分和芯片连接部分。 扇出部分可以在相对的表面之间具有第一和第二相对表面以及在第一方向上的第一厚度。 芯片连接部分可以具有小于第一厚度的第二厚度。 芯片连接部分可以限定第一表面下方的凹陷。 器件芯片可以具有多个无源器件或有源器件中的至少一个。 器件芯片可以具有面向芯片连接部分并且与其电耦合的触点。 装置芯片的厚度的至少一部分可以在凹部内延伸。
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